• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.8
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• pp.676-682
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• 2002

This paper has been made to investigate the thermal performance characteristics for the several types of heat sinks such as extruded heat sink, aluminum foam heat sink, layered heat sink. The various types heat sinks are prepared and tested for natural convection as well as forced convection. The experimental results for natural convection are compared to those for three types of heat sink so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for layered heat sink, extruded heat sink and aluminum foam heat sink are almost comparable to those under natural convection and forced convection. The forced convection of layered heat sink become 1.2 times as high as those of extruded heat sink, and the forced convection of extruded heat sink become 1.2 times as high as those of aluminum foam heat sink. This study shows that bar height, bar distance and number of bar for layered heat sink are important parameters, which have a serious influence on thermal performance for layered heat sinks.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2438-2443
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• 2007

In order to guarantee the performance of electronic products. It is needed to improve the cooling performance of heat sink. So this paper has been made to investigate the cooling performance for the aluminum heat sink using pulsating heat pipe(PHP). The pulsating heat pipe was used as a heat spreader. Working fluid was R-22. Heater (50 mm ${\times}$ 50 mm ${\times}$ 3mm) was attached to heat sink and it generated 30W, 60W, 80W, 100W. Heat sink was tested for forced convection with 1${\sim}$4m/s of inlet air velocity. And both type heat sinks were carried out by using CFD simulation. This study showed that pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Journal of the Korean Society of Mechanical Technology
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• v.13 no.3
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• pp.1-6
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• 2011

In order to find better performance of heat sink, in this research, different cases were analysed by changing number of slots and shape of fins. Round shape fins which have wide surface showed 24% better heat transfer rate than vertical fins. There were not big discrepancies between 1 slot and 2 slots fins. Consequently, for better performance of heat sink, developments for widening surface and better material for high heat transfer rate are needed.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.1016-1021
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• 2011

The enhancement for cooling performance of heat sink is surely necessary to guarantee the performance of electronic products. So in this paper, the cooling performances of the aluminum heat sink with pulsating heat pipe(PHP) were investigated experimentally and numerically. The pulsating heat pipe was used as a heat spreader. Working fluid of PHP was R-22. Heat inputs were 30W, 60W, 80W and 100W, respectively. Heat sink was tested for forced convection conditions with air velocity of 1 ~ 4m/s. And CFD simulations were conducted for two different heat sinks. The results showed that the cooling performance of heat sink with pulsating heat pipe was higher than that of conventional heat sink. Therefore, the pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.4
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• pp.271-287
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• 2001

This paper has been made to investigate the thermal performance characteristics for the several types of layered aluminum heat sinks with offset-strip fin. Heat sinks with different fin height, fin length, number of fin layer and slanted fin are prepared and tested for natural convection as well as forced convection. The experimental results for layered heat sink(LHS) are compared to those for advanced pin fin heat sink (PHS) so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for LHS are almost comparable to those of PHS under natural convection, and become 1.2∼1.5 times as high as those of PHS under forced convection situation. This study shows that fin height and number of fin layer re important parameters, which have a serious influence on thermal performance for layered heat sinks.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.1167-1171
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• 2008

The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

• International Journal of Aerospace System Engineering
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• v.1 no.1
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.849-854
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• 2005

In this paper, the cooling performance of a microchannel heat sink with nano-particle-fluid suspensions ('nanofluids') is numerically investigated. By using theoretical models of thermal conductivity and viscosity of nanofluids that account for the fundamental role of Brownian motion respectively, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6nm copper-in-water and 2nm diamond-in-water. The results show that a microchannel heat sink with nanofluids has high cooling performance compared with the cooling performance of that with water, the classical coolant. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1472-1475
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• 2004

Current processor power consumption has dramatically increased and already reached 115 Watts. Therefore, Heat sink design needs more high accuracy in 1U server. The target performance of heat sink is very dependent of fin geometry and it is also seriously affected by design conditions such as fan type, air duct shape and heatsink design parameters. The present paper investigates the behavior of heat sink performance under various conditions. The present work addresses pressurized type plane fin heat sinks having dimension of 40 mm by 40 mm by 56 mm fan.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.30 no.1
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• pp.1-9
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• 2018

Thermal performance of a heat sink for an inverter power stack was analyzed in terms of array and installation location of an Insulated Gate Bipolar Transistor (IGBT). Thermal flow around the heat sink was calculated with a numerical model that could simulate forced convection. Thermal performance was calculated depending on the array and location of high- and low-power IGBTs considering the maximum temperature of IGBT. The optimum array and installation location were found and causes were analyzed based on results of numerical analysis. For the numerical analysis, experiment design considered the installation location of IGBT, ratio of heat generation rates of high- and low-power IGBTs, and velocity of the inlet air as design variables. Based on numerical results, a correlation that could calculate thermal performance of the heat sink was suggested and the maximum temperature of the IGBT could be predicted depending on the installation method.