• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Advances in nano research
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• v.9 no.1
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• pp.1-13
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• 2020

In this work, the electrical potential (EP) technique with an artificial neural networks (ANNs) for monitoring of nanostructures are used for the first time. This study employs an expert system to identify size and localize hidden nano-delamination (N.Del) inside layers of nano-pipe (N.P) manufactured from Basalt Fiber Reinforced Polymer (BFRP) laminate composite by using low-cost monitoring method of electrical potential (EP) technique with an artificial neural networks (ANNs), which are combined to decrease detection effort to discern N.Del location/size inside the N.P layers, with high accuracy, simple and low-cost. The dielectric properties of the N.P material are measured before and after N.Del introduced using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to N.Del, a finite element (FE) simulation model for N.Del location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic, therefore, FE analyses are employed to make sets of data for the learning of the ANNs. The method is applied for the N.Del monitoring, to minimize the number of FE analysis in order to keep the cost and save the time of the assessment to a minimum. The FE results are in excellent agreement with an ANN and the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.172-172
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• 2009

$BaTiO_3$는 perovskite 구조를 가지는 대표적인 강유전체 재료로서 MLCC(Multi Layer Ceramic Capacitor), PTC thermistor등에 널리 사용되어지고 있다. 최근 고용량 MLCC 의 상업화와 함께 나노크기를 갖는 tetragonal phase의 $BaTiO_3$ 입자를 합성하기 위한 다양한 제조방법이 제시되고 있다. 또한 유전 특성과 온도특성 및 신뢰성을 향상시키기 위해 많은 첨가제들이 연구되어지고 있다. 따라서 이 번 연구에서는 선행 연구를 통해 얻어진 high energy mill을 이용한 고상반응법으로 제조된 $BaTiO_3$를 사용하였으며, 제조된 $BaTiO_3$ 분말에 glass frit를 첨가하여 소결온도 및 유전특성의 변화를 관찰하였다. 제조된 $BaTiO_3$ 분말은 200nm이하의 구형화와 균일한 입자크기를 보였으며, 선행연구를 통해 최적화된 glass frit의 양인 2.53wt%를 첨가하였고 1170, 1200, $1230^{\circ}C$에서 소결하여 소결온도에 따른 변화를 관찰하였다. 실험방법으로는 원료를 혼합하기 위하여 24시간 ball-mill을 이용하여 혼합하였으며, $\Phi15$로 성형하여 소결을 진행하였다. 실험진행 결과 모든 시편에서의 비유전율은 glass frit가 첨가되지 않은 조성보다 높게 나타났으며, $1200^{\circ}C$에서 소결한 시편의 비유전율($\varepsilon_r$)은 2300으로 glass frit가 첨가되지 않은 조성과 비교하여 21% 증가하여 최대치를 나타냈다. 또한 소결온도 $1200^{\circ}C$ 이상에서의 모든 시편에서는 95% 이상의 상대밀도를 나타내어, glass frit가 소결조제로써의 역할을 하는 것으로 나타났다. 따라서 본 연구를 통해 glass frit첨가로 인한 소결온도 감소 및 유전특성이 증가하는 것을 확인 하였다.

• Journal of the Korean Ceramic Society
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• v.34 no.3
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• pp.241-248
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• 1997

RuO2 thin films were deposited on SiO2(1000$\AA$)/Si and MgO(100) single crystal substrates at low tem-peratures by hot-wall metalorganic chemical vapor deposition(MOCVD), and effects of deposition paramet-ers on the properties of the thin films were investigated. RuO2 single phase was obtained at lower de-position temperature of 25$0^{\circ}C$. RuO2 thin films deposited onto SiO2(1000$\AA$)/Si substrates showed a random orientation, and RuO2 films onto MgO(100) single crystals showed the (hk0) orientation. The crystallinity and resistivity of RuO2 thin films increased and decreased with increasing deposition temperature, respec-tively. The resistivity of RuO2 thin films decreased with decreasing the flow rate. The resistivity of the 2600$\AA$-thick RuO2 thin films deposited with O2 flow rate of 50 sccm at 35$0^{\circ}C$ was 52.7$\mu$$\Omega$-cm, and they could be applicable to bottom electrodes of high dielectric materals.

• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.158-165
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• 2010

This study reviewed terahertz technologies of time domain spectroscopy, T-ray imaging, and high rate wireless data transfer. The main topics of the terahertz research area were investigation of materials and package modules for terahertz wave generation and detection, and setup of the terahertz system for time domain spectroscopy(TDS), T-ray imaging and sub-THz wireless communication. In addition to Poly-GaAs film as a photoconductive switching antenna material, a table-top scale for the THz-TDS/imaging system and terahertz continuous wave(CW) generation systems for sub-THz data transfer and narrow band T-ray imaging were designed. Dielectric properties of ferroelectric BSTO($Ba_xSr_{1-x}TiO_3$) films and chalcogenide glass systems were characterized with the THz-TDS system at the THz frequency range. Package modules for terahertz wave transmitter/receiver(Tx/Rx) photoconductive antenna were developed.

• Journal of Korean Ophthalmic Optics Society
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• v.6 no.2
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• pp.23-29
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• 2001

In the SP series of glasses, the formation of droplet is well done with increasing PbO. But in the case SP-1, droplet could not be observed in low concentration PbO. These results are considered that PbO does the role of a network modifier, so the crosslinking break down by $SiO_2$. But, in the glasses contained PbO above 50 mol%, glasses are formeddue to $Pb^{4+}$ ion does the role of a network former. As a result of electrical conductivity analysis for SP series of glasses, the electrical conduction is due to bipolaron at high temperature, and it is due to single polaron hopping at low temperature. In the SP series of glasses, electrical conduction mechanism coincide with the correlated-barrier hopping(CBH) model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.832-835
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• 2001

We report the structural and electrical properties of hafnium oxide (HfO$_2$) films with tungsten silicide (WSi$_2$) metal gate. In this study, HfO$_2$thin films were fabricated by oxidation of sputtered Hf metal films on Si, and WSi$_2$was deposited directly on HfO$_2$by LPCVD. The hysteresis windows in C-V curves of the WSi$_2$HfO$_2$/Si MOS capacitors were negligible (<20 mV), and had no dependence on frequency from 10 kHz to 1 MHz and bias ramp rate from 10 mV to 1 V. In addition, leakage current was very low in the range of 10$^{-9}$ ~10$^{-10}$ A to ~ 1 V, which was due to the formation of interfacial hafnium silicate layer between HfO$_2$and Si. After PMA (post metallization annealing) of the WSi$_2$/HfO$_2$/Si MOS capacitors at 500 $^{\circ}C$ EOT (equivalent oxide thickness) was reduced from 26 to 22 $\AA$ and the leakage current was reduced by approximately one order as compared to that measured before annealing. These results indicate that the effect of fluorine diffusion is negligible and annealing minimizes the etching damage.

• Advances in aircraft and spacecraft science
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• v.4 no.5
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• pp.515-528
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• 2017

Since composite structures are widely used in structural engineering, delamination in such structures is an important issue of research. Delamination is one of a principal cause of failure in composites. In This study the electrical potential (EP) technique is applied to detect and locate delamination in basalt fiber reinforced polymer (FRP) laminate composite pipe by using electrical capacitance sensor (ECS). The proposed EP method is able to identify and localize hidden delamination inside composite layers without overlapping with other method data accumulated to achieve an overall identification of the delamination location/size in a composite, with high accuracy, easy and low-cost. Twelve electrodes are mounted on the outer surface of the pipe. Afterwards, the delamination is introduced into between the three layers (0º/90º/0º)s laminates pipe, split into twelve scenarios. The dielectric properties change in basalt FRP pipe is measured before and after delamination occurred using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to delamination, a finite element simulation model for delamination location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic. Response surfaces method (RSM) are adopted as a tool for solving inverse problems to estimate delamination location/size from the measured electrical potential changes of all segments between electrodes. The results show good convergence between the finite element model (FEM) and estimated results. Also the results indicate that the proposed method successfully assesses the delamination location/size for basalt FRP laminate composite pipes. The illustrated results are in excellent agreement with the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.

• Journal of the Korean Chemical Society
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• v.24 no.4
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• pp.288-294
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• 1980

Methanolysis rate constants were determined for $CH_3O(CO)Cl,\;CH_3S(CO)Cl\;and\;CH_3S(CS)Cl\;in\;CH_3OH-CH_3CN$ mixtures. Results show that the rates are not predominantly influenced by the bulk solvent properties but are partly influenced by specific electrophilic solvation.Polarity of the solvent is not a dominant factor but it nevertheless plays a role in charge stabilization of the $S_N1$ like transition state. The methanolysis proceeds through $S_N1$ mechanism for $CH_3S(CS)Cl$ for which both specific solvation of leaving group by methanol and charge stabilization by a high dielectric medium are important, while for $CH_3O(CO)Cl\;methanolysis occurs\;via\;S_N2$ mechanism in which both of the solvent effects are unimportant.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.48 no.9
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• pp.47-53
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• 2011

The signal transmission properties of the connector such as insertion loss and return loss are investigated using analysis procedure of S-parameter simulation, equivalent model extraction, and characteristic impedance calculation. S-parameter simulation is performed by connector's modeling and solving based on 3-dimensional finite element method. The connector's equivalent model of ${\pi}$ type is are proposed and extracted with an optimization process of circuit analysis simulator. The characteristic impedance of the connector is calculated with results of circuit analysis simulation and S-parameter data. According to the connector's characteristic impedance, it's revised design is carried out. In this work, the connector's effective contact area is increased and its body is applied as a high dielectric material in order to increase its capacitance and then obtain impedance matching. Therefore, return loss of the connector is improved by approximately 10 dB due to its design revision.