• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.14-14
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• 1998

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.53-58
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• 2022

Shape changes of hard mask play a key role in the aspect ratio dependent etch (ARDE). For etch process using high density and energy ions, deformation of hard mask shape becomes more severe, and high aspect ratio (HAR) etch profile is distorted. In this study, polygonal geometric model for shape-deformation of amorphous carbon layered hard mask is suggested to control etch profile during the process. Mask shape is modeled with polygonal geometry consisting of trapezoids and rectangles, and it provides dynamic information about angles of facets and etched width and height of remained mask shape, providing important features for real-time HAR etch profiling.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.287-287
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• 2011

ITRS(international technology roadmap for semiconductors)에 따르면 MOS (metal-oxide-semiconductor)의 CD(critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/SiO2를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두되고 있다. 일반적으로 metal gate를 식각시 정확한 CD를 형성시키기 위해서 plasma를 이용한 RIE(reactive ion etching)를 사용하고 있지만 PIDs(plasma induced damages)의 하나인 PICD(plasma induced charging damage)의 발생이 문제가 되고 있다. PICD의 원인으로 plasma의 non-uniform으로 locally imbalanced한 ion과 electron이 PICC(plasma induced charging current)를 gate oxide에 발생시켜 gate oxide의 interface에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 metal gate의 식각공정에 HDP(high density plasma)의 ICP(inductively coupled plasma) source를 이용한 중성빔 시스템을 사용하여 PICD를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. 식각공정조건으로 gas는 HBr 12 sccm (80%)와 Cl2 3 sccm (20%)와 power는 300 w를 사용하였고 200 eV의 에너지로 식각공정시 TEM(transmission electron microscopy)으로 TiN의 anisotropic한 형상을 볼 수 있었고 100 eV 이하의 에너지로 식각공정시 하부층인 HfO2와 높은 etch selectivity로 etch stop을 시킬 수 있었다. 실제 공정을 MOS의 metal gate에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU(North Carolina State University) CVC model로 effective electric field electron mobility를 구한 결과 electorn mobility의 증가를 볼 수 있었고 또한 mos parameter인 transconductance (Gm)의 증가를 볼 수 있었다. 그 원인으로 CP(Charge pumping) 1MHz로 gate oxide의 inteface의 분석 결과 이러한 결과가 gate oxide의 interface trap양의 감소로 개선으로 기인함을 확인할 수 있었다.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.845-852
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• 2011

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processing conditions. The compact/target(?) has a diameter of ${\Phi}150{\times}6.35mm$. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FE-SEM. A Ti thin-film fabricated on a $Si/SiO_2$ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below $40{\mu}m$, respectively. The specific resistivity of the optimized Ti target was $8.63{\times}10^{-6}{\Omega}{\cdot}cm$.

• Journal of Powder Materials
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• v.10 no.3
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• pp.176-180
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• 2003

Pure WC powders which does not include a binder phase were consolidated by spark plasma sintering (SPS) process at 1600~185$0^{\circ}C$ for 0~30 min under 50 MPa. Microstructure alid mechanical properties of binderless WC prepared by SPS were investigated. With increasing sintering temperature, sintered density and Vickers hardness of binderless WC increased. The fracture toughness of binderless WC was 7~15 MPa $m^{1/2}$ depending on the sintered density and decreased with increasing the Vickers hardness. It is found that the binderless WC prepared by SPS at 175$0^{\circ}C$ for 10 min under 50 MPa showed nearly full densification with fine-grained structure and revealed excellent mechanical properties of high hardness (~HV 2400) and considerably high fracture toughness (~7 MPa $m^{1/2}$).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.170-171
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• 2008

The etching characteristics of Zirconium Oxide ($ZrO_2$) and etch selectivity of $ZrO_2$ to Si in HBr/$SF_6$ plasma were investigated. It was found that $ZrO_2$ etch rate shows a non-monotonic behavior with increasing both HBr fraction in $SF_6$ plasma, Source power, Bias Power, gas pressure. The maximum $ZrO_2$ etch rate of 54.8 nm/min was obtained for HBr(25%)/$SF_6$(75%) gas mixture. From these data, the suggestions on the $ZrO_2$ etch characteristics were made.

• The Korean Journal of Ceramics
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• v.3 no.3
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• pp.159-162
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• 1997

Diamond was uniformly nucleated on large area Si(001) substrate (3cm$\times$4cm) using the low pressure magnetoactive microwave plasma chemical vapor deposition. $CH_4/He$ gas mixture was used as source gas in order to obtain high radical density in the nucleation enhancement step. $CH_3$radical density was measured by means of infrared laser absorption spectroscopy. The effect of substrate bias voltage on diamond nucleation was examined. The results showed that a suitable positive bias voltage appled to the substrate with respect to the chamber could enhance diamond nucleation while a negative bias voltages leaded to deposition of only non-diamond phase carbon.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.27-35
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• 2002

In laser materials processing, localized heating, melting and evaporation caused by focused laser radiation forms a vapor on the material surface. The plume is generally an unstable entity, fluctuating according to its own dynamics. The beam is refracted and absorbed as it traverses the plume, thus modifying its power density on the surface of the condensed phases. This modifies material evaporation and optical properties of the plume. A laser-produced plasma plume simulation is completed using axisymmetric, high-temperature gas dynamic model including the laser radiation power absorption, refraction, and reflection. The physical properties and velocity profiles are verified using the published experimental and numerical results. The simulation results provide the effect of plasma plume fluctuations on the laser power density and quantitative beam radius changes on the material surface. It is proved that beam absorption, reflection and defocusing effects through the plume are essential to obtain appropriate mathematical simulation results. It is also found that absorption of the beam in the plume has much less direct effect on the beam power density at the material surface than defocusing does and helium gas is more efficient in reducing the beam refraction and absorption effect compared to argon gas for common laser materials processing.

• Journal of the Korean institute of surface engineering
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• v.27 no.6
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• pp.327-334
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• 1994

This work concerns a research for helicon wave plasma generators with applications to materials pro-cessing. For this end, helicon wave plasma source has been designed, constructed and tested. High density plasma was successfully produced and diagnosed with Langmuir probe. The measured maximum plasma de-nsity in this work was $10^{11}cm{-3}$ with 295 gauss of magnetic field and electron temperature was about 3.5eV. The uniformity of plasma densities in the radial direction was excellent with 160 gauss of magnetic field on the cross section which is 10cm apart from the edge of the exciting coil.

• Applied Science and Convergence Technology
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• v.23 no.4
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• pp.169-178
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• 2014

Fluid model based numerical analysis is done to simulate a low damage etch back system for 20 nm scale semiconductor fabrication. Etch back should be done conformally with very high material selectivity. One possible mechanism is three steps: reactive radical generation, adsorption and thermal desorption. In this study, plasma generation and transport steps are analyzed by a commercial plasma modeling software package, CFD-ACE+. Ar + $CF_4$ ICP was used as a model and the effect of reactive gas inlet position was investigated in 2D and 3D. At 200~300 mTorr of gas pressure, separated gas inlet scheme is analyzed to work well and generated higher density of F and $F_2$ radicals in the lower chamber region while suppressing ions reach to the wafer by a double layer conducting barrier.