Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Fabrication and Evaluation Properties of Titanium Sintered-body for a Sputtering Target by Spark Plasma Sintering Process

방전플라즈마 소결 공정을 이용한 스퍼터링 타겟용 타이타늄 소결체 제조 및 특성 평가

  • Lee, Seung-Min (Korea Institute of Industrial Technology (KITECH), Automotive Components Center) ;
  • Park, Hyun-Kuk (Korea Institute of Industrial Technology (KITECH), Automotive Components Center) ;
  • Youn, Hee-Jun (Korea Institute of Industrial Technology (KITECH), Automotive Components Center) ;
  • Yang, Jun-Mo (Measurement & Analysis Team, National Nanofab Center) ;
  • Woo, Kee-Do (School of Advanced Materials Engineering, Chunbuk National University) ;
  • Oh, Ik-Hyun (Korea Institute of Industrial Technology (KITECH), Automotive Components Center)
  • 이승민 (한국생산기술연구원 동력부품센터) ;
  • 박현국 (한국생산기술연구원 동력부품센터) ;
  • 윤희준 (한국생산기술연구원 동력부품센터) ;
  • 양준모 (나노종합팹센터 특성평가팀) ;
  • 우기도 (전북대학교 금속공학과) ;
  • 오익현 (한국생산기술연구원 동력부품센터)
  • Received : 2011.03.30
  • Published : 2011.11.25
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Abstract

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processing conditions. The compact/target(?) has a diameter of ${\Phi}150{\times}6.35mm$. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FE-SEM. A Ti thin-film fabricated on a $Si/SiO_2$ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below $40{\mu}m$, respectively. The specific resistivity of the optimized Ti target was $8.63{\times}10^{-6}{\Omega}{\cdot}cm$.

Keywords

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