• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.287-288
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• 2005

In this study, we have investigated electro-optical characteristics of thermal and UV stressed TN cells on the rubbed polyimide surface. Mono-domain alignments of thermal stressed TN cells over temperature of liquid crystal isotropic phase were almost same that of no thermal stressed TN cells. Also, threshold voltage and response time of thermal stressed TN cells were same that of no thermal stressed TN cells. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface show decrease of characteristics as increasing thermal stress time. Therefore, thermal stability of TN cell was decreased by high thermal stress for the long times.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.1033-1036
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• 2006

We have investigated electro-optical characteristics in three kinds of twisted nematic (TN) cells on the polyimide surface. The threshold voltage and the response time of thermal stressed TN cells were same that of no thermal stressed TN cells. There were little change of value in these TN cells. On the other hand, transmittance of no thermal stressed TN cells were better than that of thermal stressed TN cells. Transmittances of TN cells on the polyimide surface decreased by increasing thermal stress time. Moreover, the residual DC of the thermal stressed TN cells increased as increasing thermal stress temperature and time. Therefore, thermal stability of TN cells were decreased gradually by giving high thermal stress for a long time.

• Transactions of the Society of Information Storage Systems
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• v.2 no.3
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• pp.208-213
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• 2006

The present state of the design of swing arm actuators for optical disc drives is to obtain the high efficient dynamic characteristics within a very compact volume. As a necessary consequence, the need of the small form factor (SFF) storage device has been arisen as major interests in the information storage technology. In this paper, we suggest the miniaturized swing arm type actuator that has high efficient dynamic characteristics for SFF optical disk drive (ODD). For the operating mechanism, it uses a tracking electromagnetic (EM) circuit for a focusing motion together. Moreover, due to the size constraint, the thermal stability of optical head is important. Therefore, the actuator is designed to emit the heat, which is generated by optical pick-up, along the actuator body easily. Initial model is designed based on the topology optimization method considering the thermal conductivity. Then, the structural parts of the actuator are modified to maintain the high sensitivity and to have wide control bandwidth by the design of experiments method (DOE) and new concept of decreasing mass and inertia. Finally, a swing arm type actuator for SFF ODD is suggested and its dynamic characteristics are verified.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.80-86
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• 2014

We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of $70kgf/mm^2$ grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to $200^{\circ}C$. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at $200^{\circ}C$ and also physical properties show stable thermal and electrical conductance of over $220W/m{\cdot}K$ and 58.44% IACS upto the $200^{\circ}$. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.18-22
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• 2008

In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.

• Journal of the Korean Applied Science and Technology
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• v.27 no.4
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• pp.552-558
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• 2010

Zinc soap and Zn/Ba mixed metal soap were synthesized and PVC plastisol with mixed metal soap and various costabilizers were also synthesized with good structures and characterized by IR and $^1H$-NMR. The IR spectrums and $^1H$-NMR spectrums of the synthesized soaps were in very good accordance with the structures proposed by earlier workers. In using phosphite as a costabilizer, TIDP phosphite was shown to be the excellent thermal stabilization effect at the low temperature and TNPP phosphite was shown to be the excellent thermal stabilization effect at the high temperature. In case of antioxidant, it was revealed that antioxidant was not effective in the low temperature thermal stabilization effect while highly effective in the high temperature thermal stability. $NaClO_4$ solution with sorbitol solvent had the best thermal stabilization effect among $NaClO_4$ solution series at low and high temperature.

• Journal of Powder Materials
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• v.12 no.1
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• pp.43-50
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• 2005

Mechanical alloying using high-energy ball mill and subsequent spark plasma sintering (SPS) process was applied to Al-Fe-Cr and Al-Fe-Mo powder mixture to investigate effects of Cr and Mo addition on thermal stability of Al-Fe, and thereby to enhance its thermal stability up to $500^{\circC}$. Various analytical techniques including micro-Vickers hardness test, SEM, TEM, X-ray diffractometry and corrosion test were carried out. It was found that addition of Cr and Mo to Al-Fe system played a role of grain growth inhibitor of matrix Al and some precipitates such as $Al_3Fe$ during SPS and subsequent heat treatment. The inhibition of grain growth resulted in increased Vickers hardness and thermal stability up to $500^{\circC}$ comparing to those of Al-Fe alloy system.

• Journal of Powder Materials
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• v.12 no.1
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• pp.70-78
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• 2005

Mechanical alloying using high-energy ball mill and subsequent spark plasma sintering (SPS) process was applied to understand mechanical alloying processing of Al-Fe alloy system. The thermal stability of mechanically alloyed Al-Fe alloy was intended to be enhanced by SPS process. Various analytical techniques including particle size analysis, density measurement, micro-Vickers hardness test, SEM, TEM, and X-ray diffractometry were adopted to find optimum processing conditions for mechanical alloying and subsequent SPS and to estimate thermal stability of the prepared alloy. It was found from the treatment of mechanically alloyed Al-8wt.%Fe powder mixture that needle-shaped $Al_3Fe$ precipitates was formed in the Al-Fe matrix, and the alloy compact showed enhanced densification and reached its full density with little loss of its fine microstructure. After heat treatment at $500^{\circC}$, it was also shown that the thermal stability of Al-8wt.%Fe alloy fabricated in the present study was enhanced, which was due to its fine microstructure developed by fast densification of SPS.

• Carbon letters
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• v.9 no.3
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• pp.200-202
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• 2008

In order to improve the thermal stability of PAN-based electrospun fibers, AP-PER-MEL and $TiO_2$ were added in to the fibers as additives. The polymer composite with uniformly mixed additional agents was obtained. In case of non-treated sample, the fibers were burn off completely with high rate within $620^{\circ}C$. But in case of treated samples (EF-M and EF-MT), it is sure that the thermal stability was improved by studying TGA data and ISO flammability test about 20 and 30%, respectively. A synergy effect of adding two kinds of agents (AP-PER-MEL and $TiO_2$) into PAN-based electrospun fibers was confirmed. Through SEM images, it is confirmed that the fiber shape can be kept even after addition of agents (AP-PER-MEL and $TiO_2$). Finally the thermal stability of fibers was largely developed with keeping the nature of PAN-based fibers effectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.365-369
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• 2016

In this paper, we fabricated Cu/Mn alloy shunt resistor with low resistance and thermal stability for use of mobile electronic devices. We designed metal alloy composed of copper (Cu) and manganese (Mn) to embody in low resistance and low TCR which are conflict each other. Cu allows high electrical conductivity and Mn serves thermal stability in this Cu/Mn alloy system. We confirmed the elemental composition of the designed metal alloy system by using energy dispersive X-ray (EDX) analysis. We obtained low resistance below $10m{\Omega}$ and low temperature coefficient of resistance (TCR) below $100ppm/^{\circ}C$ from the designed Cu/Mn alloy resistor. And in order to minimize resistance change caused by alternative frequency on circuit, shape design of the metal alloy wire is performed by rolling process. Finally, we conclude that design of the metal alloy system was successfully done by alloying Cu and 3 wt% of Mn, and the Cu/Mn alloy resistor has low resistance and thermal stability.