• 제목/요약/키워드: High Power semiconductor

검색결과 968건 처리시간 0.026초

고내압 IGBT의 전기적 특성 향상에 관한 연구 (High Voltage IGBT Improvement of Electrical Characteristics)

  • 안병섭;정헌석;정은식;김성종;강이구
    • 한국전기전자재료학회논문지
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    • 제25권3호
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    • pp.187-192
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    • 2012
  • Development of new efficient, high voltage switching devices with wide safe operating area and low on-state losses has received considerable attention in recent years. One of those structures with a very effective geometrical design is the trench gate Insulated Gate Bipolar Transistor(IGBT).power IGBT devices are optimized for high-voltage low-power design, decided to aim. Class 1,200 V NPT Planer IGBT, 1,200 V NPT Trench IGBT for class has been studied.

전력용반도체 소자를 이용한 새로운 고전압 펄스발생회로 (High Voltage Pulse Generator using Power Semiconductor Switches)

  • 이영운
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2000년도 전력전자학술대회 논문집
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    • pp.30-33
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    • 2000
  • Using power semiconductor switches such as IGBTs diodes and L-C circuits novel repetitive impulse voltage generator is developed. In the presented circuits high voltage pulse is generated by series-connection of capacitors and IGBTs. The charging of capacitors and voltage balance of IGBTs is done automatically. To verify the proposed circuit 20kV, 300A pulse generator is manufactured and tested.

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고압 전력변환장치를 위한 전력용 스윗칭 반도체 소자의 특성 (Characteristics of power switching semiconductors for high voltage power converters)

  • 서범석;심은용;조순봉;현동석
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1990년도 하계학술대회 논문집
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    • pp.409-412
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    • 1990
  • Series connection of power switching semiconductor elements is unavoidable when a high voltage convertor is aimed. However, it is important to equalize distribution of turn-off voltage because the switching elements have different characteristics. In this paper optimal switching control algorithm is proposed so that series connected poker switching semiconductor elements can be always switched simultaneous turn-on and turn-off.

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고 전력 Source Measurement Unit의 설계 및 제작 (Design and Implementation of High Power Source Measurement Unit)

  • 이상구;백왕기;박종식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 B
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    • pp.860-863
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    • 2003
  • In this paper high power SMU(Source Measurement Unit) having 50V/1.5A source/measure range has been designed and implemented. The SMU has two operation mode, voltage mode and current mode. The SMU can be used as variable voltage source, variable current source, voltage meter, or current meter. Combining two different unit, output power can be doubled as 100V/1.5A. The developed SMU tan be used many semiconductor testing system and electronic device inspecting system.

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Design A High Efficiency Auxiliary Power Supply with Wide Input Voltage Range for PV-PCS

  • Jin, Cheng-hao;Li, Shan-mei;Kim, Jin-tae
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2012년도 전력전자학술대회 논문집
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    • pp.343-344
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    • 2012
  • In high power PV generation system, the solar cell normally generates wide output voltage depending on the insolation, cell's temperature and shade effect. This paper will propose a high efficiency converter allowing the wide input voltage to supply stable voltage with the controller and operation for the PV generation system. The proposed converter consists of two stages comprising SEPIC with a coupled inductor and LLC, which generates 24 V of output at the final output terminal. In this paper, a design method and experimental results with a test-bed of 50 W will be presented to validate the proposed converter.

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4.5kV/1.5kA급 IGCT 설계 및 특성분석 (Design of 4.5kV/1.5kA IGCT)

  • 김형우;김상철;서길수;김은동
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.357-360
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    • 2003
  • In this paper, we designed 4.5kV/1.5kA IGCT devices. GCT thyristor has many superior characteristics compared with GTO thyristor, for examples; snubberless turn-off capability, short storage time, high turn-on capability, small turn-off gate charge and low total power loss of the application system containing device and peripheral parts such as anode reactor and snubber capacitance. In this paper we designed GCT thyristor devices, and analyzed static and dynamic characteristics of GCT thyristor depending on the minority carrier lifetime, n-base thickness and doping concentration of n-base region, respectively. Especially, turn-on and turn-off characteristics are very important characteristics for GCT thyristor devices. So, we considered above characteristic for design and analysis of GCT devices.

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RF magnetron sputtering으로 증착한 IGZO 박막의 RF power에 따른 구조적, 광학적 및 전기적 특성 연구 (The Structures, Optical and Electrical Properties of IGZO Thin Films by RF Magnetron Sputtering According to RF Power)

  • 연제호;김홍배
    • 반도체디스플레이기술학회지
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    • 제15권3호
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    • pp.57-61
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    • 2016
  • We have studied the structural, optical and electrical properties of IGZO thin films. The IGZO thin films were deposited on the silicon wafer by RF magnetron sputtering method. The RF power in sputtering process was varied as 15W, 30W, 45W, 60W, 75W, respectively. All of the thin films transmittance in the visible range was above 85%. XRD analysis showed that amorphous structure of the thin films without any peak. The Hall measurements in the low RF power is the high mobility above $10cm^2/V{\cdot}s$ and the low resistvity are obtained in the IGZO thin films.

고속전철용 고전압 IGCT소자의 전기적 특성 (Electrical Characteristics of High Voltage IGCT Devices for Rapid Electronic Railway)

  • 김상철;서길수;김형우;김은동
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 하계학술대회 논문집 C
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    • pp.1556-1558
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    • 2003
  • IGCT devices is a superior devices for power conversion purpose. The basic structure of the IGCT devices is same as that of GTO thyristor. This makes the blocking voltage higher and controllable on-state current higher. In this paper, we present static and dynamic characteristics of 4.5 kV PT-type IGCT devices as a function of minority carrier lifetime, n-base thickness and n-buffer thickness. We should choose proper structural parameters for good electrical characteristics of GCT devices.

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Effects of Electrostatic Discharge Stress on Current-Voltage and Reverse Recovery Time of Fast Power Diode

  • Bouangeune, Daoheung;Choi, Sang-Sik;Cho, Deok-Ho;Shim, Kyu-Hwan;Chang, Sung-Yong;Leem, See-Jong;Choi, Chel-Jong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권4호
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    • pp.495-502
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    • 2014
  • Fast recovery diodes (FRDs) were developed using the $p^{{+}{+}}/n^-/n^{{+}{+}}$ epitaxial layers grown by low temperature epitaxy technology. We investigated the effect of electrostatic discharge (ESD) stresses on their electrical and switching properties using current-voltage (I-V) and reverse recovery time analyses. The FRDs presented a high breakdown voltage, >450 V, and a low reverse leakage current, < $10^{-9}$ A. From the temperature dependence of thermal activation energy, the reverse leakage current was dominated by thermal generation-recombination and diffusion, respectively, at low and high temperature regions. By virtue of the abrupt junction and the Pt drive-in for the controlling of carrier lifetime, the soft reverse recovery behavior could be obtained along with a well-controlled reverse recovery time of 21.12 ns. The FRDs exhibited excellent ESD robustness with negligible degradations in the I-V and the reverse recovery characteristics up to ${\pm}5.5$ kV of HBM and ${\pm}3.5$ kV of IEC61000-4-2 shocks. Likewise, transmission line pulse (TLP) analysis reveals that the FRDs can handle the maximum peak pulse current, $I_{pp,max}$, up to 30 A in the forward mode and down to - 24 A in the reverse mode. The robust ESD property can improve the long term reliability of various power applications such as automobile and switching mode power supply.

설계툴을 사용한 저전력 SoC 설계 동향 (Low Power SoC Design Trends Using EDA Tools)

  • 박남진;주유상;나중찬
    • 전자통신동향분석
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    • 제35권2호
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    • pp.69-78
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    • 2020
  • Small portable devices such as mobile phones and laptops currently display a trend of high power consumption owing to their characteristics of high speed and multifunctionality. Low-power SoC design is one of the important factors that must be considered to increase portable time at limited battery capacities. Popular low power SoC design techniques include clock gating, multi-threshold voltage, power gating, and multi-voltage design. With a decreasing semiconductor process technology size, leakage power can surpass dynamic power in total power consumption; therefore, appropriate low-power SoC design techniques must be combined to reduce power consumption to meet the power specifications. This study examines several low-power SoC design trends that reduce semiconductor SoC dynamic and static power using EDA tools. Low-power SoC design technology can be a competitive advantage, especially in the IoT and AI edge environments, where power usage is typically limited.