• Journal of Power Electronics
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• v.15 no.4
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• pp.951-963
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• 2015

In this paper, a new symmetric multilevel inverter is proposed. A simple structure for the cascaded multilevel inverter topology is also proposed, which produces a high number of levels with the application of few power electronic devices. The symmetric multilevel inverter can generate 2n+1 levels with a reduced number of power switches. The basic unit is composed of a single and double source unit (SDS-unit). The application of this SDS-unit is for reducing the number of power electronic components like insulated gate bipolar transistors, freewheeling diodes, gate driver circuits, dc voltage sources, and blocked voltages by switches. Various new algorithms are recommended to determine the magnitude of dc sources in a cascaded structure. Furthermore, the proposed topology is optimized for different goals. The proposed cascaded structure is compared with other similar topologies. For verifying the performance of the proposed basic symmetric and cascaded structure, results from a computer-based MATLAB/Simulink simulation and from experimental hardware are also discussed.

• Proceedings of the KIPE Conference
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• 2005.07a
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• pp.774-777
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• 2005

In this paper, a constant frequency phase shifting PWM controlled voltage source full bridge-type series load resonant high-frequency inverter using the IGBT power modules is presented for innovative consumer electromagnetic induction heating applications such as a hot water producer, steamer and super heated steamer. The full bridge arm side link passive quasi-resonant capacitor snubbers in parallel with the each power semiconductor device and high frequency AC load side linked active edge inductive snubber-assisted series load resonant tank soft switching inverter with a constant frequency phase shifted PWM control scheme is discussed and evaluated on the basis of the simulation and experimental results. It is proved from a practical point of view that the series load resonant and edge resonant hybrid high-frequency soft switching PWM inverter topology, what is called class DE type. including the variable-power variable-frequency(VPVF) regulation function can expand zero voltage soft switching commutation range even under low output power setting ranges, which is more suitable and acceptable for induction heated dual packs fluid heater developed newly for consumer power utilizations. Furthermore, even in the lower output power regulation mode of this high-frequency load resonant tank high frequency inverter circuit it is verified that this inverter can achieve ZVS with the aid of the single auxiliary inductor snubber.

• Proceedings of the KSR Conference
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• 2011.05a
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• pp.1473-1479
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• 2011

In this paper, speed control of IPMSM drives for the next generation domestic high speed railway system using multilevel inverter is presented. Multilevel inverter is suitable for the high-voltage high-capacity motor drive system because noise and switching frequency of power semiconductor devices is reduced. For the speed control of IPMSM using multilevel inverter, maximum torque control is applied in a constant torque region, and field weakening control is applied in a constant power region. Simulation programs based on Matlab/Simulink are developed. Finally the designed system is verified by simulation and their characteristics are analyzed by the simulation results.

• The Transactions of the Korean Institute of Power Electronics
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• v.22 no.2
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• pp.181-184
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• 2017

This study analyzes the turn-on and turn-off transients of a metal-oxide-semiconductor field-effect transistor (MOSFET) with high-switching frequency systems. In these systems, the voltage distortion becomes serious at the output terminal of a Vienna rectifier by the turn-off delay of the MOSFET. The current has low-order harmonics through this voltage distortion. This paper describes the transient of the turn-off that causes the voltage distortion. The algorithm for reducing the sixth harmonic using a proportional-resonance controller is proposed to improve the current distortion without complex calculation for compensation. The reduction of the current distortion by high-switching frequency is verified by experiment with the 2.5-kW prototype Vienna rectifier.

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.12-17
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• 2024

Floating inverter amplifiers (FIAs) have recently garnered considerable attention owing to their high energy efficiency and inherent resilience to input common-mode voltages and process-voltage-temperature variations. Since the voltage gain of a simple FIA is low, it is typically cascaded or cascoded to achieve a higher voltage gain. However, cascading poses stability concerns in closed-loop applications, while cascoding limits the output swing. This study introduces a gain-enhanced FIA that features cross-coupled body biasing. Through simulations, it is demonstrated that the proposed FIA designed using a 28-nm complementary metal-oxide-semiconductor technology with a 1-V power supply can achieve a high voltage gain (> 90 dB) suitable for dynamic open-loop applications. The proposed FIA can also be used as a closed-loop amplifier by adjusting the amount of positive feedback due to the cross-coupled body biasing. The capability of achieving a high gain with minimum-length devices makes the proposed FIA a promising candidate for low-power, high-speed sensor interface systems.

• Korean Journal of Materials Research
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• v.3 no.5
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• pp.459-465
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• 1993

By making the inter-metal PECVD $SiO_2$ as a Si rich oxide under the SOG, the hydrogen and water related diffusants could be captured a t SI dangling bonds. This gettering process was known to prevent the device characteristics degradations related to the H, $H_20$. The basic characteristics of Si rich oxide have been studied according to changing high/low frequency power and $SiH_4/N_2O$ gas flow ratio in PECVD. As increase in low frequency power, deposition rate decreased but K.I. and compressive stress increased. Decrease of the water peaks of FTIR spectra at the wave number range of 3300~3800$\textrm{cm}^{-1}$' also indicated that intensty the films were densified. As increase in SiH, gas flow rate, deposition rate, R.I. and etch rate increased while compressive stress decreased. F'TIK spectra showed that peak intensity corresponding to Si-0-Si stretching vibration decreased and shifted to the lower wave numbers. But AES showed that Si dangl~ng bonds were increased as a result of lower Si:O(l: 1.23) ratlo inthe Si rich oxide as compared to Si : O(1 : 1.98) ratio of usual oxide.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.83-85
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• 2019

The use of high voltage gain converters is essential for the distributed power generation systems with renewable energy sources such as the fuel cells and solar cells due to their low voltage characteristics. In this paper, a high voltage gain topology combining cascode Inverting Buck-Boost converter and voltage multiplier structure is introduced. In proposed converter, the input voltage is connected in series at the output, the portion of input power is directly delivered to the load which results in continuous input current. In addition, the voltage multiplier stage stacked in proper manner is not only enhance high step-up voltage gain ratio but also significantly reduce the voltage stress across all semiconductor devices and capacitors. As a result, the high current-low voltage switches can be employed for higher efficiency and lower cost. In order to show the feasibility of the proposed topology, the operation principle is presented and the steady-state characteristic is analyzed in detail. A 380W-40/380V prototype converter was built to validate the effectiveness of proposed converter.

• Journal of electromagnetic engineering and science
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• v.11 no.4
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• pp.282-289
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• 2011

GHz electromagnetic interference (EMI) characteristics are analyzed for a 3dimensional (3D) stacked chip power distribution network (PDN) with through silicon via (TSV) connections. The EMI problem is mostly raised by P/G (power/ground) noise due to high switching current magnitudes and high PDN impedances. The 3D stacked chip PDN is decomposed into P/G TSVs and vertically stacked capacitive chip PDNs. The TSV inductances combine with the chip PDN capacitances produce resonances and increase the PDN impedance level in the GHz frequency range. These effects depend on stacking configurations and P/G TSV designs and are analyzed using the P/G TSV model and chip PDN model. When a small size chip PDN and a large size chip PDN are stacked, the small one's impedance is more seriously affected by TSV effects and shows higher levels. As a P/G TSV location is moved to a corner of the chip PDNs, larger PDN impedances appear. When P/G TSV numbers are enlarged, the TSV effects push the resonances to a higher frequency range. As a small size chip PDN is located closer to the center of a large size chip PDN, the TSV effects are enhanced.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.293-297
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• 2010

We have studied the optical and electrical properties of a-IGZO thin films on the n-type semiconductor fabricated by RF magnetron sputtering method. The ceramic target was used in which $In_2O_3$, $Ga_2O_3$ and ZnO powder were mixed with 1:1:2 mol% ratio and furnished. The RF power was set at 25 W, 50 W, 75 W and 100 W as a variable process condition. The transmittance of the films in the visible range was above 80%, and it was 92% in the case of 25 W power. AFM analysis showed that the roughness increased as increasing RF power, and XRD showed amorphous structure of the films without any peak. The films are electrically characterized by high mobility above 10 $cm^2/V{\cdot}s$ at low RF power, high carrier concentration and low resistivity. It is required to study further finding the optimal process condition such as lowering the RF power, prolonging the deposition ratio and qualification analysis.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.563-569
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• 2015

For some low-frequency applications such as power-related circuits, NEM relays have been known to show better performance than MOSFETs. For example, in a step-down charge pump circuit, the NEM relays showed much smaller layout area and better energy efficiency than MOSFETs. However, severe process variations of NEM relays hinder them from being widely used in various low-frequency applications. To mitigate the process-variation problems of NEM relays, in this paper, a new NEM-relay charge pump circuit with the self-adjustment is proposed. By self-adjusting a pulse amplitude voltage according to process variations, the power consumption can be saved by 4.6%, compared to the conventional scheme without the self-adjustment. This power saving can also be helpful in improving the power efficiency of the proposed scheme. From the circuit simulation of NEM-relay charge pump circuit, the efficiency of the proposed scheme is improved better by 4.1% than the conventional.