• 제목/요약/키워드: Heating Condition

검색결과 1,305건 처리시간 0.026초

Sodium Isocyanate의 제법 및 $Na_2CO_3$, Urea, Biuret 혼재시 그의 정량분석법에 관한 연구 (Preparation of Sodiumisocyanate and its Analyzing Method in the Presence of Impurities $Na_2CO_3$, Urea, and Biuret)

  • 국채호
    • 약학회지
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    • 제7권2_3호
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    • pp.67-71
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    • 1963
  • Studies the reaction mechanism and optimal reaction condition of the process of preparing sodium isocyanate, by means of heating of sodium carbonate and urea. Proposing, at the sametime, the quantitative analyzing method of sodium isocyanate in the presence of impurities of $Na_{2}CO_{3}$, urea and biuret. 1. Sodium isocyanate could be prepared by means of heating reaction of sodium carbonate and urea. 2. Adding urea into the heated sodium carbonate is reasonable. 3. Quantitative analysis of sodium isocyanate in the presence of impurities, $Na_{2}CO_{3}$, urea and biuret could be done by the following method:-adding nitrobarite solution into sample solution in order to remove $CO_{3}"$ and neutralize the solution, filtering off $BaCO_{3}$, and then precipitating isocyanate as a silver salt, filtering off AgNCO, and then, titrating remaining $AgNO_{3}$ with $NH_{4}SCN$, (indicator $FeNH_{4}(SO_{4})_{2})$/TEX>

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가열 후 냉각조건에 따른 골재 종류별 고강도 콘크리트의 역학적 특성 평가 (Evaluation on Mechanical Properties of High Strength Concrete according to the Aggregate Type and after Heating Cooling Conditions)

  • 윤종일;김규용;남정수;최경철;윤민호;함은영
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2012년도 추계 학술논문 발표대회
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    • pp.99-100
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    • 2012
  • Aggregate thermal properties and cooling methods are most important to evaluate the residual mechanical properties of concrete. In this study, we evaluate the residual mechanical properties of concrete according to the aggregate type and cooling method. We use the normal weight aggregate and light weight aggregate which have different thermal properties. After heating to the target temperature, we evaluate the mechanical properties according to the slow and fast cooling condition. As a result, normal weight aggregate concrete has higher effectiveness of cooling conditions than light weight aggregate concrete.

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사염화탄소의 열분해 소각에 관한 연구 (A Study on the Thermal Decomposition of Carbon Tetrachloride by Pyrolytic Incineration)

  • 이태호;정홍기
    • 환경위생공학
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    • 제11권1호
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    • pp.57-61
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    • 1996
  • This study was to decompose carbon tetrachloride and CFC with pyrolytic incineration unit because of prohibition of their usage sooner or later. We have investigated heating value and temperature versus decomposing rate, removal of $Cl_2$ and dust in the flue gas, The results obtained were as follows; 1. In combustion condition to decompose $CCl_4$ heating value was 3,300Kcal/Kg, retention time was 2,0 sec. incinerator exit temperature was $950^{\circ}C$. 2.The removal of HCI and $Cl_2$ in flue gas used NaOH as reagent, then molar ratio o of $Na^+/Cl^-$ was 1.07. 3. NaCI of dust component was more than 90 %, 2 stage venturi scrubber was used to remove dust, then removal rate of dust was 99% over at L/G of $1.7Vm^3$

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NUMERICAL ANALYSIS FOR UNSTEADY THERMAL STRATIFIED FLOW WITH HEAT TRACING IN A HORIZONTAL CIRCULAR CYLINDER

  • Jeong, Ill-Seok;Song, Woo-Young;Park, Man-Heung
    • 한국원자력학회:학술대회논문집
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    • 한국원자력학회 1997년도 춘계학술발표회논문집(1)
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    • pp.304-309
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    • 1997
  • A method to mitigate the thermal stratification flow of a horizontal pipe line is proposed by heating external bottom of the pipe with electrical heat tracing. Unsteady two dimensional model has been used to numerically investigate an effect of the external Denting to the thermally stratified flow. The dimensionless governing equations are solved by using the control volume formulation and SIMPLE algorithm. Temperature distribution, streamline profile and Nusselt numbers of fluids and pipe walls with time are analyzed in case of externally heating condition. no numerical result of this study shows that the maximum dimensionless temperature difference between the hot and the cold sections of pipe inner wall is 0.424 at dimensionless time 1,500 ann the thermal stratification phenomena is disappeared at about dimensionless time 9,000. This result means that external heat tracing can mitigate the thermal stratification phenomena by lessening $\Delta$ $T_{ma}$ about 0.1 and shortening the dimensionless time about 132 in comparison with no external heat tracing.rnal heat tracing.

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옥상용 합성고분자 시트를 애용한 지붕노출 시스템 적용에 관한 연구 (A Study on Application of Exposure System using Waterproofing Sheets of Synthetic Polymer for Rooftop)

  • 이상수;김수련;곽규성;오상근
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2005년도 춘계 학술기술논문발표대회 논문집
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    • pp.179-183
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    • 2005
  • In apply roof waterproof system using of synthetic high polymer sheet for rooftop measure physical performance (tension$\cdot$tearing ability, temperature relativity, heating stretch performance, junction performance, wind resistance test) by various test environment condition waterproof test of structure and performance of construction work aspect, present suitable form of construction work under these environment. Also, wish to improve durability of concrete structure as that examine in priority about adhesion method and joint junction method with waterproof out surface, and present new direction about roof system application of waterproofing method for rooftop.

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마이크로채널 기판에서 비정상 복합 열전달의 수치적 연구 (NUMERICAL STUDY OF TRANSIENT CONJUGATE HEAT TRANSFER IN A MICRO-CHANNEL SUBSTRATE)

  • 이희준
    • 한국전산유체공학회지
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    • 제17권4호
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    • pp.87-92
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    • 2012
  • A numerical study of transient conjugate heat transfer on micro heater in a micro-channel substrate under pulsed heating was conducted. It was found that the time constant is not affected by the pulse heating magnitude at same operating condition. Furthermore, the time constant increases with low substrate thermal diffusivity, low Reynolds number, and large channel diameter. Since the time constant is a dominant parameter to characterize transient heat transfer, it should be considered for transient convective heat transfer coefficient.

수정된 화학증착과정에서 토치이송과 고체층이 열전달과 입자부착에 미치는 영향 (Effect of Torch Speed and Solid Layer Thickness on Heat Transfer and Particle Deposition During modified Chemical Vapor Deposition Process)

  • 박경순;최만수
    • 대한기계학회논문집
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    • 제18권5호
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    • pp.1301-1309
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    • 1994
  • A study of heat transfer and thermophoretic particle deposition has been carried out for the Modified Chemical Vapor Deposition(MCVD) process. A new concept utilizing two torches is suggested to simulate the heating effects from repeated traversing torches. Calculation results for the wall temperatures and deposition efficiency are in good agreement with experimental data. The effects of variable properties are included and heat flux boundary condition is used to simulate the moving torch heating. A conjugate heat transfer which includes heat conduction through solid layer and heat teansfer in a gas in a tube is analyzed. Of particular interests are the effects of torch speeds and solid layer thicknesses on the deposition efficiency, rate and the tapered entry length.

Thixoforming을 위한 연주 Billet의 수평형 재가열 (Horizontal Reheating of Aluminium Alloys for Thixoforming)

  • 박상문;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 춘계학술대회 논문집
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    • pp.120-123
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    • 2001
  • The semi-solid casting will have a higher internal integrity, mechanical properties and dimensional accuracy than the conventional castings. This process can reduce the manufacturing costs and finished weight for critical components. The semi-solid casting are capable of greater dimensional repeatbility, this supplies considerable savings when extensive machining, salvage and scrap are key variables in the current automotive product. One of the most important factor regarding the semi-solid die casting process are the reheating method of the raw materials to the semi-solid state. Therefore, in this present work, the horizontal type induction heating system to obtain the optimal reheating conditions suitable for semi-solid die casting process was designed and manufactured. And the microstructure of reheated materials was investigated.

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주상복합의 실외기 형태에 따른 냉방시스템 성능 평가 (The performance evaluation of outdoor unit cooling system in a residential apartment complex)

  • 경서경;김윤진;임정희;김병선
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2008년도 추계학술발표대회 논문집
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    • pp.263-268
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    • 2008
  • In a residential complex case, the efficiency of land use are maximized, but a variation of external condition such as load in-equality, the increase in wind velocity and solar radiation by a height causes increasing energy in a building. Besides, because of increasing window size for a lighting and a view, it comes heating load in winter and cooling load in summer. A choice of cooling-system is important for this reason. Recently an internal high-rise residential complex installs an air-cooling system and operates individual heating. However, this study applies water-cooling used one public cooling-tower instead of an air-cooling system, also with an efficiency test of an air and a water-cooling system, consider an internal applicability.

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솔더 포일을 이용한 무플럭스 솔더링에 관한 연구 (A Study on Fluxless Soldering using Solder Foil)

  • 신영의;김경섭
    • Journal of Welding and Joining
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    • 제16권5호
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    • pp.100-107
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    • 1998
  • This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

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