• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• Restorative Dentistry and Endodontics
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• v.24 no.2
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• pp.265-285
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• 1999

The purposes of this investigation were to observe the reaction kinetics of five commercial dual cured resin cements (Bistite, Dual, Scotchbond, Duolink and Duo) when cured under varying thicknesses of porcelain inlays by chemical or light activation and to evaluate the effect of the porcelain disc on the rate of polymerization of dual cured resin cement during light exposure by using thermal analysis. Thermogravimetric analysis(TGA) was used to evaluate the weight change as a function of temperature during a thermal program from $25{\sim}800^{\circ}C$ at rate of $10^{\circ}C$/min and to measure inorganic filler weight %. Differential scanning calorimetry(DSC) was used to evaluate the heat of cure(${\Delta}H$), maximum rate of heat output and peak heat flow time in dual cured resin cement systems when the polymerization reaction occured by chemical cure only or by light exposure through 0mm, 1mm, 2mm and 4mm thickness of porcelain discs. In 4mm thickness of porcelain disc, the exposure time was varied from 40s to 60s to investigate the effect of the exposure time on polymerization reaction. To investigate the effect on the setting of dual cured resin cements of absorption of polymerizing light by porcelain materials used as inlays and onlays, the change of the intensity of the light attenuated by 1mm, 2mm and 4mm thickness of porcelain discs was measured using curing radiometer. The results were as follows 1. The heat of cure of resin cements was 34~60J/gm and significant differences were observed between brands (P<0.001). Inverse relationship was present between the heat of reaction and filler weight % the heat of cure decreased with increasing filler content (R=-0.967). The heat of reaction by light cure was greater than by chemical cure in Bistite, Scotchbond and Duolink(P<0.05), but there was no statistically significant difference in Dual and Duo(P>0.05). 2. The polymerization rate of chemical cure and light cure of five commercially available dual cured resin cements was found to vary greatly with brand. Setting time based on peak heat flow time was shortest in Duo during chemical cure, and shortest in Dual during light cure. Cure speed by light exposure was 5~20 times faster than by chemical cure in dual cured resin cements. The dual cured resin cements differed markedly in the ratio of light and chemical activated catalysts. 3. The peak heat flow time increased by 1.51, 1.87, and 3.24 times as light cure was done through 1mm, 2mm and 4mm thick porcelain discs. Exposure times recommended by the manufacturers were insufficient to compensate for the attenuation of light by the 4mm thick porcelain disc. 4. A strong inverse relationship was observed between peak heat flow and peak time in chemical cure(R=0.951), and a strong positive correlations hip was observed between peak heat flow and the heat of cure in light cure(R=0.928). There was no correlationship present between filler weight % or heat of cure and peak time. 5. The thermal decomposition of resin cements occured primarily between $300^{\circ}C$ and $480^{\circ}C$ with maximum decomposition rates at $335^{\circ}C$ and $440^{\circ}C$.

• Composites Research
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• v.28 no.3
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• pp.99-103
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• 2015

This paper presents the cure kinetics studies on the cure reaction of thermosetting resin. Above all, change in degree of cure and specific heat capacity according to temperature are observed using DSC and MDSC. The results are analyzed by cure kinetics and specific heat capacity model. Glass transition temperature was also measured to apply to the specific heat capacity model. Model parameters were gained from the modeling result. As a result, behavior of specific heat capacity can be calculated mathematically.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.3
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• pp.611-619
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• 1996

The purpose of this study was to evaluate the fitness of 4 kinds of resin record base materials. The record base materials used on the edentulous cast in this study were Triad VLC resin (Dentsply International Inc., U.S.A.), custom tray resin (Kerr Ltd., U.S.A.), heat-cure resin (Dentimex Co., Holland), and self-cure resin (Dentimex Co., Holland). The gap width between record base and cast were measured in the ridge crest and midpalatal area with microhardness tester. The results obtained were as follows : 1. Among the 4 kinds of record base, heat-cure Vertex fitted best on the cast. Triad and Fomatray fitted better than self-cure Vertex. Self-cure Vertex had the poorest fit. 2. The quality of the fit of the record base varied at different locations on the cast. The record base fit better in the ridge crest than midpalatal area. 3. In the midpalatal area, there's no significant difference in the fit of Fomatray, Triad and heat-cure Vertex. They all fit better than self-cure Vertex. 4. In the ridge crest, heat-cure Vertex fit better than any other record base.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.9-12
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• 2002

In this paper, N,N-m-phenyenedimaleimide (m-PDM), Polyamide Resin (PI) and Metallic dimethacrylate etc. influencing the heat resistance of anaerobic adhesive has been studied, an anaerobic adhesive composition capable of post-cure expansion and $230^{\circ}C$ temperature resistance comprising a multifunctional methacrylate and m-PDM capable of effectuating expansion upon post-cure has been developed. A homogeneous mixture of a monomer and m-PDM are subjected to a first cure heat stage (Room Temperature) wherein a rigid partially-cured plastic is formed and a post-cure heat stage ($150^{\circ}C$) to effectuate permanent expansion of cured adhesive composition.

• The Journal of Advanced Prosthodontics
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• v.1 no.1
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• pp.41-46
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• 2009

STATEMENT OF PROBLEM. The poor chemical bonding of a denture base resin to cast titanium framework often introduces adhesive failure and increases microleakage. PURPOSE. This study evaluated the shear bond strengths of a heat cure denture base resin to commercially pure titanium, Ti-6Al-4V alloy and a cobalt-chromium alloy using two adhesive primers. MATERIAL AND MATHODS. Disks of commercially pure titanium, Ti-6Al-4V alloy and a cobalt-chromium alloy were cast. Specimens without the primer were also prepared and used as the controls. The shear bond strengths were measured on a screw-driven universal testing machine. RESULTS. The primers significantly(P < .05) improved the shear bond strengths of the heat cure resin to all metals. However, the specimens primed with the Alloy $primer^{(R)}$(MDP monomer) showed higher bond strength than those primed with the MR $bond^{(R)}$(MAC-10 monomer) on titanium. Only adhesive failure was observed at the metal-resin interface in the non-primed specimens, while the primed specimens showed mixed failure of adhesive and cohesive failure. CONCLUSIONS. The use of appropriate adhesive metal primers makes it possible not only to eliminate the need for surface preparation of the metal framework before applying the heat cure resins, but also reduce the need for retentive devices on the metal substructure. In particular, the Alloy $primer^{(R)}$, which contains the phosphoric acid monomer, MDP, might be clinically more acceptable for bonding a heat cure resin to titanium than a MR $bond^{(R)}$, which contains the carboxylic acid monomer, MAC-10.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.135-147
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• 1994

This study was conducted to evaluate whether the fatigue toughness of visible light cured composite resins could be improved and how much percentage of polymerzation shrinkage could be affected by additional heat treatment. 7 materials were investigated for this study: P-50, Lite-fil CR inlay, Pekafil, Clearfil CR inlay, Clearfil photo posterior, Z -100 and Progress. Diametral tensile strengths and linear shrinkages of composite resins were taken under visible light cured and additional post-cure heated condition and compared each other. A fatigue toughness of above materials was evaluated by measuring diametral tensile strength after they were repeatedly loaded with 120kgf/$cm^2$ up to 3000 cycles. The results obtained were as follows : 1. When composite resins were cured just by visible light, Lite fil CR inlay, Z -100 and Progress showed respectively higher diametral tensile strength than the other materials. Clearfil CR inlay, Clearfil photo posterior and Progress exhibited strong fatigue toughness compared to P-50 and Pekafil. 2. Post-cure heat treated composite resins had higher diametral tensile strengths than visible light cured composite resins at fatigue toughness test as well as no fatigue toughness test. 3. When Composite resins were additionally polymerized by post-cure heat treatment, P-50 showed weak fatigue toughness, on the contrary, Clearfil CR inlay, Z-100, Progress showed strong one. 4. When composite resins were cured just by visible light, percentage of polymerization linear shrinkage was the lowerest in Clearfil CR inlay, followed by, in ascending order, Clearfil photo posterior, Lite-fil CR inlay, Progress, Pekafil, P-50, and Z-100. In the case of post- cure heat treated composite resins, percentage of linear shrinkage was the lowest in Clearfil photo posterior, followed by, in ascending order, Lite-til CR inlay, Clearfil CR inlay, Progress, P-50, Pekafil and Z-100. 5. Percentage of polymerization linear shrinkage was greater in the post-cure heat treated composite resins than in the visible light cured composite resins and linear shrinkage increased significantly in Pekafil, Clearfil CR inlay, and Clearfil photo posterior between at the visible light cured and at the post-cure heat treated condition. The above results is saying that additional post-cure heat treatment on the composite resins for posterior restoration is able to affect on improvement of strength and fatigue toughness and lead to increase polymerization of composite resins.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.38-41
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• 2000

High temperature cure characteristics of polyester resin systems were investigated by isothermal and dynamic differential scanning calorimetries. During isothermal scanning, the experimental procedure was modified to reduce the initial Boss of heat. no kinetic equation from the isothermal experiment was compared with that from the dynamic experiment.

• 연구논문집
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• s.29
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.