Journal of Adhesion and Interface (접착 및 계면)
- Volume 3 Issue 1
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- Pages.9-12
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- 2002
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- 1229-9243(pISSN)
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- 2233-8217(eISSN)
Study on Heat Resistance Anaerobic Adhesive Which Expands When Post Cured
- Zhai, Haichao (Beijing Tianshan New Materials and Technology Company) ;
- Li, Yinbai (Beijing Tianshan New Materials and Technology Company) ;
- Lin, Xinsong (Beijing Tianshan New Materials and Technology Company)
- Received : 2001.11.23
- Accepted : 2002.01.21
- Published : 2002.03.21
Abstract
In this paper, N,N-m-phenyenedimaleimide (m-PDM), Polyamide Resin (PI) and Metallic dimethacrylate etc. influencing the heat resistance of anaerobic adhesive has been studied, an anaerobic adhesive composition capable of post-cure expansion and
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