• Title/Summary/Keyword: Heat lamp

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Boron doping with fiber laser and lamp furnace heat treatment for p-a-Si:H layer for n-type solar cells

  • Kim, S.C.;Yoon, K.C.;Yi, J.S.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.322-322
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    • 2010
  • For boron doping on n-type silicon wafer, around $1,000^{\circ}C$ doping temperature is required, because of the relatively low solubility of boron in a crystalline silicon comparing to the phosphorus case. Boron doping by fiber laser annealing and lamp furnace heat treatment were carried out for the uniformly deposited p-a-Si:H layer. Since the uniformly deposited p-a-Si:H layer by cluster is highly needed to be doped with high temperature heat treatment. Amorphous silicon layer absorption range for fiber laser did not match well to be directly annealed. To improve the annealing effect, we introduce additional lamp furnace heat treatment. For p-a-Si:H layer with the ratio of $SiH_4:B_2H_6:H_2$=30:30:120, at $200^{\circ}C$, 50 W power, 0.2 Torr for 30 min. $20\;mm\;{\times}\;20\;mm$ size fiber laser cut wafers were activated by Q-switched fiber laser (1,064 nm) with different sets of power levels and periods, and for the lamp furnace annealing, $980^{\circ}C$ for 30 min heat treatment were implemented. To make the sheet resistance expectable and uniform as important processes for the $p^+$ layer on a polished n-type silicon wafer of (100) plane, the Q-switched fiber laser used. In consequence of comparing the results of lifetime measurement and sheet resistance relation, the fiber laser treatment showed the trade-offs between the lifetime and the sheet resistance as $100\;{\omega}/sq.$ and $11.8\;{\mu}s$ vs. $17\;{\omega}/sq.$ and $8.2\;{\mu}s$. Diode level device was made to confirm the electrical properties of these experimental results by measuring C-V(-F), I-V(-T) characteristics. Uniform and expectable boron heavy doped layers by fiber laser and lamp furnace are not only basic and essential conditions for the n-type crystalline silicon solar cell fabrication processes, but also the controllable doping concentration and depth can be established according to the deposition conditions of layers.

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A STUDY ON LAMP BANK DESIGN OF SOLAR SIMULATOR (솔라시뮬레이터의 램프뱅크 설계에 관한 연구)

  • Baek, S.H.
    • Journal of computational fluids engineering
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    • v.17 no.3
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    • pp.45-52
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    • 2012
  • This paper is a study on the design of the solar lamp bank which is a very important part of the solar simulator with the commercial metal halide lamps and infrared lamps. Lamp Bank is designed by the lamp bank design program based on point light source theory. The reliability of the program for lamp bank design is verified through irradiance variation experiments of a kind of lamp according to horizontal distance. Solar lamp bank facilitates heat distribution and satisfies the irradiance in the three wave length which test guidelines require. The shape of the ceiling board next to the lamp bank to promote the lamp cooling efficiency and to reduce temperature deviation and air velocity deviation in the chamber is so creative. The ceiling board of partial closed type is the best among several types.

A Thermal Flow Analysis for an Optimal shape of Solar Lamp Bank (최적의 램프뱅크형태를 결정하기 위한 열유동 해석)

  • Baek, Sang-Hwa
    • Journal of the Korean Solar Energy Society
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    • v.32 no.4
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    • pp.82-89
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    • 2012
  • This study is on the thermal flow analysis to select an optimal shape of solar lamp bank. Solar Lamp bank is designed by the lamp bank design program based on point light source theory. The reliability of the program for lamp bank design is verified through irradiance variation experiments of a kind of lamp according to horizontal distance. Solar lamp bank facilitates heat distribution and satisfies the irradiance in the three wave length which test guidelines require. Among the 4 kinds of lamp bank, since lamp bank type D satisfies uniformity ${\pm}10%$ and also doesn't exceed total irradiance 1,232 $W/m^2$, type D is finally selected.

A Study on the External Insulation of Missile Surface (미사일 외면의 열 방호 단열재 연구)

  • Park, Byeong-Yeol;Ryoo, Moon-Sam
    • Journal of the Korean Society of Propulsion Engineers
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    • v.10 no.3
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    • pp.53-59
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    • 2006
  • This paper presents the IR-Lamp test results of evaluating heat protection performance and measuring of mechanical/thermal properties in the heat protection material of missile external surface. The results showed that increasing the contents of microballoons improved the heat protection performance, but the mechanical properties were deteriorated. Among the kinds of microballoons, Epoxy/Phenolic Microballoons mixture showed the best mechanical properties and low thermal conductivity. Epoxy/Cork mixture showed the best heat protection in the IR-Lamp test, though it has low mechanical properties and high thermal conductivity.

Cause Investigation and Verification of Fire Accidents for Road and Street Lighting (가로등 화재사고의 원인규명과 검증)

  • Shong, Kil-Mok;Han, Woon-Ki;Kim, Jong-Min;Kim, Young-Seok;Kim, Myoung-Soo;Kim, Hyeok-Soo
    • Journal of Korean Institute of Fire Investigation
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    • v.11 no.1
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    • pp.31-36
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    • 2008
  • This paper carried out a variety of analysis for a finding out the causes of fire on the street lamp. The glass bulb of 250W metal-halide(MH) lamps attached with the impurities rose the temperature by at $410.4^{\circ}$ in normal condition. Therefore, a lamp apparatus is needed the improvement for ventilation and the protection against dust. The heat of MH lamps is diffused through out the luminous tube, a glass bulb, and apparatus by degrees. The accident cause of the lamp is presumed that the accumulated heat by deposits of the inner part. It will be recommended the improvement of the structure that aren't the external impurity and accumulated heat in the MH lamps set.

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Temperature Control for LED Lamps Using RF Communication (RF통신을 이용한 LED 조명의 온도제어)

  • Choi, Hyeung-Sik;Shin, Hee-Young;Oh, Ji-Youn;Lee, Sang-Seop
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.10
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    • pp.759-765
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    • 2012
  • In this paper, a temperature control for LED (light emitting diode) lamp using a cooling fan is studied. An efficient temperature control scheme for the LED lamp using the fan wind at the lowest sound noise is studied. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan with various size of heat sinks was performed. To reduce the fan sound noise, a method of reducing the operation time with optimal size of the heat sink was studied. Also, a control of LED lamps using RF communication was studied.

Numerical Study on Combined Heat Transfer in NIR Dryer for Agricultural and Marine Products (근적외선 농수산물 건조기의 복합열전달특성에 관한 수치적 연구)

  • Choi, H.K.
    • Journal of Biosystems Engineering
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    • v.31 no.5 s.118
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    • pp.395-402
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    • 2006
  • Mixed heat transfer in an indirected NIR (Near Infrared Ray) dry chamber was investigated numerical analysis. It is Important that the miked heat transfer effects on double parameters which the Reynolds number and the position of emit lamp. Reynolds number are based on the outer diameter of the cylinder range from 103 to $30{\times}105$. Four difference heat transfer regimes of behavior are apparent: forced convection and radiation on the outer surface of the cylinder, pure conduction, pure natural convection and radiation between lamp surface and inner surface of the cylinder. The temperature and flow patterns are illustrated by iso-contour lines for the double parameters. Also presented are results on the convective heat transfer flux and the radiative heat transfer flux as increased with Reynolds number.

LED Headlamp Thermal Characteristics by Looped Heat Pipe (루프형 히트파이프를 이용한 LED 헤드램프 열적 특성)

  • Noh H.C.;Park K.S.;Kang B.D.;Son S.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.443-444
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    • 2006
  • The influence of the heat sources on LED junction temperature are Engine room air, Back plate, Electric power device, and so on. LED lamp cooling system is considered to be an important subject fur high light efficiency. Because LED Chip will be problem When LED junction temperature be over $135^{\circ}C$, In this Study, The Looped Heat Pipe System is considered to prevent LED Chip fall. The LHPS is consist of evaporator part, condenser part, heat pipe part. The working fluid of LHPS is HCFC-123. In this study, to prevent LED Chipfall, we study thermal characteristics for Looped Heat Pipe System with LED lamp.

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Analyze on Heat-sink of 20Watt Class LED Lamp using COMSOL (COMSOL을 이용한 20W급 LED램프의 방열 해석)

  • Eo, Ik-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.7
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    • pp.1484-1488
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    • 2009
  • This thesis is about Heat-sink design which is considered as the biggest problems for commercialization of LED lighting and suggests how to solve the problems though analysis on heat-sink using COMSOL. The temperature difference after simulation value and modelling was $10^{\circ}C$by Transient analysis of Heat Transfer Module which is in the COMSOL Multiphysics. The result approximated the object which is close to actual lighting, when various elements are used according to temperature change of interior and exterior surroundings LED lighting is set up.