• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.176-176
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• 2012

본 연구는 GaN 기반의 전자소자의 표면 패시베이션 방법으로 열산화 공정을 이용한 알루미늄산화막 패시베이션 공정에 대하여 연구하였다. 결정질의 알루미늄산화물은 경도가 크고 화학적으로 안정적이기 때문에 외부 오염에 대한 소자 표면을 효과적으로 보호할 수 있으며, 열적안정성이 뛰어나 공정중 또는 공정 후의 고온 환경에서의 열 손상이 적은 장점을 가진다. 결정질 알루미늄산화막($Al_2O_3$)을 소자 표면에 형성하기 위해서 일반적으로 TMA (trimethlyaluminium)와 오존($O_3$)가스를 이용한 ALD 공정법이 사용되고 있으나 공정 비용이 비싸고 열산화막에 비해 전자 trapping이 많이 발생하여 전자이동도가 저하되는 단점이 있어, 본 연구에서는 열산화 공정을 이용하여 소자의 전기적 특성 저하를 발생시키지 않는 알루미늄산화막 패시베이션을 수행하였다. 실험에 사용된 기판은 AlGaN/GaN 이종접합 구조가 증착된 HEMT 제작용 기판을 사용하였으며 TLM 구조를 제작하여 소자의 채널 면저항 및 절연영역간 누설전류 특성을 확인하였다. TLM 구조가 제작된 샘플 위에 알루미늄을 100 ${\AA}$ 두께로 소자위에 증착하고 $O_2$ 분위기에서 약 $525{\sim}675^{\circ}C$ 온도로 3분간 열처리하여 알루미늄 산화막을 형성한 후 $950^{\circ}C$ 온도로 $N_2$ 분위기에서 30초간 안정화열처리 하여 안정한 알루미늄 산화막 패시베이션을 형성하였다. 알루미늄산화막 패시베이션 후 소자의 절연영역 사이의 누설전류는 패시베이션 전과 비슷한 크기를 나타냈고 패시베이션 후 채널의 면저항이 패시베이션 전에 비해 약 20% 감소한 것을 확인하였다. 또한 패시베이션된 소자와 패시베이션되지않은 소자에 대해 $900^{\circ}C$ 온도로 30초간 열처리한 결과 패시베이션 되지 않은 소자는 74%만큼 채널 면저항이 증가하였으며, 절연영역 누설전류가 다섯오더 크기로 증가한 반면 알루미늄산화막 패시베이션한 소자는 단지 13%의 채널 면저항의 증가를 나타내었고 절연영역 누설전류는 100배 감소한 값을 보여 알루미늄산화막 패시베이션이 소자의 열적 안정성을 향상시키는 것을 확인하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.12
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• pp.103-112
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• 2005

In this paper, in order to derive the current-voltage characteristics of n-AlGaN/GaN HEMTs with the piezoelectric and spontaneous polarizations, we suggested analytical solutions for the two-dimensional Poisson equation in the AlGaN and GaN regions by taking into account the longitudinal field variation, field-dependent mobility, and the continuity condition of the channel current flowing in the quantum well. Obtained expressions for long and short channel devices would be applicable to the entire operating regions in a unified manner. Simulation results show that the drain saturation current increases and the cutoff voltage decreases as drain voltage increases. Compared with the conventional models, the present model seems to provide more reasonable explanation for the drain-induced threshold voltage roll-off and the channel length modulation effect.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.339-342
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• 2004

본 논문은 밀리미터파 대역 무선통신 시스템 송신부의 응용을 위해 CPW 구조를 이용하여 V-band용 상향 주파수 혼합기와 2단 구동증폭기를 설계$\cdot$제작하였다. 능동소자는 본 연구실에서 제작한 $0.1{\mu}m$ 게이트 GaAs Pseudomorphic HEMTs(PHEMTs)를 사용하였으며 입$\cdot$출력단은 CPW를 사용해 정합 회로를 설계하였다. 제작된 상향 주파수 혼합기는 LO power 5.4 dBm, 2.4 GHz IF 신호를 -10.25 dBm으로 입력하였을 때 Conversion Loss 1.25 dB, LO-to-RF Isolation은 58 GHz에서 13.2 dB의 특성을 나타내었다 2단 구동 증폭기는 측정결과 60 GHz에서 S21 이득 13 dB, $58\;GHz\;\~\;64\;GHz$ 대역에서 S21 이득 12 dB 이상을 유지하는 광대역 특성을 얻었고 증폭기의 Pl dB는 3.8 dBm, 최대 출력전력은 6.5 dBm의 특성을 얻었다.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.857-860
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• 2005

We reported 94 GHz, low conversion loss, and high isolation single balanced active-gate mixer based on 70 nm gate length InGaAs/InAlAs metamorphic high electron mobility transistors (MHEMTs). This mixer showed that the conversion loss and isolation characteristics were 2.5 ${\sim}$ 2.8 dB and under -30 dB, respectively, in the range of 93.65 ${\sim}$ 94.25 GHz. The low conversion loss of the mixer is mainly attributed to the high-performance of the MHEMTs exhibiting a maximum drain current density of 607 mA/mm, a extrinsic transconductance of 1015 mS/mm, a current gain cutoff frequency ($f_t$) of 330 GHz, and a maximum oscillation frequency ($f_{max}$) of 425 GHz. High isolation characteristics are due to hybrid ring coupler which adopted dielectric-supported air-gapped microstrip line (DAML) structure using surface micromachined technology. To our knowledge, these results are the best performance demonstrated from 94 GHz single balanced mixer utilizing GaAs-based HEMTs in terms of conversion loss as well as isolation characteristics.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.62-62
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• 2015

In this study, we study the effects of CF4 plasma treatment on the characteristics of enhancement mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs). The CF4 plasma is generated by inductively coupled plasma reactive ion etching (ICP-RIE) system. The CF4 gas is decomposed into fluorine ions by ICP-RIE and then fluorine ions will effect the AlGaN/GaN interface to inhibit the electron transport of two dimension electron gas (2DEG) and increase channel resistance. The CF4 plasma method neither like the recessed type which have to utilize Cl2/BCl3 to etch semiconductor layer nor ion implantation needed high power to implant ions into semiconductor. Both of techniques will cause semiconductor damage. In the experiment, the CF4 treatment time are 0, 50, 100, 150, 200 and 250 seconds. It was found that the devices treated 100 seconds showed best electric performance. In order to prove fluorine ions existing and CF4 plasma treatment not etch epitaxial layer, the secondary ion mass spectrometer confirmed fluorine ions truly existing in the sample which treatment time 100 seconds. Moreover, transmission electron microscopy showed that the sample treated time 100 seconds did not have etch phenomena. Atomic layer deposition is used to grow Al2O3 with thickness 10, 20, 30 and 40 nm. In electrical measurement, the device that deposited 20-nm-thickness Al2O3 showed excellent current ability, the forward saturation current of 210 mA/mm, transconductance (gm) of 44.1 mS/mm and threshold voltage of 2.28 V, ION/IOFF reach to 108. As IV concerning the breakdown voltage measurement, all kinds of samples can reach to 1450 V.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.7 s.110
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• pp.659-664
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• 2006

This paper reports a high power 60 GHz push-push oscillator fabricated using $0.12{\mu}m$ metamorphic high electron-mobility transistors(mHEMTs). The devices with a $0.12{\mu}m$ gate-length exhibited good DC and RF characteristics such as a maximum drain current of 700 mA/mm, a peak gm of 660 mS/mm, an $f_T$ of 170 GHz, and an $f_{MAX}$ of more than 300 GHz. By combining two sub-oscillators having $6{\times}50{\mu}m$ periphery mHEMT, the push-push oscillator achieved a 6.3 dBm of output power at 59.5 GHz with more than - 35 dBc fundamental suppression. The phase noise of - 81.5 dBc/Hz at 1 MHz offset was measured. This is one of the highest output power obtained using mHEMT technology without buffer amplifier, and demonstrates the potential of mHEMT technology for cost effective millimeter-wave commercial applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.62-62
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• 2003

고밀도 유도결합 플라즈마(high density inductively coupled plasma) 식각은 GaAs 이종접합 양극성 트랜지스터(HBTs)와 고속전자 이동도 트랜지스터(HEMTs)와 같은 GaAs 기반 반도체의 정교한 패턴을 형성하는데 더욱 많이 이용되고 있다 본 연구는 고밀도 플라즈마 소스(source)인 평판형(planar) 고밀도 유도결합 플라즈마 식각장치를 이용하여 $BCl_3$ 와 $BCl_3/Ar$ 가스에 따른 GaAs 식각결과를 비교 분석하였다. 공정변수는 ICP 소스 파워를 0-500W, RIE 척(chuck) 파워를 0-150W, 공정압력을 0-15 mTorr 이었다. 그리고 가스 유량은 20sccm(standard cubic centimeter per minute)으로 고정시킨 상태에서 Ar 첨가 비율에 따른 GaAs의 식각결과를 관찰하였다. 공정 결과는 식각률(etch rate), GaAs 대 PR의 선택도(selectivity), 표면 거칠기(roughness)와 식각후 표면에 남아 있는 잔류 가스등을 분석하였다. 20 $BCl_3$ 플라즈마를 이용한 GaAs 식각률 보다 Ar이 첨가된 (20-x) $BC1_3/x Ar$ 플라즈마의 식각률이 더 우수하다는 것을 알 수 있었다. 식각률 증가는 Ar 가스의 첨가로 인한 GaAs 반도체와 Ar 플라즈마의 충돌로 나타난 결과로 예측된다. $BCl_3$ 와 $BC1_3/Ar$ 플라즈마에 노출된 GaAs 반도체 모두 표면이 평탄하였고 수직 측벽도 또한 우수하였다. 그리고 표면에 잔류하는 성분은 Ga와 As 이외에 $Cl_2$ 계열의 불순물이 거의 발견되지 않아 매우 깨끗함을 확인하였다. 이번 발표에서는 $BCl_3$ 와 $BCl_3/Ar$ 플라즈마를 이용한 GaAs의 건식식각 비교에 대해 상세하게 보고 할 것이다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.3
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• pp.34-38
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• 2000

This paper describes design, fabrication, and performance of an ultra-high-speed and low-noise MMIC (Monolithic Microwave Integrated Circuit) preamplifier for a 10 Gb/s optical receiver. The transimpedance type 3-stage MMIC preamplifier for ultra-high-speed and low-noise was designed using an AlGaAs/InGaAs/GaAs P-HEMTs(Pseudomorphic High Electron Mobility Transistors) with 0.15${\mu}{\textrm}{m}$ length T-shaped gate. To obtain broadband characteristics, we used the inductor peaking technique, and the gate width was optimized for low noise performance. Measurements reveal that the fabricated preamplifier has the high transimpedance gain of 60 ㏈Ω and 9.15 ㎓ bandwidth with the noise figure of less than 3.9 ㏈.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.705-711
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• 2003

In this Paper, 2${\times}$100 $\mu\textrm{m}$ AlCaN/GaN HEMT's(on sapphire substrate) large signal model including thermal effect was extracted. An equation based empirical model was employed to make large signal model for convergence and high speed. Pulsed I-V measurement was performed to extract thermal resistance and capacitance. Power amplifiers with 9 mm and 15 mm AlCaN/GaN HEMTS were designed using scaled modeling results of 2${\times}$100 $\mu\textrm{m}$ device respectively. From comparisons between measured and simulated data, the model considering of thermal effects gave better agreement than without one. It demonstrates that thermal modeling must be performed for power amplifier that uses large size transistors.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.12
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• pp.10-16
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• 2003

To analyze the effects of the air-bridge parasitic capacitances on the performance of coplanar waveguide pseudomorphic high electron mobility transistors (CPW PHEMTs), the gate-to-air-bridge ( $C_{ag}$ ) and the drain-to air-bridge ( $C_{ad}$ ) capacitances were taken into account plus the conventional pinched-off cold. FET circuit model. To examine the effects of the parasitic capacitances due to the air-bridges, a variety routing schemes for the air-bridge interconnection were adopted for fabricating the 0.1-${\mu}{\textrm}{m}$ $\Gamma$-gate length CPW HEMT's. According to air-bridge schemes, the $S_{21}$ gain is affected considerably. From the results of the fabricated CPW PHEMT, the $C_{ag}$ and $C_{ad}$ is one of the important factor of decreasing the gain of HEMTs.