• 제목/요약/키워드: H-bonding

검색결과 897건 처리시간 0.032초

전자회전공명 플라즈마를 이용한 a-C:H 박막의 특성 연구 (The Study on Characteristics of a-C:H Films Deposited by ECR Plasma)

  • 김인수;장익훈;손영호
    • 한국산업정보학회:학술대회논문집
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    • 한국산업정보학회 2001년도 춘계학술대회논문집:21세기 신지식정보의 창출
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    • pp.224-231
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    • 2001

  • 2.45 GHz 마이크로웨이브를 사용하는 전자회전공명 플라즈마를 이용하여 화학적 기상증착(electron cyclotron resonance plasma enhanced chemical vapor deposition; ECR-PECVD) 방법으로 ECR 마이크로웨이브 power, CH$_4$/H$_2$가스 혼합비와 유량, 증착시간, 그리고 기판 bias 전압 등을 변화시켜 가면서 수소가 함유된 비정질 탄소(a-C:H) 박막을 증착하였고, 증착시킨 박막의 특성을 AES(Auger electron spectroscopy), ERDA(elastic recoil detection analysis), FTIR(Fourier transform infrared) 및 Raman 측정 등으로 조사하였다. 증착시킨 a-C:H 박막은 탄소 및 수소원소들로만 구성되어 있음을 AES 측정으로 확인하였다. 그리고 FTIR 측정으로부터 a-C:H 박막은 대부분 sp$^3$결합을 하고 있고 일부는 sp$^2$결합을 하고 있음을 확인하였으며, CH$_4$/H$_2$가스 혼합비와 유량의 변화가 a-C:H 박막의 탄소와 수소의 결합구조에 큰 영향을 미치지 않았으며, 다만 증착시간이 증가할수록 탄소와 수소 원자들의 결합구조가 $CH_3$구조에서 CH$_2$나 CH 구조로 변하고 있음을 알았다. 또한 Raman 스펙트럼의 Gaussian curve fitting을 통하여 sp$^3$/sp$^2$의 결합수에 비례하는 D 및 G peak의 면적 강도비(I$_{D}$/l$_{G}$)는 기판 bias 전압을 증가시킬수록 증가하였으며, 경도도 역시 증가하였다.하였다.

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Theoretical Investigation of Triple Bonding between Transition Metal and Main Group Elements in (η5-C5H5)(CO)2M≡ER (M = Cr, Mo, W; E = Si, Ge, Sn, Pb; R = Terphenyl Groups)

  • Takagi, Nozomi;Yamazaki, Kentaro;Nagase, Shigeru
    • Bulletin of the Korean Chemical Society
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    • 제24권6호
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    • pp.832-836
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    • 2003

  • To extend the knowledge of triple bonding between group 6 transition metal and heavier group 14 elements, the structural and bonding aspects of ($η^5-C_5H_5$)$(CO)_2$M≡ER (M = Cr, Mo, W; E = Si, Ge, Sn, Pb) are investigated by hybrid density functional calculations at the B3PW91 level. Substituent effects are also investigated with R = H, Me, $SiH_3$, Ph, $C_6H_3-2,6-Ph_2$, $C_6H_3-2,6-(C_6H_2-2,4,6-Me_3)_2$, and $C_6H_3-2,6-(C_6H_2-2,4,6- iPr_3)_2$.

  • https://doi.org/10.5012/bkcs.2003.24.6.832 인용 PDF KSCI

EMTP를 이용한 지중케이블의 도체 연가 영향 분석 (EMTP-analysis of Transposition Effects on Underground Transmission Cables)

  • 하체웅;한성흠;허회덕;이인호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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    • pp.93-94
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    • 2006

  • The sheath of a single-conductor cable for ac service acts as a secondary of a transformer, the current in the conductor induces a voltage in the sheath. When the sheaths of single-conductor cables are bonded to each other, as is common practice for multi-conductor cables, the induced voltage causes current to flow in the completed circuit. This current causes losses in the sheath. Various methods of bonding may be used for the purpose of minimizing sheath losses. In korea, sheath cross bonding system was employed for the prevention of sheath losses, the sheaths wire subjected to at voltages, and the bonding was designed to keep the magnitude of the induced voltages within small limits so as to prevent the possibility of sheath corrosion. But, sheath cross bonding system without transposition of cable can not achieve an exact balance of induced sheath voltages unless the cables are lain in trefoil. This paper describes a transposition system with sheath cross bonding using EMTP(Electromagnetic Transient Program). The transposition system with cross bonding can be extended to longer cable circuits for laid in flat as wall as trefoil by the methods described in this paper.

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Hydrogen Bonding Analysis of Hydroxyl Groups in Glucose Aqueous Solutions by a Molecular Dynamics Simulation Study

  • Chen, Cong;Li, Wei Zhong;Song, Yong Chen;Weng, Lin Dong;Zhang, Ning
    • Bulletin of the Korean Chemical Society
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    • 제33권7호
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    • pp.2238-2246
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    • 2012

  • Molecular dynamics simulations have been performed to investigate hydrogen bonding characteristics of hydroxyl groups in glucose aqueous solutions with different concentrations. The hydrogen bonding abilities and strength of different O and H atom types have been calculated and compared. The acceptor/donor efficiencies have been predicted and it has been found that: (1) O2-HO2 and O3-HO3 are more efficient intramolecular hydrogen bonding acceptors than donors; (2) O1-HO1, O4-HO4 and O6-HO6 are more efficient intramolecular hydrogen bonding donors than acceptors; (5) O1-HO1 and O6-HO6 are more efficient intermolecular hydrogen bonding acceptors than donors while hydroxyl groups O2-HO2 and O4-HO4 are more efficient intermolecular hydrogen bonding donors than acceptors. The hydrogen bonding abilities of hydroxyl groups revealed that: (1) the hydrogen bonding ability of OH2-$H_w$ is larger than that of hydroxyl groups in glucose; (2) among the hydroxyl groups in glucose, the hydrogen bonding ability of O6-HO6 is the largest and the hydrogen bonding ability of O4-HO4 is the smallest; (3) the intermolecular hydrogen bonding ability of O6-HO6 is the largest; (4) the order for intramolecular hydrogen bonding abilities (from large to small) is O2-HO2, O1-HO1, O3-HO3, O6-HO6 and O4-HO4.

  • https://doi.org/10.5012/bkcs.2012.33.7.2238 인용 PDF KSCI