• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1238_1239
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• 2009

본 논문에서는 ELA poly-Si TFT보다 뛰어난 균일도를 갖고, a-Si:H TFT보다 전기적 안정도가 우수한 PMOS SPC-Si TFT의 특성을 연구하였다. SPC-Si의 계면 특성을 향상 시키기 위해 $SiO_2$ 게이트 절연막을 증착하기 전에 Solid Phase Crystalline 실리콘(SPC-Si) 채널 영역에 다양한 H2 플라즈마 처리를 해주었다. PECVD를 이용하여 100W에서 H2 플라즈마 처리를 5분 해주었을 때 SPC-Si TFT의 전기적 특성이 향상되는 것을 볼 수 있는데, $V_{TH}$가 약 -3.91V, field effect mobility가 $22.68cm^2$/Vs, 그리고 Subthreshold swing이 0.64 정도를 보였다. 또한 소자에 Hot carrier stress($V_{GS}$=14.91V, $V_{DS}$=-15V, for 2,000sec)를 주었을 때도 전기적 특성이 변하지 않았으며, 일정한 bias stress($V_{GS}$=-15V, $V_{DS}$=-10V, for 2,000sec)를 가하였을 때도 $V_{TH}$가 증가하지 않았다. 이러한 결과를 통해 SPC-Si가 poly-Si TFT보다 더욱 안정함을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.115-118
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• 2017

Highly photosensitive and wide bandgap amorphous silicon oxide (a-$SiO_x$:H) films were developed at low temperature ranges ($100{\sim}150^{\circ}C$) with employing plasma-enhanced chemical vapor deposition by optimizing $H_2/SiH_4$ gas ratio and $CO_2$ flow. Photosensitivity more than $10^5$ and wide bandgap (1.81~1.85 eV) properties were used for making the a-$SiO_x$:H thin film solar cells, which exhibited a high open circuit voltage of 0.987 V at the substrate temperature of $100^{\circ}C$. In addition, a power conversion efficiency of 6.87% for the cell could be improved up to 7.77% by employing a new n-type nc-$SiO_x$:H/ZnO:Al/Ag triple back-reflector that offers better short circuit currents in the thin film photovoltaic devices.

• Korean Journal of Materials Research
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• v.1 no.4
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• pp.177-183
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• 1991

Change of the properties of selective CVD-W by $SiH_4$ reduction with the variation of deposition time and pressure has been investigated. The lime required for covering the who)to Si substrate by tungsten at $300^{\circ}C$ under the pressure of 100mtorr is approximately 30 seconds. The film thickness tends to increase linearly in the early stage of deposition process and parabolically later, sheer resistance of the film tends to decrease rapidly initially, and slowly later with deposition time. Tungsten grain size does not change much, but grain boundary becomes hazy in the pressure range of 50-300mtorr. Also no ${\beta}-W$ but only ${\alpha}-W$ was found in this pressure range. The deposition rate and electrical resistivity of tungsten tend to increase wish increasing pressure. The results of AES analysis show that pressure does not much affect Si/W ratio of the tungsten film and silicidation at the W/Si interface.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1592-1594
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• 2003

This paper presents the deposition and characterization of microcrystalline silicon(${\mu}c$-Si:H) films by HWCVD(Hot-wire Chemical Vapor Deposition) method at low substrate($300^{\circ}C$). The filament temperature, pressure and $SiH_4$ concentration were determined to be a critical parameter for the deposition of poly-Si films. Series A was deposited under the conditions of $1380^{\circ}C$(Tf), 100 mTorr and $2{\sim}10%\{SC:SiH_4/(SiH_4+H_2)\}$ for 60 min. Series B was deposited under the conditions of $1400{\sim}1450^{\circ}(T_f)$, 30 mTorr and $2{\sim}12%$(SC) for 60 min. The physical characteristics were measured by Raman and FTIR spectroscopy, dark and photoconductivity measurements under AM1.5 illumination.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.134-135
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• 2007

Growth of cubic SiC has been carried out on oxided Si substrate using atmospheric pressure chemical vapor deposition (APCVD). Hexamethyldisilane (HMDS) was used as the single precursor and nonflammable mixture of Ar and $H_2$ was used as carrier gas. Epitaxial growth had performed depositions under the various $H_2$ conditions which were adjusted from 0 to 100 seem. The effects of $H_2$ was characterized by surface roughness, thickness uniformity, films quality and elastic modulus. Thickness uniformity and films quality were performed by SEM. Surface roughness and elastic modulus were investigated by AFM and Nano-indentor, respectively. According to the $H_2$ flow rate, Poly 3C-SiC thin film quality was improved not only physical but also mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.57-58
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• 2008

Microcrystalline (${\mu}c$) silicon thin films were prepared on glass by plasma-enhanced-chemical-vapor-deposition (PECVD) at various substrate temperature, and dilution ratio of $H_2$ with $SiH_4$. The structural and optical properties of. the ${\mu}c-Si$ thin films were investigated using XRD and UV-VIS spectrophotometer. The ${\mu}c-Si$ thin film with 42 nm grain size was grown at optimal condition of 2.5 Torr, spacing between electrodes of 3cm, deposition time of 3000s, RF power of 200W, substrate temperature of $350^{\circ}C$, $SiH_4$ ($20%SiH_4$+80%He) of 50sccm, and $H_2$ of 100sccm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.238-242
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• 2001

In this paper, the current-voltage characteristics of a 4H-SiC MESFET is simulated by using the Atlas Simulation tool. we are able to use the simulator to extract more information about the new material 4H-SiC, including the mobility, velocity-field Curve and the Schottky barrier height. We have enabled and used the new simulator to investigate breakdown Voltage and thus predict operation limitiations of 4H-SiC device. Modeling results indicate that the Breakdown Voltage is 197 V and Current is 100 mA

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.238-242
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• 2001

In this paper, the current-voltage characteristics of a 4H-SiC MESFET is simulated by using the Atlas Simulation tool. we are able to use the simulator to extract more information about the new material 4H-SiC, including the mobility, velocity-field Curve and the Schottky barrier height. We have enabled and used the new simulator to investigate breakdown Voltage and thus predict operation limitations of 4H-SiC device. Modeling results indicate that the Breakdown Voltage is 197 V and Current is 100 mA

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.477-480
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• 2002

Si-O-C(-H) thin film with a tow dielectric constant were deposited on a P-type Si(100) substrate by an inductively coupled plasma chemical vapor deposition (ICPCVD). Bis-trimethylsilymethane (BTMSM, H$_{9}$C$_3$-Si-CH$_2$-Si-C$_3$H$_{9}$) and oxygen gas were used as Precursor. Hybrid type Si-O-C(-H) thin films with organic material have been generated many voids after annealing. Consequently, the Si-O-C(-H) films can be made a low dielectric material by the effect of void. The surface characterization of Si-O-C(-H) thin films were performed by SEM(scanning electron microscope). The characteristic analysis of Si-O-C(-H) thin films were performed by X-ray photoelectron spectroscopy (XPS).

• Proceedings of the Korean Vacuum Society Conference
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• 2007.08a
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• pp.382-382
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• 2007