• Journal of Magnetics
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• v.15 no.1
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• pp.32-35
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• 2010

The effects of Cu-addition and die-upset temperature on the texture in the die-upset Nd-lean $Nd_xFe_{93.5-(x+y)}-Cu_yGa_{0.5}B_6$ (x = 9-12, y = 0-2) alloys were investigated. The die-upset Cu-containing Nd-lean $Nd_{12}Fe_{81.5-y}-Cu_yGa_{0.5}B_6$ (y = 1, 2) alloys showed a considerable texture. Texture in the Nd-lean alloys developed through basal plane slip deformation. The Cu-addition reduced the melting point of grain boundary phase facilitating grain gliding during the die-upsetting, and providing a greater chance for the $Nd_2Fe_{14}B$ grains to meet the deformation conditions. Die-upsetting at higher temperature facilitated grain gliding and plastic deformation, thus enhancing texture.

• Nuclear Engineering and Technology
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• v.37 no.4
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• pp.299-308
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• 2005

The behavior of fission gas in all major types of nuclear fuel has been reviewed with an emphasis on more recently discovered aspects. It is proposed that the behavior of fission gas can be classified in a number of characteristic types that occur at a high or low operating temperature, and/or at high or low fissile burnup. The crystal structure and microstructure of the various fuels are the determinant factors in the proposed classification scheme. Three types of behavior, characterized by anisotropic $\alpha$-U, high temperature metallic $\gamma$-U, and cubic ceramics, are well-known and have been extensively studied in the literature. Less widely known are two equally typical low temperature kinds: one associated with fission induced grain refinement and the other with fission induced amorphization. Grain refinement is seen in crystalline fuel irradiated to high burnup at low temperatures, whereas breakaway swelling is observed in amorphous fuel containing sufficient excess free-volume. Amorphous fuel, however, shows stable swelling if insufficient excess free-volume is available during irradiation.

• Proceedings of the Korean Nuclear Society Conference
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• 1997.05b
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• pp.123-128
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• 1997

The effects of heat treatment on fatigue crack growth rates (FCGRs) of Inconel 690 have been investigated in terms of carbide morphology and grain size. Cycling tests in air at room temperature have shown that FCGR in low stress intensity factor range (ΔK) region can be effectively reduced by increasing the grain boundary carbide precipitate size and grain size. Decrease in FCGR is attributed to the crack tip blunting at the precipitates of grain boundary chromium carbides.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.31 no.3
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• pp.311-317
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• 1986

To obtain the basic informations on the variation of rice grain shattering under different environmental conditions, several experiments were carried out from 1982 to 1985. The degree of grain shattering was significantly differed depending upon the harvesting time after heading in some rice varieties. It appeared that the ratio of grain shattering was greatly affected by the drying period after harvesting; the ratio of grain shattering of sun-dried seeds for 6 days after harvesting was higher than those of the just harvested seeds. Grain shattering was increased at high level of nitrogen and decreased with delay in transplanting date. Yearly differences in grain shattering was more clearly recognized in easy-shattering varieties in comparison with those of non-shattering varieties. Rice grain shattering also increased by the low temperature treatment (l7/15$^{\circ}C$, day/night) at booting stage, 5 to 11 days before heading. A rice variety, Milyang 23, belong to easy shattering group was more pronounced at the low temperature condition with shading. In general, it was always possible to classify the cultivar differences between easy-shattering and non-shattering groups regardless of any environmental condition. Thus results suggested that rice grain shattering will be largely governed by genetic factors.

• Journal of Biosystems Engineering
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• v.26 no.5
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• pp.449-460
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• 2001

This study was carried out to develop a simulation model with EES(Engineering equation solver) for analyzing the performance of a grain cooler. In order to validate the developed simulation model, several main factors which have affected on the performance of the gain cooler were investigated through experiments. A simulation model was developed in the standard vapor compression cycle, and then this model was modified considering irreversibe factors so that the developed alternate model could predict the actual cycle of a grain cooler. The compressor efficiency in vapor compression cycle considering irreversibility much affected on the coefficient of performance(COP). The COP in the standard vapor compression cycle model was greatly as high as about 6.50, but the COP in an alternative model considering irreversibility was as low as about 3.27. As a result of comparison between the actual cycle and the vapor compression cycle considering irreversibility, the difference of pressure at compressor outlet(inlet) was a little by about 48kPa (8.8kPa), the temperatures of refrigerant at main parts of the grain cooler were similar. and the temperature of chilled air was about 8$\^{C}$ in both. The model considering irreversibility could predict performance of the grain cooler. The theoretical period required to chill grain of 1,383kg from the initial temperature 24$\^{C}$ to below 11$\^{C}$ was about 55 hours 30 minutes, and the actual period required in a grain bin was about 58 hours. The difference between the predicted and an actual period was about 2 hours 30 minutes. The cooling performance predicted by the developed model could well estimate the cooling period required to chill the grain.

• Journal of Korea Foundry Society
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• v.22 no.3
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• pp.109-113
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• 2002

A good fluidity of high strength Al-alloys is required to cast thin wall castings needed to reduce the weight of cast parts. The fluidity, measured as the length to which the metal flows in a standard channel, is affected by many factors, such as the pouring temperature, solidification type of the alloy, the channel thickness, melt head, mold materials and temperature, coating etc. Therefore the experimentally measured fluidity scatters very much and makes it difficult to estimate the fluidity of a melt with a few measurements. The effect of Ti content and grain refinement on the fluidity of high strength aluminum alloy was investigated with a test casting with 8 thin flow channels to reduce the scattering of the fluidity results. The fluidity of Al-4.8%Cu-0.6%Mn Al-6.2%Zn-1.6%Mg-1.0%Cu and well-known commercial aluminum alloy, A356 was tested. Initial content of Ti was varied from 0 to 0.2wt% and Al-5Ti-B master alloy was added for grain refinement. The flow length varied linearly with superheat. By adding Ti and Al-5Ti-B, the fluidity increased. The grain size decreased by adding grain refiner at the same time. The fluidity depended on the degree of grain refinement. The fluidity of the alloy solidifying in mushy type is improved by grain refinement, because grain refinement increases the solid fraction at the time of flow stoppage.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.6
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• pp.235-240
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• 2003

In this paper, we present the fabrication and the characteristic analysis of sequential lateral solidification(SLS) poly-Si thin film transistors(TFT's) with molybdenum gate for active matrix liquid displays (AMLCD's) pixel controlling devices. The molybdenum gate is applied for the purpose of low temperature processing. The maximum processing temperature is 55$0^{\circ}C$ at the dopant thermal annealing step. The SLS processed poly-Si film which is reduced grain and grain boundary effect, is applied for the purpose of electrical characteristics improvements of poly-Si TFT's. The fabricated low temperature SLS poly-Si TFT's had a varying the channel length and width from 10${\mu}{\textrm}{m}$ to 2${\mu}{\textrm}{m}$. And to analyze these devices, extract electrical characteristic parameters (field effect mobility, threshold voltage, subthreshold slope, on off current etc) from current-voltage transfer characteristics curve. The extract electrical characteristic of fabricated low temperature SLS poly-Si TFT's showed the mobility of 100~400cm$^2$/Vs, the off current of about 100pA, and the on/off current ratio of about $10^7$. Also, we observed that the change of grain boundary according to varying channel length is dominant for the change of electrical characteristics more than the change of grain boundary according to varying channel width. Hereby, we comprehend well the characteristics of SLS processed poly-Si TFT's witch is recrystallized to channel length direction.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.6
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• pp.263-269
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• 2019

The mechanism of microstructure and hardness changes during mill annealing of Ti-6Al-4V alloy was investigated. The annealing heat treatments were performed at $675{\sim}795^{\circ}C$ in vacuum for 2 hours, followed by air cooling. The microstructure was observed by using an optical microscope and X-ray diffraction, and hardness was measured by using a Rockwell hardness tester and micro Vickers hardness tester. The average grain size becomes smaller at $675^{\circ}C$ to $735^{\circ}C$ due to the formation of new grains rather than grain growth, but becomes larger at $735^{\circ}C$ to $795^{\circ}C$ due to growth of the already-formed grains rather than formation of new grains. The mill annealing temperature becomes higher, the ${\beta}$ phase fraction decreases and ${\alpha}$ phase fraction increases at room temperature. This is because the higher annealing temperature, the smaller amount of V present in the ${\beta}$ phase, and thus the ${\beta}$ to ${\alpha}$ transformation occurs more easily when cooled to room temperature. As the mill annealing temperature increases, the hardness value tends to decrease, mainly due to resolution of defects such as dislocations from $675^{\circ}C$ to $735^{\circ}C$ and due to grain growth from $735^{\circ}C$ to $795^{\circ}C$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.961-968
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• 2012

In this study, we have investigated the effects of Mn and Co co-doping on defects, J-E curves and grain boundary characteristics of ZnO-$Bi_2O_3$ (ZB) varistor. Admittance spectra and dielectric functions show two bulk defects of $Zn_i^{{\cdot}{\cdot}}$ (0.17~0.18 eV) and $V_o^{\cdot}$ (0.30~0.33 eV). From J-E characteristics the nonlinear coefficient (${\alpha}$) and resistivity (${\rho}_{gb}$) of pre-breakdown region decreased as 30 to 24 and 5.1 to 0.08 $G{\Omega}cm$ with sintering temperature, respectively. The double Schottky barrier of grain boundaries in ZB(MCo) ($ZnO-Bi_2O_3-Mn_3O_4-Co_3O_4$) could be electrochemically single type. However, its thermal stability was slightly disturbed by ambient oxygen because the apparent activation energy of grain boundaries was changed from 0.64 eV at lower temperature to 1.06 eV at higher temperature. It was revealed that a co-doping of Mn and Co in ZB reduced the heterogeneity of the barrier in grain boundaries and stabilized the barrier against an ambient temperature (${\alpha}$-factor= 0.136).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.12
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• pp.1911-1918
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• 2001

Recently the non-destructive test technique which uses the grain boundary etching characteristics owing to the variation of material structures has been proposed. However, during in-serviced GEM test there are a lot of variables such as the changes of temperature and concentration of etching solution, the roughness condition of surface polished etc.. The purpose of this paper is to investigate the influences of these test variables on GEM test results in order to establish a reliable and sensitive of GEM evaluation technique. The experiments are conducted in various solution temperatures, 10$\^{C}$, 15$\^{C}$, 20$\^{C}$, and 25$\^{C}$ and in 70% and 100% concentrations of that, and in various surface roughnesses polished by #800, #2000, and 0.3㎛ alumina powder. Through the test with variables, it is verified that the decrease of temperature and concentration of etching solution and the coarsened surface roughness by not using polishing cloth and powder induce some badly and/or greatly influences on GEM test results like grain boundary etching width(W$\_$GB) and intersecting point ratio(N$\_$i/N$\_$0/). Therefore, to get reliable and good GEM test results, it must be prepared the surface of specimen polished by polishing cloth and 0.3㎛ alumina powder and the saturated picric acid solution having 25$\^{C}$ and be maintained the constant temperature(25$\^{C}$) during GEM test.