• 한국결정학회지
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• 제8권2호
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• pp.105-110
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• 1997

CdS/CuInSe2 태양전지에서 창측재료로 1μm 두께의 CdS박막을 1x10-3mTorr의 진공하에서 CdS source 온도를 800-1100'C로 하고 기판의 온도를 50-200℃로하여 진공증차겁으로 제조하였다. 증착된 CdS박막의 구조적, 전기적, 광학적 특성조사는 x-ray diffractometer(XRD), scanning electron microscope(SEM), 전기비저항 측정, Hall measurement 그리고 optical transmission spectra로 행하였고, 각막들의 성분분석은 energy dispersive analysis of X-ray (EDAX)를 가하나, 광투과도는 감소하였다. 이때 증착된 CdS 박막들은 모두 hexagonal 구조를 가지고 있었으며, 결정성은 기판유리를 딸 (002)면으로 형성되었다. CdS Source 온도가 1000℃에서 증착된 CdS 박막이 0.9(S/cm)의 가장 높은 전기 전도도를 나타내었다. 또한 기판온도를 100'C로 제조한 CdS 박막이 전기비저항은 40(Ω,cm)이었고 광투과도는 80% 이상의 값을 나타내어 CdS/CuInSe2 태양전지의 창측재료로 적합했다.

• 한국재료학회지
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• 제26권3호
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• pp.154-159
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• 2016

A roll-bonding process was applied to fabricate an AA1050/AZ91/AA1050 laminate complex sheet. Two AA1050 and one AZ91 magnesium sheets of 2 mm thickness, 30 mm width and 200 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 2 mm in thickness by conventional rolling. The rolling was performed at 623K without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 15.9 m/min. The AA1050/AZ91/AA1050 laminate complex sheet fabricated by roll bonding was then annealed at 373~573K for 0.5h. The microstructure of the complex sheets was revealed by electron back scatter diffraction (EBSD) measurement; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the complex sheet was found to increase by 11 % and the tensile elongation decreased by 7%, compared to those values of the starting material. In addition, the hardness of the AZ91 Mg region was slightly higher than those of the AA1050 regions. Both AA1050 and AZ91 showed a typical deformation structure in which the grains were elongated in the rolling direction; however, the mis-orientation distribution of grain boundaries varied greatly between the two materials.

• 한국전기전자재료학회논문지
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• 제16권2호
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• pp.102-107
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• 2003

This study puts focus on the optimization of growth temperature of CIGS absorber layer which affects severely the performance of solar cells. The CIGS absorber layers were prepared by three-stage co-evaporation of metal elements in the order of In-Ga-Se. The effect of the growth temperature of 1st stage was found not to be so important, and 350$^{\circ}C$ to be the lowest optimum temperature. In the case of growth temperature at 2nd/3rd stage, the optimum temperature was revealed to be 550$^{\circ}C$. The XRD results of CIGS films showed a strong (112) preferred orientation and the Raman spectra of CIGS films showed only the Al mode peak at 173cm$\^$-1/. Scanning electron microscopy results revealed very small grains at 2nd/3rd stage growth temperature of 480$^{\circ}C$. At higher temperatures, the grain size increased together with a reduction in the number of the voids. The optimization of experimental parameters above mentioned, through the repeated fabrication and characterization of unit layers and devices, led to the highest conversion efficiency of 15.4% from CIGS-based thin film solar cell with a structure of Al/ZnO/CdS/CIGS/Mo/glass.

• 한국전기전자재료학회논문지
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• 제24권9호
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• pp.755-759
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• 2011

$Cu(In_{1-x},Ga_x)Se_2$ thin films have been considered as an effective absorber material for high efficient solar cells. In this paper, the CIGS thin films with varied Ga content were prepared using a co-evaporation process of three stage. We carry out structure and electrical optical property on the thin film in varied Ga content. CIGS thin films have been characterized by X-ray diffraction(XRD), scanning electron microscopy(SEM), energy-dispersive spectroscopy(EDS), four-point probe measurement, and the Hall measurement. To optimize Ga contents, Ga/(In+Ga) ratio were changed from 0.13 to 0.72. At this time the carrier concentrations were varied from $1.22{\times}10^{11}\;cm^{-3}$ to $5.07{\times}10^{16}\;cm^{-3}$, and electrical resistivity were varied from $1.11{\times}10^0\;{\Omega}-cm$ to $1.08{\times}10^2\;{\Omega}-cm$. A strong <220/204> orientation and a lager grain size were obtained at a Ga/(In+Ga) of 0.3. We were able to achieve conversion efficiency as high as 15.95% with a Ga/(In+Ga) of 0.3.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.146.2-146.2
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• 2013

Copper is considered to be the most promising substrate for the growth of high-quality and large area graphene by chemical vapor deposition (CVD), in particular, on the (111) facet. Because the interactions between graphene and Cu substrates influence the orientation, quality, and properties of the synthesized graphene, we studied the interactions using angle-resolved photoemission spectroscopy. The evolution of both the Shockley surface state of the Cu(111) and the ${\pi}$ band of the graphene was measured from the initial stage of CVD growth to the formation of a monolayer. Graphene growth was initiated along the Cu(111) lattice, where the Dirac band crossed the Fermi energy (EF) at the K point without hybridization with the d-band of Cu. Then two rotated domains were additionally grown as the area covered with graphene became wider. The Dirac energy was about -0.4 eV and the energy of the Shockley surface state of Cu(111) shifted toward the EF by ~0.15 eV upon graphene formation. These results indicate weak interactions between graphene and Cu, and the electron transfer is limited to that between the Shockley surface state of Cu(111) and the ${\pi}$ band of graphene. This weak interaction and slight lattice mismatch between graphene and Cu resulted in the growth of rotated graphene domains ($9.6^{\circ}$ and $8.4^{\circ}$), which showed no significant differences in the Dirac band with respect to different orientations. These rotated graphene domains resulted in grain boundaries which would hinder a large-sized single monolayer growth on Cu substrates.

• 대한금속재료학회지
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• 제48권10호
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• pp.884-892
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• 2010

To modify the physical properties of Cu thin films, gelatin is generally used as an additive. In this study, we assessed the effect of gelatin on the mechanical properties of electrodeposited Cu films. For this purpose, Cu/gelatin composite films were fabricated by adding 100 ppm of gelatin to an electrolyte, and tension and indentation tests were then performed. Additional tests based on pure Cu films were also performed for comparison. The Cu films containing gelatin presented a smaller grain size compared to that of pure Cu films. This increased the hardness of the Cu films, but addition of gelatin did not significantly affect the elastic modulus of the films. Cu films prepared at room temperature showed no significant change in the yield strength and tensile strength with an addition of gelatin, but we observed a dramatic decrease in the elongation. In contrast, Cu films prepared at $40^{\circ}C$ with gelatin presented a significant increase in the yield strength and tensile strength after the addition of gelatin. Elongation was not affected by adding gelatin. Presumably, the results would be closely related to the preferred orientation of the Cu thin film with the addition of gelatin and at temperatures that lead to a change in the microstructure of the Cu thin films.

• 대한금속재료학회지
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• 제50권12호
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• pp.931-937
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• 2012

The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.

• 대한금속재료학회지
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• 제46권4호
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• pp.249-256
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• 2008

0.5 wt% Al doped ZnO thin films (AZO) were prepared on glass substrates using RF magnetron sputtering method. Thin films were grown at substrate temperature of $250^{\circ}C$, RF power of 75W, working pressure of 10 mTorr, by changing the $O_2/Ar$ pressure ratio from 0% to 16.7%. The effects of oxygen partial pressure during the deposition process on structural and optical properties of the films were investigated using XRD, SEM, AFM, EPMA and UV-visible spectroscopy. All the AZO thin films were grown as hexagonal wurtzite phase with the c-axis preferred out-of-plane orientation. The surface roughness and grain size of AZO films decreased with increasing oxygen ratio from 10.6 nm to 3.2 nm and 94.9 nm to 30.9 nm, respectively. On the other hand, the transmittance and band gap energy of the AZO films increased from 84.7% to 92.6% and 3.24 eV to 3.28 eV, respectively with increasing the $O_2/Ar$ pressure ratio.

• Nuclear Engineering and Technology
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• 제54권6호
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• pp.1972-1981
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• 2022

A typical ferritic/martensitic (F/M) steel sheet was subjected to pulsed laser surface remelting (LSR) and corrosion test in lead-bismuth eutectic (LBE) at 550 ℃. There present two modification zones with distinct microstructures in the LSRed specimen: (1) remelted zone (RZ) consisting of both bulk δ-ferrite grains and martensitic plates and (2) heat-affected zone (HAZ) below the RZ, mainly composed of martensitic plates and high-density precipitates. Martensitic transformation occurs in both the RZ and the HAZ with the Kurdjumov-Sachs and Nishiyama-Wassermann orientation relationships followed concurrently, resulting in scattered orientations and specific misorientation characteristics. Hardnesses of the RZ and the HAZ are 364 ± 7 HV and 451 ± 15 HV, respectively, considerably higher than that of the matrix (267 ± 3 HV). In oxygen-saturated and oxygen-depleted LBE, thicknesses of oxide layers developed on both the as-received and the LSRed specimens increase with prolonging corrosion time (oxide layers always thinner under the oxygen-depleted condition). The corrosion resistance of the LSRed F/M steel in oxygen-saturated LBE is improved, which can be attributed to the grain-refinement accelerated formation of dense Fe-Cr spinel. In oxygen-depleted LBE, the growth of oxide layers is very low with both types of specimens showing similar corrosion resistance.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2001년도 추계학술발표회 초록집
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• pp.37-37
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• 2001

TiN coatings were applied for VarIOUS application fields, because of a good wear-resistance and a high hardness. Typically, TiN thin films show the hardness of 25GPa and friction coefficient of 0.6. However, in many field, one is looking for a more improved tool which has low friction coefficient and high wear resistance. The main motivation of this study is to characterize the influence of copper dopant content on TiN thin films. Ti-Cu-N thin films were deposited onto D2 steel substrates by PVD processing with various magnetron current densities (Cu contents). In this work, we synthesized titanium nitride films similar with reported typical titanium nitride films and synthesized Ti-Cu-N thin films with the addition of elemental copper which is measured improved hardness more than pure TiN films with copper content variables. This films has preferred oriented films of (111) direction. In addition, It was found that there is a strong correlation between content of various metal and film characteristics such as preferred orientation, grain size, hardness and friction coefficient and so, in future study, improved mechanical properties of TiN films can be controlled by change in target current density. The Ti-Cu-N film will show apparent hardness improvement and mechanical properties enhancement, when doping element is added onto TiN thin films. Film structure, chemical composition, mechanical properties were investigated by means of X-ray diffraction(XRD), scanning electron microscopy(SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy(EDS), wear resistance tester and nanohardness tester.