• Title/Summary/Keyword: Grain Boundary

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Low-temperature Sintering Behavior of TiO2 Activated with CuO

  • Paek, Yeong-Kyeun;Shin, Chang-Keun;Oh, Kyung-Sik;Chung, Tai-Joo;Cho, Hyoung Jin
    • Journal of the Korean Ceramic Society
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    • v.53 no.6
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    • pp.682-688
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    • 2016
  • In $TiO_2$-CuO systems, low-temperature sinterability was investigated by a conventional sintering method. Sintering temperatures were set at under $950^{\circ}C$, at which the volume diffusion is inactive. The temperatures are less than the melting point of Ag ($961^{\circ}C$), which is often used as an internal conductor in low-temperature co-fired ceramic technology. To optimize the amount of CuO dopant, various dopant contents were added. The optimum level for enhanced densification was 2 wt% CuO. Excess dopants were segregated to the grain boundaries. The segregated dopants supplied a high diffusion path, by which grain boundary diffusion improved. At lower temperatures in the solid state region, grain boundary diffusion was the principal mass transport mechanism for densification. The enhanced grain boundary diffusion, therefore, improved densification. In this regard, the results of this study prove that the sintering mechanism was the same as that of activated sintering.

Stress Corrosion Cracking of Alloy 600 and Alloy 690 in Caustic Solution

  • Kim, Hong Pyo;Lim, Yun Soo;Kim, Joung Soo
    • Corrosion Science and Technology
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    • v.2 no.2
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    • pp.82-87
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    • 2003
  • Stress corrosion cracking of Alloy 600 and Alloy 690 has been studied with a C-ring specimen in 1%, 10% and 40% NaOH at $315^{\circ}C$. SCC test was performed at 200 mV above corrosion potential. Initial stress on the apex of C-ring specimen was varied from 300 MPa to 565 MPa. Materials were heat treated at various temperatures. SCC resistance of Ni-$_\chi$Cr-10Fe alloy increased as the Cr content of the alloy increased if the density of an intergranular carbide were comparable. SCC resistance of Alloy 600 increased in caustic solution as the product of coverage of an intergranular carbide in grain boundary, intergranular carbide thickness and Cr concentration at grain boundary increased. Low temperature mill annealed Alloy 600 with small grain size and without intergranular carbide was most susceptible to SCC. TT Alloy 690 was most resistant to SCC due to the high value of the product of coverage of an intergranular carbide in grain boundary, intergranular carbide thickness and Cr concentration at grain boundary. Dependency of SCC rate on stress and NaOH concentration was obtained.

Effect of Repetitive Cold Rolling and Annealing on the Superplasticity of Fe-10Mn-3.5Si Alloy (Fe-10Mn-3.5Si 합금의 초소성에 미치는 반복 냉연 및 소둔의 영향)

  • Jeong, Hyun-Bin;Choi, Seok-Won;Lee, Young-Kook
    • Journal of the Korean Society for Heat Treatment
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    • v.35 no.4
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    • pp.211-219
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    • 2022
  • It is known that superplastic materials with ultrafine grains have high elongation mainly due to grain boundary sliding. Therefore, in the present study we examined the influence of grain refinement, caused by a repetitive cold rolling and annealing process, on both superplastic elongation and superplastic deformation mechanism. The cold rolling and annealing process was repetitively applied up to 4 times using Fe-10Mn-3.5Si alloy. High-temperature tensile tests were conducted at 763 K with an initial strain rate of 1 × 10-3 s-1 using the specimens. The superplastic elongation increased with the number of the repetitive cold rolling and annealing process; in particular, the 4 cycled specimen exhibited the highest elongation of 372%. The primary deformation mechanism of all specimens was grain boundary sliding between recrystallized α-ferrite and reverted γ-austenite grains. The main reason for the increase in elongation with the number of the repetitive cold rolling and annealing process was the increase in fractions of fine recrystallized α-ferrite and reverted γ-austenite grains, which undergo grain boundary sliding.

Sintering and Grain Growth of Rare Earth-Doped Ceria Particles

  • Sameshima, Soichiro;Higashi, Kenji;Hirata, Yoshihiro
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 2000.06a
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    • pp.65-86
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    • 2000
  • Rare earth-doped ceria powders with a composition of Ce0.8R0.2O1.9(R=Yb, Y, Gd, Sm, Nd and La) were prepared by heating the oxalate coprecipitate. The green compacts began to shrink at 600$^{\circ}$-700$^{\circ}C$. The relative density after the sintering at 1200$^{\circ}$ and 1400$^{\circ}C$ became higher for the higher green density. The samples were densified above 98% relative density by the sintering ant 1600$^{\circ}C$ for 4 h and the grain sizes (4.7-7.6$\mu\textrm{m}$) showed a tendency to become larger with increasing ionic radius of doped-rare earth element. In the intial stag of sintering at 700$^{\circ}$-800$^{\circ}C$, the dominant mass transport process changed from lattice diffusion to grain boundary diffusion to grain boundary diffusion with heating time. The porosity during the intermediated and final stage of the sintering at 1200$^{\circ}$ and 1400$^{\circ}C$ decreased by the mass transport through lattice diffusion with grain growth.

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Evaluation Method for Graphene Grain Boundary by UV/ozone-oxidation Chemical-etching Process (UV/ozone 산화처리 및 화학적 식각공정을 적용한 그래핀 Grain Boundary 평가 방법)

  • Kang, Jaewoon;Park, Hongsik
    • Journal of Sensor Science and Technology
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    • v.25 no.4
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    • pp.275-279
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    • 2016
  • Chemical vapor deposited (CVD) polycrystalline graphene is widely used for various sensor application because of its extremely large surface-to-volume ratio. The electrical properties of CVD-graphene is significantly affected by the grain size and boundaries (GGBs), but evaluation of GGB of continuous monolayer graphene is difficult. Although several evaluation methods such as tunneling electron microscopy, confocal Raman, UV/ozone-oxidation are typically used, they still have issues in evaluation efficiency and accuracy. In this paper, we suggest an improved evaluation method for precise and simple GGB evaluation which is based on UV/ozone-oxidation and chemical etching process. Using this method, we could observe clear GGBs of CVD-graphene layers grown by different process conditions and statistically evaluate average grain sizes varying from $1.69{\sim}4.43{\mu}m$. This evaluation method can be used for analyzing the correlation between the electrical properties and grain size of CVD-graphene, which is essential for the development of graphene-based sensor devices.

A Study of Stress Analysis of Multi-Grain Orthotropic Material by BEM (경계 요소법에 의한 직교 이방성 다결정 재료의 응력해석에 관한 연구)

  • Kim, Dong-Eun;Lee, Sang-Hun;Jeong, Il-Jung;Lee, Seok-Soon
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.4
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    • pp.127-133
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    • 2008
  • As the application of the MEMS parts increases, the structural safety of MEMS appears importantly. A lot of MEMS parts are made by a multi-grain silicon wafer, which is an orthotropic material. Moreover directions of the materials on each grain are distributed randomly. The stress analysis for the multi-grain is important factor in order to apply the MEMS parts to industrial applications. The finite element method (FEM) is commonly used by a stress analysis method but the boundary element method (BEM) is known as the result of the BEM is more accurate than that of the FEM since the fundamental solution are used. In this study, we derived the boundary integration equation for the orthotropic material by applying fundamental solutions with complex variables. The multi-region analysis procedure for the BEM and the multi-grain generation procedure by a random process technique are developed in order to apply the analysis of the multi-grain orthotropic material. The discontinuous element is used in order to remove the comer problem in the BEM. The results of the present method are compared with those of the finite element method in order to verify the present procedure.

INTERGRANULAR FAILURE ASSOCIATED WITH BOUNDARY SLIDING IN Pb-SN EUTECTIC SOLDERS USED FOR MICROELECTRONICS APPLICATIONS (Electronic Packaging에 쓰이는 공정 조성의 Pb-Sn Solders에서 Grain Boundary Sliding과 관련된 계면파괴현상)

  • Lee, Seong-Min
    • Korean Journal of Materials Research
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    • v.4 no.3
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    • pp.334-338
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    • 1994
  • This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

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Morphology and Segregation of Sulfide Inclusions in Cast Steels (II) (Influence of [Mn/S] Ratios on the Morphology of Sulfide Inclusions in Fe-Mn-S Alloys) (주강의 유화물 형태와 편석에 대한 연구 (II) (Fe-Mn-S 합금의 유화물 형태에 미치는 Mn/S비의 영향))

  • Park, Heung-Il;Kim, Ji-Tae;Kim, Woo-Yeol
    • Journal of Korea Foundry Society
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    • v.29 no.6
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    • pp.270-276
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    • 2009
  • After casting button-type small ingots of ternary Fe-Mn-S alloys which had three different Mn/S ratios (1, 5 and 70) in a vacuum arc furnace, the effect of the ratio on the sulfide formation was investigated. In case of the Mn/S ratio of 1, if alloy composition was located in an iron-rich corner on a Fe-Mn-S ternary phase diagram, only duplex MnS-FeS sulfide films were observed in the grain boundary. If the alloy composition was located in the miscibility gap area of the phase diagram, primary globular dendritic sulfides and dendritic sulfide slags were generated within the grain and tubular monotectic sulfides were also detected in the grain boundary. When the Mn/S ratio was 5, if the alloy composition was in the iron-rich corner, only bead-like sulfides were generated. On the other hand, if the composition was in the miscibility gap area, globular dendritic sulfides and dendritic sulfide slags were generated in the form of primary sulfide inclusions and rod-like eutectic sulfides were observed in the grain boundary. Especially, if the contents of Mn and S increased more in the miscibility gap area of the phase diagram, primary globular sulfides containing iron intrusions were observed. In case of Mn/S ratio of 70, if the contents of Mn and S was decreased in the Fe corner of the phase diagram, only bead-like sulfides were observed in the grain boundary. Despite the composition was outside the miscibility gap area of the phase diagram, if the contents of Mn and S increased, clusters of fine sulfide particles as well as fine spherical primary monophase sulfides were observed in the grain boundary.

The Effect of Additives on Twining in ZnO Varistors

  • Han, Se-Won;Kang, Hyung-Boo
    • The Korean Journal of Ceramics
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    • v.4 no.3
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    • pp.207-212
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    • 1998
  • By comparison of the experimental results in two systems of ZnO varistors, it's appear that Sb2O3 is the indispensable element for twining in ZnO varistors and the Zn7Sb2O12 spinel acts as the nucleus to form twins. Al2O3 is not the origin of twining in ZnO varistor, but it was found that Al2O3 could strengthen the twining and form a deformation twining by ZnAl2O4 dragging and pinning effect. The inhibition ratios of grain and nonuniformity of two systems ZnO varistors increase with the increase of Al2O3 content. The twins affect the inhibition of grain growth, the mechanism could be explained follow as: twins increase the mobility viscosity of ZrO grain and grain boundary, and drag ZrO grain and liquid grain boundary during the sintering, then the grain growth is inhibited and the microstructure becomes more uniform.

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Dislocation Density Propagation adjacent to the Low Angle Grain Boundaries of Polycrystalline Materials (다결정 미세입자 소각입계면에서의 전위밀도 확산)

  • Ma, Jeong-Beom
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.5
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    • pp.618-622
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    • 2011
  • Specialized large-scale computational finite-element and molecular dynamic models have been used in order to understand and predict how dislocation density emission and contact stress field due to nanoindentation affect inelastic deformation evolution scales that span the molecular to the continuum level in ductile crystalline systems. Dislocation density distributions and local stress fields have been obtained for different crystalline slip-system and grain-boundary orientations. The interrelated effects of grain-boundary interfaces and orientations, dislocation density evolution and crystalline structure on indentation inelastic regions have been investigated.