• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.55-62
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• 2001

With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.1
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• pp.125-142
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• 1996

Bond strength of four different cements to dental casting alloys which were treated with #600 emery, tin-plating, and $50{\mu}m$ sandblasting were evaluated. The alloy specimens were Type III Gold alloy(Degulor C), Palladium-Silver alloy(Pors on 4), Nickel-Chromium(Rexillium III) alloy, which were embedded in acrylic resin disc. The specimens were treated with #600 emery and tin plating, #600 emery and sandblasting, then bonded using Fuji I, Ketac Cem(Glass ionomer cements), Poly F, Livcarbo(Polycarboxylate cements). The specimens were immersed in water for 24 hours and shear bond strengths were evaluated by Instron Machine. Tin plated, sandblasted, and debonded alloy surfaces were observed using scanning electron microscope. On the basis of this study, the following conclusions could be drawn. 1. In the tin plated alloy group, increase in bond strength of glass ionomer cements was statistically insignificant. 2. In the tin plated alloy group, increase in bond strength of polycarboxylate cements was statistically significant, except nickel-chromium alloy. 3. Sandblasted alloy group showed higher bond strength than that of tin-plated alloy group.

• Current Photovoltaic Research
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• v.4 no.4
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.3
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• pp.620-631
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• 1996

Bonding of resin to cast alloy has traditionally been provided by mechanical retention. But, chemical bonding methods such as silicoating, tin plating, heat treatment, application of 4-META adhesives, have been developed to overcome the problems of the mechanical bonding methods. Silicoating has been used availaby in fixed prosthodontics, but is also reported to be used in removable prosthodontics. The aim of this study is to measure the tensile bond strength between resin and metal, and compare the effect of the type of metal and the grain size of the aluminum oxide on the bond strength, after metal surface roughening, coating of the opaque resin, and curing of heat-curing resin were performed. The test groups were divided into 4 groups according to the cast alloys and the aluminum oxide particles used. Group 1 : Type 4 gold alloy(DM66) blasted with $$50{\mu}m\;Al_{2}O_3$$ Group 2 : Type 4 gold alloy(DM66) blasted with $$250{\mu}m\;Al_{2}O_3$$, Group 3 : Co-Cr alloy(Nobilium) blasted with $$50{\mu}m\;Al_{2}O_3$$ Group 4 : Co-Cr alloy(Nobilium) blasted with $$250{\mu}m\;Al_{2}O_3$$ * 10 test specimens were made on each group. The specimens were thermocycled, and Instron Universal testing machine was used to measure the tensile bond strength of the finished specimens. The results were as follows : 1. Bond strengths showed that the group of gold alloy blasted with $250{\mu}m$ aluminum oxide particle had higher bond strength, and the group of gold alloy blasted with $50{\mu}m$ aluminum oxide particles had lower bond strength than any of the other groups. 2. Gold alloy had significantly higher bond strength when blasted with $250{\mu}m$ aluminum oxide particles than $50{\mu}m$, but. Co-Cr alloy showed no statistically significant difference between the two particle sizes. 3. When blasted with $50{mu}m$ aluminum oxide particles, Co-Cr alloy showed significantly higher bond strength than gold alloy. And, when blasted with $250{\mu}m$ aluminum oxide particles, gold alloy had significantly higher bond strength than Co-Cr alloy. 4. On the examination of the fractured sites, only the group of Co-Cr alloy blasted with $50{\mu}m$ aluminum oxide particles showed a part of residual opaque resin, but all the samples of the other groups fractured between the resin and the metal.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of Technologic Dentistry
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• v.5 no.1
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• pp.27-30
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• 1983

This study was undertaken to know the difference that margin fittness in metal bond porcelain crown. When we use porcelain precious metal and non-precious metal as porcelain-fused metal, the results were as following. 1. The precious metal was showed best result in margin fittness and shade. 2. The non-precious metals were showed good results, especially Gemini II was excellent, but that was not good than precious metal. 3. 10k. gold plating on non-precious metal cap showed same result as nonprecious metal in margin fittness, and not good in shade. 4. When we use the non-precious metals at upper part of crown, and using precious metal in 2mm cervical portion, the margin fittness were very good, and the results same as full veneer precious metal.

• Journal of the Korean institute of surface engineering
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• v.23 no.2
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• pp.24-29
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• 1990

The TiN filmms were deposited on the stainless steel substrates by BARE techinique in order to investigate the effects of process parameters such as source-to-substate distance (15-35cm), N2 pressure(4$\times$10-10 -1$\times$10-3mb)and bias voltage(O-2000V), on the deposition rate, the concentration ratio [N/Ti] and the surface color of the films. The deposition rate was deduced from the weight measurement, the [N/ti] ratio by ESCA. The deposition rate decreased with a relationship of=40.2/D2 where D was source-to-substrate distance. The effect of the bias voltage and the N2pressure on the deposition rate, however, appeared negligble. The [N/Ti] ratio was in the narrow range of 0.7 tp 0.8 It increased slightly with the N2 partial pressure and deceased with the source-to-substrate distance. It was confired by ESCA that a significant amount of oxygen and carbon was contaminated after deposition in the top surface of TiN films. The surface color of TiN film was changed from light gold yellow to reddish gold yellow with increasing [N/Ti] ratio.

• Journal of Korean Ophthalmic Optics Society
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• v.15 no.4
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• pp.361-366
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• 2010

Purpose: HCD ion plating apparatus by hollow cathod discharge method was fabricated and TiN films were deposited on stainless steel by this apparatus with increasing in $N_2$ gas flow and the fine color changes of TiN films were analyzed. Methods: The spectroradiometer and spectrophotometer were used to observe optically the fine color changes of TiN thin films, and XPS was used to analyze the compositions of TiN thin films with increasing in $N_2$ gas flow. Results: The color coordinate of TiN thin film with $N_2$ 120 sccm gas flow showed (0.382, 0.372) which had the mixed colors of gold and silver, and the color coordinate changed to the increasing value of (x,y) with increasing in $N_2$ gas flow which indicated the deep gold color. It was found that the slopes of the reflectances at 550nm were increased with increasing in $N_2$ gas flow. And from the Ti scans using XPS, it was found that the peak heights of 455 eV derived from TiN composition were increased with increasing in $N_2$ gas flow, while the peak heights of 459 eV from $TiO_2$ composition were decreased. Conclusions: The results obtained above were that the color of TiN film with 120 sccm $N_2$ gas flow had been observed from the mixed color of silver and gold due to TiC, $N_2$, TiN on the surface and TiN, $N_2$ inside film, and the color of TiN films changed a deep gold color with increasing in $N_2$ gas flow due to increasing TiN composition.

• Journal of the Korean Institute of Gas
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• v.15 no.4
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• pp.27-32
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• 2011

Management of gas safety is becoming important with increasing use of gas facilities. U-safety system is being promoted as part of national management of gas, and thus real-time and in-situ gas sensor should be developed. Detection method for When the gas sensor is installed in gas conduit, explosion may be likely, because hydrocarbon gases is usually used the difference of thermal resistance between reference and working electrode. Therefore, it is required to detect the hydrocarbons, such as $CH_4$ and CO, at room temperature via electrochemically catalytic reaction. In this study, Pt nanoparticle was doped on the porous gold powder by electrolytic plating method, and then it was used as catalytic electrode for CO oxidation. For Pt/PAu electrode, approximately 21% of CO conversion was obtained. It is noted that Pt/PAu electrode could be used to react the oxidation of hydrocarbon gases at room temperature via applying of external voltage.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.314-324
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• 1996

Scanning probe microscopes (SPMs) such as the scanning tunneling microscope (STM) and the atomic force microscope (AFM) were used for surface modification tools at the nanometer scale. Material surfaces, i. e., titanium, hydrogen-terminated silicon and trimethylsilyl organosilane monolayer on silicon, were locally oxidized with the best lateral spatial resolution of 20nm. The principle behind this proximal probe oxidation method is scanning probe anodization, that is, the SPM tip-sample junction connected through a water column acting as a minute electrochemical cell. An SPM-nanolithogrphy process was demonstrated using the organosilane monolayer as a resist. Area-selective chemical modifications, i. e., etching, electroless plating with gold, monolayer deposition and immobilization of latex nanoparticles; were achieved in nano-scale resolution. The area-selectivity was based on the differences in chemical properties between the SPM-modified and unmodified regions.