• JSTS:Journal of Semiconductor Technology and Science
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• 제14권2호
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• pp.169-174
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• 2014

As a versatile processing method for nanoscale memory integration, laser-induced epitaxial growth is proposed for the fabrication of vertical Si channel (VSC) transistor. The fabricated VSC transistor with 80 nm gate length and 130 nm pillar diameter exhibited field effect mobility of $300cm^2/Vs$, which guarantees "device quality". In addition, we have shown that this VSC transistor provides memory operations with a memory window of 700 mV, and moreover, the memory window further increases by employing charge trap dielectrics in our VSC transistor. Our proposed processing method and device structure would provide a promising route for the further scaling of state-of-the-art memory technology.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.629-632
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• 2008

Printed organic thin-film transistors (OTFTs) were used in the fabrication of a screen- printed gate, source and drain electrodes on flexible plastic substrates using silver pastes, a coated polyvinylphenol dielectrics, and jetted bis(triisopropyl-silylethynyl) pentacene (TIPS-pentacene) organic semiconductor. The OTFTs printed using screen printing and soluble processes made it was possible to fabricate a printed OTFT with a channel length as small as $13\;{\mu}m$ on plastic substrates; this was not possible using previous traditional printing techniques.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2015년도 춘계학술대회
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• pp.829-831
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• 2015

본 연구에서는 비대칭 이중게이트 MOSFET의 채널길이와 채널두께의 비에 따른 문턱전압 및 전도중심의 변화를 분석하고자한다. 비대칭 이중게이트 MOSFET는 상하단 게이트 전압에 의하여 전류흐름을 제어할 수 있어 단채널효과를 감소시킬 수 있다는 장점이 있다. 그러나 채널길이가 감소하면 필연적으로 발생하는 문턱전압의 급격한 변화는 소자 특성에 커다란 영향을 미치고 있다. 특히 상하단의 게이트 전압, 상하단의 게이트 산화막 두께 그리고 도핑분포변화에 따라 발생하는 전도중심의 변화는 문턱전압을 결정하는 중요 요소가 된다. 해석학적으로 문턱전압 및 전도중심을 분석하기 위하여 해석학적 전위분포를 포아송방정식을 통하여 유도하였다. 다양한 채널길이 및 채널두께에 대하여 전도중심과 문턱전압을 계산한 결과, 채널길이와 채널두께의 비 등 구조적 파라미터뿐만이 아니라 도핑분포 및 게이트 전압 등에 따라 전도중심과 문턱전압은 크게 변화한다는 것을 알 수 있었다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2015년도 춘계학술대회
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• pp.839-841
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• 2015

본 연구에서는 비대칭 이중게이트 MOSFET의 채널길이와 채널두께의 비에 따른 드레인 유도 장벽 감소 현상의 변화에 대하여 분석하고자한다. 드레인 전압이 소스 측 전위장벽에 영향을 미칠 정도로 단채널을 갖는 MOSFET에서 발생하는 중요한 이차효과인 드레인 유도 장벽 감소는 문턱전압의 이동 등 트랜지스터 특성에 심각한 영향을 미친다. 드레인 유도 장벽 감소현상을 분석하기 위하여 포아송방정식으로부터 급수형태의 전위분포를 유도하였으며 차단전류가 $10^{-7}A/m$일 경우 비대칭 이중게이트 MOSFET의 상단게이트 전압을 문턱전압으로 정의하였다. 비대칭 이중게이트 MOSFET는 단채널효과를 감소시키면서 채널길이 및 채널두께를 초소형화할 수 있는 장점이 있으므로 본 연구에서는 채널길이와 두께 비에 따라 드레인 유도 장벽 감소를 관찰하였다. 결과적으로 드레인 유도 장벽 감소 현상은 단채널에서 크게 나타났으며 하단게이트 전압, 상하단 게이트 산화막 두께 그리고 채널도핑 농도 등에 따라 큰 영향을 받고 있다는 것을 알 수 있었다.

• E2M - 전기 전자와 첨단 소재
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• 제7권2호
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• pp.123-129
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• 1994

SONOS EEPROM chips, containing several SONOSFET nonvolatile memories of various channel size, have been fabricated on the basis of the existing n-well CMOS processing technology for 1 Mbit DRAM ($1.2\mu\textrm{m}$.m design rule). All the SONOSFET memories have the triple insulated-gate consisting of 30.angs. tunneling oxide, 205.angs. nitride and 65.angs. blocking oxide. The miniaturization of the devices for the higher density EEPROM and their characteristics alterations accompanied with the scaling-down have been investigated. The stabler operating characteristics were attained by increasing the ratio of the channel width to length. Also, the transfer, switching, retention and degradation characteristics of the most favorable performance devices were presented and discussed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 합동 추계학술대회 논문집 정보 및 제어부문
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• pp.165-168
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• 2001

This paper presents a design of a divide unit supporting IEEE-754 floating point standard single-precision with 32-bit word length. Its functions have been verified with ALTERA MAX PLUS II tool. For a high-speed division operation, the radix-4 non-restoring algorithm has been applied and CLA(carry-look -ahead) adders has been used in order to improve the area efficiency and the speed of performance for the fraction division part. The prevention of the speed decrement of operations due to clocking has been achieved by taking advantage of combinational logic. A quotient select block which is very complicated and significant in the high-radix part was designed by using P-D plot in order to select the fast and accurate quotient. Also, we designed all division steps with Gate-level which visualize the operations and delay time.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.367-367
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• 2010

Electrical characteristics of Large-grain silicon with Ni-induced crystallization which gate insulator is made of 80 nm $SiO_2$ and 20 nm SiNx was fabricated and measured with different channel widths, channel length fixed $10{\mu}m$. Focusing on the changes of channel widths from $4{\mu}m$ to $40{\mu}m$. Field-effect mobility decreased from 111.30 to $94.10\;cm^2/V_s$ when the channel widths increased. Still threshold voltage was almost similar with -1.06V.

• ETRI Journal
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• 제20권1호
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• pp.37-45
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• 1998

Reduced surface field lateral double-diffused MOS transistor for the driving circuits of plasma display panel and field emission display in the 120V region have been integrated for the first time into a low-voltage $1.2{\mu}m$ analog CMOS process using p-type bulk silicon. This method of integration provides an excellent way of achieving both high power and low voltage functions on the same chip; it reduces the number of mask layers double-diffused MOS transistor with a drift length of $6.0{\mu}m$ and a breakdown voltage greater than 150V was self-isolated to the low voltage CMOS ICs. The measured specific on-resistance of the lateral double-diffused MOS in $4.8m{\Omega}{\cdot}cm^2$ at a gate voltage of 5V.

• 한국광학회:학술대회논문집
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• 한국광학회 1998년도 제15회 광학 및 양자전자 학술발표회 논문집
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• pp.192-193
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• 1998

At Rutherford Appleton Laboratory(RAL), a high-repetition rate ps exicmer laser-plasma x-ray source has been developed for x-ray lithography with a calibrated output of up to 1 watt X-ray average power at 1nm wavelength. In a previous reports this compact x-ray source was used to print 0.18$\mu$m lines for a gate on Si-FET devices and deep three-dimensional structure with 100$\mu$m length, 25$\mu$m width, and 48 $\mu$m depth for a nanotechnology. The deep X-ray lithography is called as LIGA thchnology and getting a wide interest as a new technology for a nano-device. In this report all this works are summarized.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1992년도 춘계학술대회 논문집
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• pp.127-132
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• 1992

To relize the future intelligent robot the development of a special-purpose processor for a coordinate transformation is evidently challenging task. In this case the complexity of a hardware architecture strongly depends on the adopted algorithm. In this paper we have used an inverse kinemetics algorithm based on incremental unit computation method. This method considers the 3-axis articulated robot as the combination of two types of a 2-axis robot: polar robot and 2-axis planar articulated one. For each robot incremental units in the joint and Cartesian spaces are defined. With this approach the calculation of the inverse Jacobian matrix can be realized through a simple combinational logic gate. Futhermore, the incremental computation of the DDA integrator can be used to solve the direct kinematics. We have also designed a hardware architecture to implement the proposed algorithm. The architecture consists of serveral simple unitsl. The operative unit comprises several basic operators and simple data path with a small bit-length. The hardware architecture is realized byusing the EPLD. For the straight-line motion of the KAIST arm we have obtained maximum end effector's speed of 12.6 m/sec by adopting system clock of 8 MHz.