• 한국재료학회지
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• 제12권5호
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• pp.387-390
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• 2002

A new approach of using double buffer layers of AlN and GaN for growth of GaN films on Si has been undertaken via molecular beam epitaxy using ammonia. The first buffers layer of AlN was grown using $N_2$plasma and the second of GaN was grown using ammonia. The surface roughness of the grown films was investigated by atomic force microscope and was compared with the normally grown films on sapphire. Double crystal x-ray rocking curve and low temperature photoluminescence techniques were employed for structural and optical properties examination. Donor bound exciton peak at 3.481 eV with full width half maximum of 41 meV was observed at 13K.

• 전기전자학회논문지
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• 제23권3호
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• pp.1033-1037
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• 2019

GaN-based sensors have been widely investigated thanks to its potential in detecting the presence of hydrogen. In this study, we fabricated hydrogen gas sensors with AlGaN/GaN heterojunction and investigated how the sensing performance to be affected by SiN surface passivation. The gas sensor employed a high electron mobility transistors (HEMTs) with 30 nm platinum catalyst as a gate to detect the hydrogen presence. SiN layer was deposited by inductively-coupled chemical vapor deposition as post-passivation. The sensors with SiN passivation exhibited hydrogen sensing characteristics with various gas flow rates and concentrations of hydrogen in inert background gas at $200^{\circ}C$ similar to the ones without passivation. Aside from quick response time for both sensors, there are differences in sensitivity and recovery time because of the existence of the passivation layer. The results also confirmed the dependence of sensing performance on gas flow rate and gas concentration.

• 한국전기전자재료학회논문지
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• 제30권3호
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• pp.175-179
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• 2017

In this study, we investigate the $SiO_2$ current blocking layer (CBL) to improve light output power efficiency in nonpolar a-plane (11-20) GaN LEDs on a r-plane sapphire substrate. The $SiO_2$ CBL was produced under the p-pad layer using plasma enhanced chemical vapor deposition (PECVD). The results show that nonpolar GaN LED light output power with the $SiO_2$ CBL is considerably enhanced compared without the $SiO_2$ CBL. This can be attributed to reduced light absorption at the p-pad due to current blocking to the active layer by the $SiO_2$ CBL.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.113-113
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• 1999

최근의 고품질 III-N 화합물 반도체 박막성장과 더불어 청색계열의 LED 및 LD의 성공적인 실현은 본 연구분야에 대한 새롭고 헌신적인 상업적, 학문적/ 기술적 투자환경을 유도해 나가고 있다. 특히, c-축 배향 단결정 사파이어를 기판재료로 사용하고 얇은 GaN buffer의 사용은 고온에서 그 위에 성장되는 성장박막의 특성을 크게 향상시키는 것으로 알려져 있다. 그러나 절연체를 기판으로 사용함에 따른 소자구조 및 제작공정의 복잡성과 기판과 GaN 박막사이의 큰 격자 부정합에 따른 결함센터 등은 소자의 전기, 광학적, 구조적 특성에 부정적인 영향을 미치고 있다. 이러한 문제점을 해결하고 양질의 박막을 성장하기 위한 GaN 혹은 그 대체 기판의 개발에 많은 연구투자가 이루어지고 있는 현실 속에서 Si을 기판으로 이용한 GaN 성장의 가능성이 조심스럽게 점쳐지고 있다. 현재까지의 연구결과를 참조할 때 대체로 복잡한 interlayer를 사용하여 박막성장이 일부 이루어졌으나 그 재현성이나 성장의 중요인자에 대한 해석은 아직 분명하게 밝혀져 있지 않다. 본 연구에서는 원자적 관점에서 Si의 표면에 일부 변화를 유도하고, MOCVD 방법으로 그 위에 성장되는 GaN 박막의 광학적 및 표면 morphology 등에 미치는 영향을 분석하여 핵심적인 성장인자를 추출하고자 시도하였다. 성장된 GaN/Si 박막의 물성은 SEM(AFM), PL, XRD, Auger depth profile 장비등을 이용하여 조사하였으며 사파이어 기판 위에 성장된 GaN 박막의 특성들과 비교 검토하였다.

• 한국전자파학회논문지
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• 제24권2호
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• pp.128-135
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• 2013

본 논문에서는 Si가 도핑된 Modulation-doped AlGaN/GaN 이종 접합 구조를 가지는 전력증폭기용 MISHFET 소자를 제작하였다. 제작된 GaN TR 소자는 6H-SiC(0001)의 Substrate 위에 성장시켰으며, 180 nm의 gate length를 가진다. 제작된 소자를 측정한 결과, 837 mA/mm의 최대 드레인 전류 특성, 177 mS/mm의 $g_m$(Tranconductance)을 가지며, $f_T$는 45.6 GHz, $f_{MAX}$는 46.5 GHz로 9.3 GHz에서 1.54 W/mm의 전력 밀도와 40.24 %의 PAE를 가지는 것으로 확인되었다.

• Journal of Power Electronics
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• 제12권1호
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• pp.19-23
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• 2012

This paper presents a practical methodology for realistic simulation on reverse characteristics of Wide Bandgap (WBG) SiC and GaN p-n junctions. The adjustment on certain physic-based model parameters, such as the trap density and photo-generation for SiC junction, and impact ionization coefficients and critical field for GaN junction are described. The adjusted parameters were used in Synopsys Medici simulation to obtain a realistic p-n junction avalanche breakdown voltage. The simulation results were verified through benchmarking against independent data reported by others.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.49-54
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• 2017

In this paper, recent researches on new and renewable energy have been conducted due to problems such as energy exhaustion and environmental pollution, and new researches on high efficiency and high speed switching are needed. Therefore, we compared the efficiency by using high speed switching devices instead of IGBT which can't be used in high speed switching. The experiment was performed theoretically by applying the same parameters of the high speed switching devices which are the Cool MOS of Infineon Co., SiC C3M of Cree, and GaN FET device of Transform, by implementing the DC-DC boost converter and measuring the actual efficiency for output power and frequency. As a result, the GaN FET showed good efficiency at all switching frequency and output power.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.194-197
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• 1997

A hydride vapor phase epitaxy (HVPE) method was performed to prepare the thick-fi lm GaN on AIN/Si substrates. We obtained substrate-free GaN. The foul t-width at half maximum of double crystal X-ray rocking curve from 350 ${\mu}{\textrm}{m}$ thick substrate-free GaN was ~1000 arcsec. The photoluminescence spectrum (at 20 K) shows the narrow bound exiton (I$_2$) line and wealth donor-acceptor pair recombination however. there was not observed deep donor-accepter pair recombination indicate the substrate-free GaN crystal prepared in this study are of high purity and high crystalline quality.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 추계학술발표회
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• pp.150-150
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• 1997

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 춘계학술발표회
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• pp.32-32
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• 1997