• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.180-181
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• 2015

본 논문에서는 ICP Poly Etcher를 이용한 Dry Etch에서 몇가지 공정조건의 변화에 따른 Etching 특성 변화를 연구하였다. 주요 가스유량들이 증가 할 때, Poly-Si 의 Etch rate는 증가 하였으며 Uniformity는 나빠진 것을 확인 할 수 있었고 다른 특성들은 특별한 변화를 보이지 않았다. 주요 Gas인 HBr의 증가는 PR(Photo Resist)와 Uniformity에 영향을 주었다. 이 논문을 통해 HBr의 유량이 Poly-Si Etching에 영향을 주는 결과를 알아 볼 수 있었고 HBr 가스의 유량 증가가 Polymer의 생성에 영향을 줘 Selectivity와 Uniformity를 증가 시킨다는 것도 확인 해 볼 수 있었다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.6
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• pp.236-243
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• 2004

The oxide etching process was characterized in a magnetically enhanced reactive ion etching (MERIE) reactor with a $CHF_3CF_4$ gas chemistry. A statistical experimental design plus one center point was used to characterize relationships between process factors and etch response. The etch response modeled are etch rate, etch selectivity to TiN and uniformity. Etching uniformity was improved with increasing $CF_4$ flow ratio, increasing source power, and increasing pressure depending on source power. Characterization of via etching in $CHF_3CF_4$ MERIE using neural networks was successfully executed giving to highly valuable information about etching mechanism and optimum etching condition. It was found that etching uniformity was closely related to surface polymerization, DC bias, TiN and uniformity.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2006.05a
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• pp.130-134
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• 2006

The injection uniformity of the fuel manifold in a liquid rocket engine has been analyzed with dividing plates to improve the cooling performance at the face plate. Three dimensional computational fluid dynamics analysis has been performed to compare the injection uniformity for 5 candidate designs and has been verified to compare with the measured data for the optimal manifold design. For the case I and II, the coolant mass flux increases as the whole working fluid is enforced to flow under the dividing plate. The injection uniformity decreases due to the variation of mass flux at the end of dividing plate and the concentration of mass flow rate at the center of manifold. However case III and IV have uniform injection performance due to reduced mass flux concentration as the coolant can flow along both upper passage and lower passage of the dividing plate. Among the candidate designs, case IV is thought to be the optimal dividing plate with regard to cooling performance and injection uniformity.

• Journal of Biosystems Engineering
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• v.31 no.6 s.119
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• pp.482-488
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• 2006

Application of precision farming technology to rice cultivation could be an effective measure for rice quality improvement and environment-friendly agriculture. This study was conducted to develope a variable rate pneumatic granule applicator. Previous study reported that application uniformity of the prototype machine (C.V. = 23.3%) was not satisfactory. To improve the uniformity, increase of blow-head number from 12 to 16 was suggested. Analysis of the pneumatic conveying system showed that increase of number of blow-head was possible. Three-way variance analysis of the modified applicator showed that inserting length should be changed according to granule metering rate. The range of metering rate from 27.3 to 417.9 g/s were divided into 4 levels and 4 sets of inserting lengths were determined to ensure CV values less than 15%. The revised applicator showed satisfactory C.V. values of 9.4 to 14.6% in the metering rate. Granule conveying pattern was observed using a high speed camera and judged as the homogeneous flow pattern.

• 한국전산유체공학회:학술대회논문집
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• 1998.11a
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• pp.121-126
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• 1998

A numerical optimization procedure is developed to find the inlet velocity profile that yields the most uniform epitaxial layer in a vertical MOCVD reactor. It involves the solution of fully elliptic equations of motion, temperature, and concentration; the finite volume method based on SIMPLE algorithm has been adopted to solve the Navier-Stokes equations. The overall optimization process is highly nonlinear and has been efficiently treated by the sequential linear programming technique that breaks the non-linear problem into a series of linear ones. The optimal profile approximated by a 6th-degree Chebyshev polynomial is very successful in reducing the spatial non-uniformity of the growth rate. The optimization is particularly effective to the high Reynolds number flow. It is also found that a properly constructed inlet velocity profile can suppress the buoyancy driven secondary flow and improve the growth-rate uniformity.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.150-154
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• 2009

Flow distribution characteristics with varying inlet flow-rate in mega collector risers have been investigated, using commercial code FLUENT. The heat transfer in mega collector was not considered in this numerical study. Through the simulation, the following results were found. First, flow distribution characteristics in mega collector risers show the similar tendency in all cases. Secondly, with increased inlet flow-rate, flow distribution uniformity was getting worse.

• Textile Coloration and Finishing
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• v.25 no.2
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• pp.134-139
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• 2013

A tenter is very important to dry and heat-set fabrics in textile dyeing and finishing industry. However, the tenter machine typically utilizes more than 80% of all the power in dyeing system, and yet is one of the primary machine which affects quality of fabrics. Therefore, performance optimization of the tenter machine is required to reduce energy consumption and enhance quality of fabrics. To optimize the tenter machine, it is important to maintain the uniform flow rate, which can be obtained by optimizing a nozzle geometry. In this study, emboss hole angle was investigated as main parameter in flow rate uniformity and heat flux efficiency. The analysis results were compared with those acquired from bench-scale dryer test in the laboratory. The tenter machine performance simulated by Computational Fluid Dynamics(CFD) was optimized by controlling emboss hole angle.

• Advances in Computational Design
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• v.5 no.2
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• pp.111-125
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• 2020

The flow behavior of polymer melts within a slit die is an important consideration when designing a die geometry. The quality of the extruded polymer product can be determined through an evaluation of the flow homogeneity, wall shear rate and pressure drop across the central height of the die. However, mathematical formulations cannot fully determine the behavior of the flow due to the complex nature of fluid dynamics and the nonlinear physical properties of the polymer melts. This paper examines two slit die geometries in terms of outlet velocity uniformity, shear rate uniformity at the walls and pressure drop by using the licensed computational fluid dynamics package, Ansys POLYFLOW, based on the finite element method. The Carreau-Yasuda viscosity model was used for the rheological properties of the polypropylene. Comparative analysis of the simulation results will conclude that the modified die design performs better in all three aspects providing uniform exit velocity, uniform wall shear rates, and lower pressure drop.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.92-99
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• 2002

This work investigated the optimal condition for an uniform deposition growth rate in the vertical cylindric CVD chamber. Heat transfer, surface chemical reaction and mass diffusion in the flow field of CVD chamber h,id been computed using Fluent v5.3 code. A SIMPLE based finite Volume Method (FVM) was adopted to solve the fully elliptic equations for momentum, temperature and concentration of a chemical species. The numerical analysis results show good agreements with the measurements obtained by N. Yoshikawa. The results obtained by the numerical analysis showed that the film growth rate in the center of a susceptor is increasing, as the inner flow approaches to the forced convection. To the contrast, as it approaches to the natural convection, that in the outside of a susceptor is increasing. As the Reynolds number increases, the uniformity may not hold due to the larger temperature gradient at a susceptor surface. Therefore, when the temperature gradient on the surface of a susceptor is zero, the film growth rate becomes uniform on most surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.228-232
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing(CMP) process in 0.18 ${\mu}m$ semiconductor device. However it does have various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining removal rate and non-uniformity. In this paper, We studied the DOE(design of experiment) method for the optimized CMP process. Various process variations, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal process parameters.