• Journal of computational fluids engineering
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• v.13 no.4
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• pp.1-7
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• 2008

In the process of continuous hot-dip galvanizing, it is well known that the gas wiping through an air knife system is most effective because of its uniformity in coating thickness, possibility of thin coating, workability in high speed, and simplicity of control. However, gas wiping used in the galvanizing process brings about a problem of splashing at the strip edge above a certain high speed of process. It is also known that the problem of edge splashing is more harmful than that at the mid strip surface. For a given liquid(of a certain viscosity and surface tension), the onset of splashing mainly depends upon the strip velocity, the gas-jet pressure, and the nozzle's stand-off distance. In these connections in the present study, we proposed three kinds of air knife system having nozzles of constant expansion rate, and compared the jet structures issuing from newly proposed nozzle systems with the result by a conventional one. In numerical analysis, the governing equations are consisted of two-dimensional time dependent Navier-Stokes equations, and the standard k-${\varepsilon}$ turbulence model is employed to solve turbulence stress and so on. As the result, it is found that we had better use the constant expansion-rate nozzle which can be interpreted from the point view of the energy saving for the same coating thickness. Also, we better reduce the size of separation bubble and enhance the cutting ability at the strip surface, by using an air-knife having constant expansion-rate nozzle.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1038-1041
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• 2003

In the paper, we investigated silicon surface microstructures formed by reactive ion etching in hollow cathode system. Wet anisotropic chemical etching technique use to form random pyramidal structure on <100> silicon wafers usually is not effective in texturing of low-cost multicrystalline silicon wafers because of random orientation nature, but High density hollow cathode plasma system illustrates high deposition rate, better film crystal structure, improved etching characteristics. The etched silicon surface is covered by columnar microstructures with diameters form 50 to 100nm and depth of about 500nm. We used $SF_{6}$ and $O_{2}$ gases in HCP dry etch process. This paper demonstrates very high plasma density of $2{\times}10^{12}$ $cm^{-3}$ at a discharge current of 20 mA. Silicon etch rate of 1.3 ${\mu}s/min$. was achieved with $SF_{6}/O_{2}$ plasma conditions of total gas pressure=50 mTorr, gas flow rate=40 sccm, and rf power=200 W. Our experimental results can be used in various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications. In this paper we directed our study to the silicon etching properties such as high etching rate, large area uniformity, low power with the high density plasma.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8116-8127
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• 2015

This study provides results from the experiment on the rainfall distribution using a large Experimental rainfall simulator with fixed nozzle arrangement. Results from the experiment on the nozzles which are crucial for rainfall simulation show standard errors expressed as percentage are 0.15~0.38% at the indoor flow testing apparatus and 0.37~0.59% at the KICT-ERS. To examine spraying range of the nozzles, radial and triangular rainfall measurement test are done. In the radial test, coefficient of uniformity (CU) lies in 0.348~0.657 in the single nozzle spraying case, while it increases up to 0.854~0.895 in the seven nozzle spraying case. This means increase of both rain rate and uniformity by means of superimposition of spraying. The CU of the triangular test falls to 0.845~0.896. The results from the experiment on the whole-scale of the KICT-ERS show that CU exceeds 0.7 for every case except the one experimental condition where a $1.5{\phi}$ nozzle is used. The CU tends to increase with increasing rainfall intensity. Comparison with the previous studies shows that KICT-ERS provides rainfall distribution above average CU.

• Transactions of the Korean hydrogen and new energy society
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• v.17 no.4
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• pp.403-408
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• 2006

The plate reformer consisting of combustion chamber and reforming chamber for 25 kW MCFC stack has been operated and computational fluid dynamics was applied to estimate reactions and thermal fluid behavior in the reformer. The methane air 2-stage reaction was assumed in the combustion chamber, and three step steam reforming reactions were included in the calculation. Flow uniformity, reaction rate and species distribution, and temperature distribution were analyzed. In particular, temperature distribution was compared with the measurements to show good agreement in the combustion chamber, however, inappropriate agreement in the reformer chamber.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.3
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• pp.120-126
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• 2018

In the present study, the multi-nozzle electrospinning process is investigated for the fabrication of uniform polymer nanofiber mats. Electrospinning has been one of the simple and efficient methods to manufacture polymer nanofibers and their mats. Although a typical electrospinning has many advantages such as simple system and operation, various materials, and cost-effectiveness, a relatively low productivity prevents it from being used in practical applications. Thus, the multi-nozzle electrospinning system with the adjustable nozzle position and rotating drum collector is designed and produced in this study. In particular, the effects of the inter-nozzle distance and spatial arrangement of nozzles on the uniformity of the electrospun nanofibers are investigated. With this multi-nozzle electrospinning process, the maximum flow rate of the supplied polymer solution for a uniform electrospinning increases, which indicates the enhanced productivity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.203-207
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• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.

• Journal of Korean Society for Atmospheric Environment
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• v.22 no.E1
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• pp.9-18
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• 2006

Aerosol hygroscopic properties were measured by a tandem differential mobility analyzer (TDMA) system during the Aerosol Characterization Experiment (ACE)-Asia campaign from 31 March to 1 May 2001. Two high flow differential mobility analyzers (DMAs) were used to maximize the count rate on board the Center for Interdisciplinary Remotely Piloted Aircraft (CIRPAS) Twin Otter aircraft. Hygroscopic growth factor distributions of particles having initial dry nanoparticle diameters of 0.040, 0.059, 0.086, 0.126, 0.186, 0.273, 0.400, and $0.586{\mu}m$ were measured during 19 research flights. Data collected during 12 of those flights were used to investigate aerosol mixing state and the influence of aerosol source region on size-resolved hygroscopicity. The uniformity in size-resolved hygroscopicity was quantified to facilitate comparison between measurements made in different air masses. Hygroscopic growth factors are strongly dependent on source region and sizes. Mean hygroscopic growth factors were observed to be greatest when the air mass origin was from the south. The mean growth factors for continental sources decreased with initial size from 1.47 to 1.27 for $0.040{\mu}m\;and\;0.586{\mu}m$, but increased with initial size from 1.44 to 1.8 for $0.040{\mu}m\;and\;0.400{\mu}m$ dry diameters for marine sources.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.150.1-150.1
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• 2014

Showerhead is used as a main part in the semiconductor equipment. The face plate flatness should remain constant and the cleaning performance must be gained to keep the uniformity level of etching or deposition in chemical vapor deposition process. High operating temperature or long period of thermal loading could lead the showerhead to be deformed thermally. In some case, the thermal deformation appears very sensitive to showerhead performance. This paper describes the methods for robust design using computational fluid dynamics. To reveal the influence of the post distribution on flow pattern in the showerhead cavity, numerical simulation was performed for several post distributions. The flow structure appears similar to an impinging flow near a centered baffle in showerhead cavity. We took the structure as an index to estimate diffusion path. A robust design to reduce the thermal deformation of showerhead can be achieved using post number increase without ill effect on flow. To prevent the showerhead deformation by heat loading, its face plate thickness was determined additionally using numerical simulation. The face plate has thousands of impinging holes. The design key is to keep pressure drop distribution on the showerhead face plate with the holes. This study reads the methodology to apply to a showerhead hole design. A Hagen-Poiseuille equation gives the pressure drop in a fluid flowing through such hole. The assumptions of the equation are the fluid is viscous-incompressible and the flow is laminar fully developed in a through hole. An equation can be expressed with radius R and length L related to the volume flow rate Q from the Hagen-Poiseuille equation, $Q={\pi}R4{\Delta}p/8{\mu}L$, where ${\mu}$ is the viscosity and ${\Delta}p$ is the pressure drop. In present case, each hole has steps at both the inlet and the outlet, and the fluid appears compressible. So we simplify the equation as $Q=C(R,L){\Delta}p$. A series of performance curves for a through hole with geometric parameters were obtained using two-dimensional numerical simulation. We obtained a relation between the hole diameter and hole length from the test cases to determine hole diameter at fixed hole length. A numerical simulation has been performed as a tool for enhancing showerhead robust design from flow structure. Geometric parameters for the design were post distribution and face plate thickness. The reinforced showerhead has been installed and its effective deposition profile is being shown in factory.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.4
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• pp.318-331
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• 1995

The c - axis oriented single crystal of $LiNbO_3$ and $LiNbO_3$ : 5mol%MgO was success-fully grown by Floating zone method using halogen lamp as a heat source. The effects of the sintering condition of the feed rod and the atmosphere gas during the crystal growth on the be havior of the feed rod/melt interface were studied for growing crystal with the high quality, and then, the optimum growth conditions were determined by studying the experimental param eters, such as gas flow rate, pulling rate, rotation speeds of the feed rod and the seed. The grown crystals were analyzed using the chemical etching to observe the tch pattern and the ICP (Inductively Coupled Plasma) to determine the composition uniformity and the impurity content of Fe. The effects of additive (5 mol % MgO) on the transmittance and refractive index was, also, analyzed. In order to compare the nonlinear optical oharacteristics of $LiNbO_3$ with those of the other optical materials, the nonlinear optical refractive index ($n_2$) was calcu l lated using the measured refractive index.