• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.13-13
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• 2009

We have investigated the fabrication and properties of bendable PZT film formed on plastic substrates for the application in flexible memory. These devices used the PZT active layer formed on $SiO_2/Si$ wafer by sol-gel method with optimized device layouts and Pt electrodes. After etching Pt/PZT/Pt layers, patterned by photolithography process. these layers were transferred on PET plastic substrate using elastomeric stamp. The level of performance that can be achieved approaches that of traditional PZT. devices on rigid bulk wafers.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.384-384
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• 2011

Carbon nanotubes (CNTs) have been studied as an ideal material for field emitters due to the high aspect ratio, excellent electrical property and good mechanical strength. There were many reports on CNT emitters fabricated on rigid substrates, but rare reports about CNT flexible field emitters. Recently, we considered that CNTs can be a good candidate for a flexible field emitter material because of their excellent Young's modulus and elasticity, which could not be achieved with metal tips or semiconducting nanowire tips. In this work, we demonstrated the CNT flexible field emitters fabricated by a simple method and studied the field emission properties of the CNT flexible field emitters under various bending conditions. The flexible field emitters showed stable and uniform emission characteristics. Especially, there is no remarkable change of the field emission properties at the CNT flexible field emitters according to the bending conditions. The CNT flexible field emitters also exhibited a good field emission performance like the low turn-on field and high emission current. Therefore, we suggest that the CNT flexible emitters can be used in many practical applications under different bending conditions.

• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.32-35
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• 2002

In this work, we test electrode material of TFD (Thin Film Diode) device subject to flexible substrate. Al, that is ductile metal, was proper for flexible electrode to fabricate flexible display. The fabricated devices had symmetric electrode structure on both sides of insulation layer. The electrode was made of ductile Al so as to reduce the mismatch of properties between the electrode and substrate. The TFD device was successfully fabricated applying our own etch-free process. Electrical properties were improved by post-annealing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.289-290
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• 2005

We have investigated the electro-optical (EO) performances of the flexible liquid crystal display (LCD) on twisted nematic (TN) mode according to variation of cell gap in comparison with glass LCD. There were four kinds of cells which were having cell gaps of 3$\mu$m, 4$\mu$m and 5$\mu$m, especially the lowest 2$\mu$m on flexible and glass substrates separately. The EO performances of the flexible cells on the rubbed potyimide (PI) were almost the same those of glass cells. The response time of flexible cells was shorter than that of glass cells but the alignment of liquid crystal (LC) of flexible cells was weaker than that of glass cells. The residual DC of flexible cells was on the increase like that of glass cells in compliance with lowering cell gap.

• Fire Science and Engineering
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• v.15 no.3
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• pp.7-13
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• 2001

In this paper, we had analyzed comsbustion gases according to pyrolysis $600^{\circ}c$, $800^{\circ}c$ and $1000^{\circ}c$ for polymeric material using a GASTEC colorimetric gas detector tube in order to combustion gases toxicity evaluation for flame retardant untreated ply wood, flame retardant treated ply wood, flexible polyvinyl chloride and flexible polyurethane foam of polymeric material. As a result, comsbustion gases producted from small specimens of polymeric material had reached fatal to man at a 30 minute exposure time that had possesed toxicity index. Toxicity index at pyrolysis $800^{\circ}c$ of flexible polyvinyl chloride was 31.74. Flexible polyvinyl chloride was the highest toxicity index of flame retardant untreated ply wood, flame retardant treated ply wood, flexible polyvinyl chloride and flexible polyurethane foam. The comsbustion gases producted commonly no concern with pyrolysis temperature had analyzed carbon dioxide($CO_2$) and carbon monoxide(CO). Toxicity index had investigated differently according to pyrolysis temperature even a similar materal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1224-1231
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• 2003

This paper reports on the air-gap type thin film bulk acoustic wave resonator(FBAR) using ultra thin wafer with thickness of 50$\mu\textrm{m}$. It was fabricated to realize a small size devices and integrated objects using MEMS technology for flexible microsystems. To reduce a error of experiment, MATLAB simulation was executed using material characteristic coefficient. Fabricated thin FBAR consisted of piezoelectric film sandwiched between metal electrodes. Used piezoelectric film was the aluminum nitride(AlN) and electrode was the molybdenum(Mo). Thin wafer was fabricated by wet etching and dry etching, and then handling wafer was used to prevent damage of FBAR. The series resonance frequency and the parallel frequency measured were 2.447㎓ and 2.487㎓, respectively. Active area is 100${\times}$100$\mu\textrm{m}$$^2$.Q-factor was 996.68 and K$^2$$\_$eff/ was 3.91％.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Journal of Ocean Engineering and Technology
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• v.29 no.1
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• pp.70-77
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• 2015

The purpose of this study was to provide fundamental data for an anchor collision simulation of an FCM (flexible concrete mattress). Numerical material models (elastic-perfectly plastic model, Drucker-Prager model, and RHT concrete model) were compared. ANSYS Explicit Dynamics was used for collision analyses. An FE model was used for the anchor, FCM, andreinforcement bars. The results showed that the behavior of the FCM was verydifferent that those ofthe material models. In particular, the effect of the pressure dependent strength was most noticeable among the properties of concrete.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2005.11a
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• pp.79-83
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• 2005

In the reinforced concrete structure, Even if speak that water leakage occurrence is no problem to material, there is a lot of reasons construction factor, material damage by behavior structure, properties of matter change by years and water leakage part by environment condition. so, waterproofing technological consideration should be gone ahead. In this research, we will study about stick performance, concrete surface adhesive, damage and blow. we will check all things and test it. The stick expansion type complex of flexible material passed on result of standard. It is conducive to concrete of durability by waterproofing layer performance demobilitation technology on the water leakage structure for solution of problem and repair