• ETRI Journal
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• v.33 no.1
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• pp.121-124
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• 2011

Digital harmonics, which may reduce the radio frequency sensitivity of a system, can be coupled with an antenna in a mobile handset. This letter presents a decoupling method for increasing the isolation between digital harmonics on a flexible printed circuit board (FPCB) and an antenna in terms of the ground mode current and the concept of reaction. We model the signal and ground lines in an FPCB as a loop circuit exciting a ground mode current and demonstrate a simple but efficient decoupling method for reducing the excited ground mode current.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.5
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• pp.879-886
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• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Journal of Power Electronics
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• v.10 no.6
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• pp.611-620
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• 2010

This paper presents a new architecture, called "Power Electronics Remote Wiring and Measurement Laboratory (PermLAB)", that translates a common gateway interface (CGI) string from a remote web user to a web server connected to a 3-dimension switching matrix board, can be used to switch on and off, and to control a cluster of instruments and components. PermLAB addresses real-time connection, switching, and data acquisition over the Internet instead of using simulated data. A software procedure uses a signature system to identify each instrument and component in a complex system. The Web-server application is developed in HTML, JavaScript and Java, and in C language for the CGI interface, which resides in a controller portion of LabVIEW. The LabVIEW software fully integrates the Web sever, LabVIEW data acquisition boards and controllers, and the 3-dimensional switching matrix board. The paper will analyze a half-wave rectifier (AC - DC converter) circuit connected over the Internet using the PermLAB. PermLAB allows students to obtain real data by real-time wiring of real circuits in the laboratory using a "virtual breadboard" on the Web. The software for the Web-based 3-dimensional system is flexible, portable, can be integrated into many laboratory applications or expanded, and easily accessible worldwide.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.3022-3024
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• 2005

연성 PCB(flexible printed circuit board)는 현재 노트북 PC와 디지털 카메라등에 적용되며, 굴곡성이 강하고 소형화 및 조립에 용이하여 주로 기판 사이나주기판과 외부 커넥터사이에 데이터의 전송매체로써 널리 사용되는 핵심부품이다. 근래에 개발되는 PCB 기반의 고성능 신호처리회로들은 데이터 전송율이 수백 MHz에서 수 GHz에 이르고 있으며, 신호선과 유전체, 접지판의 구조적 특성에 따라서, 반사 효과와 같은 신호무결성 문제들이 파생되어 신호의 최대성능을 제한하게된다. 이에 따라 적절한 임피던스 제어를 통하여 고성능신호들의 왜곡을 상쇄시키는 기술이 중요하게 되었다. 본 논문에서는 연성 PCB 전송라인을 위한 임피던스 모델을 대상으로 각 모델의 주요 특징 및 정확성을 분석하였다. 연성 PCB의 전송라인은 보통 전통적인 마이크로스트립 라인의 특성 임피던스 모델에 비해 신호선의 너비가 크며, 이를 반영한 개선된 수학적 임피던스 모델들이 제안되어 있다. 따라서 본 논문은 기존의 마이크로스트립 전송라인과 연성 PCB 전송라인에 적합한 수학적 모델들을 이용하여 신호 무결성 문제를 모의할 수 있는 CAE(computer-aided engineering) 도구의 임피던스 측정 결과를 비교 및 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of Institute of Control, Robotics and Systems
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• v.2 no.4
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• pp.337-343
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• 1996

In this paper, we investigate the defect detection by making use of pre-made reference image data and classify the defects by using the artificial neural network. The approach is composed of three main parts. The first step consists of a proper generation of two reference image data by using a low level morphological technique. The second step proceeds by performing three times logical bit operations between two ready-made reference images and just captured image to be tested. This results in defects image only. In the third step, by extracting four features from each detected defect, followed by assigning them into the input nodes of an already trained artificial neural network we can obtain a defect class corresponding to the features. All of the image data are formed in a bit level for the reduction of data size as well as time saving. Experimental results show that proposed algorithms are found to be effective for flexible defect detection, robust classification, and high speed process by adopting a simple logic operation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.90-98
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• 2021

Piezoelectric ceramic fiber composite (PCFC) was fabricated using a planar electrode printed piezoelectric ceramic fiber driven in transverse mode for small-scale wind energy harvester applications. The PCFC consisted of an epoxy matrix material and piezoelectric ceramic fibers sandwiched by interdigitated electrode (IDE) patterned polyimide films. The PCFC showed an excellent mechanical performance under a continuous stress. For the fabrication of PCB cantilever harvester, five -PCFCs were vertically attached onto a flexible printed circuit board (PCB) substrate, and then PCFCs were serially connected through a printed Cu circuit. The energy harvesting performance was evaluated applying an inverted structure, which imples its free leading edge located at an open end but the trailing edge at a clamped end, to enhance strain energy in a wind tunnel. The output voltage of the PCB cantilever harvester was increased as the wind speed increased. The maximum output power was 17.2 ㎼ at a resistance load of 200 ㏀ and wind speed of 9 m/s. It is considered that the PCB cantilever energy harvester reveals a potential use for wind energy harvester applications.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.132-132
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• 2013

본 연구는 R/F-PCB(Rigid/Flexible Printed circuit Board)의 Cu Pattern에 최종 표면처리 방법으로 사용되는 ENIG(Electroless Ni/Immersion Gold) 공정을 대체하여 ECIG(Electroless Co/Immersion Gold)공정을 적용하고자 하는 것으로 무전해 니켈 도금의 장점인 고경도, 내마모성, 납땜성, 내식성을 가지면서 니켈 도금의 취약점인 연성을 개선한 도금액을 개발하고자 하였다. 개발된 도금액을 이용하여 Cu Pattern에 도금할 경우 일반 무전해 니켈 도금에서 나타나는 불량 원인 중 하나인 Space 부분에 도금이 되는 현상이 현저히 감소하였으며, 연성 또한 향상됨을 관찰할 수 있었다.

• Journal of the Korea Institute of Military Science and Technology
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• v.18 no.5
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• pp.525-531
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• 2015

In this paper, a novel impact sensing device for an ESAF(Electronic Safe and Arming Fuze) is presented. An impact sensing device is mounted in front of a weapon, and it detects an impact when it crashes against a target. There are two main design requirements to enhance the firing functional reliability of the ESAF; an operational reliability and a reduced latency, which is a delay time needed for sensing the impact. The design method of the contact-type impact sensing device, which employs an FPCB(Flexible Printed Circuit Board) so it can be used other weapons, is proposed. The tests demonstrated that the design described in this work show a reduced delay time with ensuring the operational reliability.