• Title/Summary/Keyword: Flexible Manufacturing

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Design and Analysis of Efficient Operation Sequencing in FMC Robot Using Simulation and Sequential Patterns (시뮬레이션과 순차 패턴을 이용한 FMC 로봇의 효율적 작업 순서 설계 및 분석)

  • Kim, Sun-Gil;Kim, Youn-Jin;Lee, Hong-Chul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.6
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    • pp.2021-2029
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    • 2010
  • This paper suggested the method to design and analyze FMC robot's dispatching rule using the Simulation and Sequential Patterns. To do this, first of all, we built FMC using simulation and then, extracted signals that facilities call a robot, saved it as the log type. Secondly, we built robot's optimal path using the Sequential Pattern Mining with the results of analyzing the log and relationship between machine and robot actions. Lastly, we adapted it to the A corp.'s manufacturing line for verifying its performance. As a result of applying the new dispatching rule in FMC, total throughput and total flow time decrease because of decreasing material loss time and increasing robot utility. Furthermore, because this method can be applied for every manufacturing plant using simulation, it can contribute to advance total FMC efficiency as well.

Investigating the Effect of Photoinitiator Types and Contents on the Photocuring Behavior of Photocurable Inks and Their Applications for Etching Resist Inks (광개시제 종류 및 함량에 따른 광경화형 잉크의 광경화 특성과 인쇄회로기판용 에칭 레지스트 소재로의 적용성 연구)

  • Bo-Young Kim;Subin Jo;Gwajeong Jeong;Seong Dae Park;Jihoon Kim;Eui-Keun Choi;Myong Jae Yoo;Hyunseung Yang
    • Applied Chemistry for Engineering
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    • v.34 no.4
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    • pp.444-449
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    • 2023
  • As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

Carbon strain sensor using Nd: YAG laser Direct Writing (Nd:YAG Laser 직접 각인을 이용한 Carbon 스트레인 센서)

  • Joo, Donghyun;Yoon, Sangwoo;Kim, Joohan;Park, Woo-Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.1
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    • pp.35-40
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    • 2018
  • Nd:YAG laser was used to carbonize polyimide films to produce carbon films. This is a simple manufacturing process to fabricate low cost sensors. By applying this method, we studied characteristics of flexible and low-cost piezoresistive. Previously, many studies focused on carbonization of polyimide using $CO_2$ laser with wavelength of $10.6{\mu}m$. In this paper, carbonization (carbonization process) was performed on polyimide films using an Nd:YAG laser with a wavelength of $1.064{\mu}m$. In order to increase the resolution, we optimized the laser conditions of the power density ($W/cm^2$) and the beam scan rate. In previous studies using $CO_2$ laser, the minimum line width was $140{\sim}220{\mu}m$ but in this study, carbon line width was reduced to $35{\sim}40{\mu}m$. The initial sheet resistance of the carbon sensor was $100{\sim}300{\Omega}/{\square}$. The resistance decreased by 30% under stretched with a curvature radius of 21 R. The calculated gauge factor was 56.6. This work offers a simple, highly flexible, and low-cost process to fabricate piezoresistive sensors.

Design of Vision Based Punching Machine having Serial Communication

  • Lee, Young-Choon;Lee, Seong-Cheol;Kim, Seong-Min
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.2430-2434
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    • 2005
  • Automatic FPC punching instrument for the improvement of working condition and cost saving is introduced in this paper. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. 3D Mechanical design tool(Pro/E) is used to manage the exact tolerance circumstances and avoid design failures. Simulation is performed to make the complete vision based punching machine before assembly, and this procedure led to the manufacturing cost saving. As the image processing algorithms, dilation, erosion, and threshold calculation is applied to obtain an exact center position from the FPC print marks. These image processing algorithms made the original images having various noises have clean binary pixels which is easy to calculate the center position of print marks. Moment and Least square method are used to calculate the center position of objects. In this development circumstance, Moment method was superior to the Least square one at the calculation of speed and against noise. Main control panel is programmed by Visual C++ and graphical Active X for the whole management of vision based automatic punching machine. Operating modes like manual, calibration, and automatic mode are added to the main control panel for the compensation of bad FPC print conditions and mechanical tolerance occurring in the case of punch and die reassembly. Test algorithms and programs showed good results to the designed automatic punching system and led to the increase of productivity and huge cost down to law material like FPC by avoiding bad quality.

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Parametric Study on 3-way Switch Design Considering Levitation Stability of Maglev Train (자기부상열차의 부상안정성을 고려한 3방향 분기기의 설계 파라미터 연구)

  • Lee, Younghak;Han, Jong-Boo;Lim, Jaewon;Lee, Jong-Min
    • Journal of the Korean Society for Railway
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    • v.19 no.2
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    • pp.135-144
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    • 2016
  • It is essential to lighten the weight of switch girders in order to reduce their costs of manufacturing and make it easier to use them in construction. Lightening the weight of switch is also important to the Maglev 3-way switches system, however, the design variables should be considered very carefully if lightening is to be applied to the system, because these variables are vitally related to the levitation stability. Because Urban Maglev trains have a structure in which train bogie wraps around the guiderail, the adjustment of a girder's height is a possible way to reduce the weight. The safety of the application of this concept is ensured by repeated experiments in a test bed, however, due to a lack of space and budget limits, the design parametric study for the system model can substitute for actual application. The purpose of this paper is to study the design parameters that are concerned with levitation stability while a Maglev train is running on the Maglev 3-way system depending on the weight of the switch girders. In this study, switch girder weight is reduced by adjustment of girder height and girders are and modeled as a flexible body. The effect of the adjustment of girder height on the levitation stability can be analyzed by comparing the velocity of the train when it passes the switch girders, with the lateral gap, and the levitation gap which are obtained from the co-simulation of the Maglev train's dynamics model and flexible switching system. The results of this research will be used to design a Maglev switch.

Flexible Unit Floor Plan of a Modular House Considering the Production System (생산 시스템을 고려한 모듈러주택의 가변형 평면계획 연구)

  • Lee, Ji-Eun
    • Land and Housing Review
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    • v.12 no.3
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    • pp.67-78
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    • 2021
  • After World War II, modular housing was developed as a means of quickly and efficiently meeting the housing supply demand. For the past 30 plus years, efforts have been made to improve modular housing in South Korea and to increase their competitiveness in the housing market. This study investigated modular houses based on a steel framed rahem structure which provides a flexible floor plan where walls are easily reconfigured to create rooms of various sizes and functions. Similar to the factory production methods used in the automotive industry, the modular housing industry can also benefit by standardizing such aspects as building components, manufacturing and construction methods, materials, process management, and floor plans. This study examined the feasibility of using a 3m × 3m module for developing various floor plans which are easy to produce and transport. Each 3m × 3m module can be configured to meet different living needs resulting in a complete home when multiple modules are connected. The module configurations can be varied to meet ground transportation and crane limitations. This study found that a 3m × 3m steel framed modular unit is a promising step towards providing residents with plans that meet their living preferences while improving and increasing the supply of modular houses.

The Effect of Workplace Flexibility on Employees' Organizational Commitment (직장 유연성이 종업원의 조직몰입에 미치는 영향)

  • Chang, Ouk-jin;Lee, Sang-jik
    • Journal of Venture Innovation
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    • v.6 no.3
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    • pp.185-202
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    • 2023
  • The COVID-19 pandemic catalyzed major changes in our work environment, underscoring the critical role of workplace flexibility. While a wealth of research exists on specific flexible work strategies and schedules, a broader understanding of workplace flexibility has been somewhat overlooked. This study aimed to bridge this gap by examining the correlation between workplace flexibility and organizational commitment. Our sample consisted of 300 employees from foreign businesses in the ICT(information and communications technology) service sector and the manufacturing industry, along with those from the top 50 leading Korean enterprises. We bifurcated workplace flexibility into two distinct categories for this study: quantitative and qualitative. Our results revealed that within the quantitative category, the flexibility of continuity of work and flexible place significantly enhanced organizational commitment. Interestingly, the flexibility of work schedules didn't have a marked impact on commitment levels. On the qualitative side, job autonomy and teamwork emerged as significant drivers of organizational commitment. It's worth noting that qualitative aspects of workplace flexibility had a more pronounced effect on organizational commitment than the quantitative elements. These findings highlight the necessity of approaching workplace flexibility from a comprehensive perspective, embracing both its quantitative and qualitative dimensions. For businesses aiming to maximize the benefits of flexibility, it's essential to cultivate a culture of open communication, champion collaboration, and prioritize job autonomy and teamwork. Establishing a work environment that actively supports feedback-oriented communication stands as a key component in this endeavor.

Recent Progress in Micro In-Mold Process Technologies and Their Applications (마이크로 인몰드 공정기술 기반 전자소자 제조 및 응용)

  • Sung Hyun Kim;Young Woo Kwon;Suck Won Hong
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.1-12
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    • 2023
  • In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.

Soft-lithography for Manufacturing Microfabricated-Circuit Structure on Plastic Substrate (플라스틱기판 미세회로구조 제조를 위한 소프트 석판 기술의 적용)

  • Park, Min-Jung;Ju, Heong-Kyu;Park, Jin-Won
    • Korean Chemical Engineering Research
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    • v.50 no.5
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    • pp.929-932
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    • 2012
  • Novel platform technology has been developed to replace the photolithography used currently for manufacturing semiconductors and display devices. As a substrate, plastics, especially polycarbonates, have been considered for future application such as flexible display. Other plastics, i.e. polyimide, polyetheretherketon, and polyethersulfone developed for the substrate at this moment, are available for photolithography due to their high glass transition temperature, instead of high price. After thin polystyrene film was coated on the polycarbonate substrate, microstructure of the film was formed with polydimethylsiloxane template over the glass transition temperature of the polystyrene. The surface of the structure was treated with potassium permanganate and octadecyltrimethoxysilane so that the surface became hydrophobic. After this surface treatment, the nanoparticles dispersed in aqueous solution were aligned in the structure followed by evaporation of the DI water. Without the treatment, the nanoparticles were placed on the undesired region of the structure. Therefore, the interfacial interaction was also utilized for the nanoparticle alignment. The surface was analyzed using X-ray photoelectron spectrometer. The evaporation of the solvent occurred after several drops of the solution where the hydrophilic nanoparticles were dispersed. During the evaporation, the alignment was precisely guided by the physical structure and the interfacial interaction. The alignment was applied to the electric device.

Environmental Life Cycle Assessments on Nano-silver Inks by Wet Chemical Reduction Process (습식환원법으로 제조한 은나노 잉크의 환경 전과정 평가)

  • Lee, Young-Sang;Hong, Tae-Whan
    • Clean Technology
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    • v.21 no.2
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    • pp.85-89
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    • 2015
  • Utilized in a variety of electronic components, electronic components industry with metallic ink technology was established itself as a major technology research and development was gradually increasing, silver ink that is excellent in conductivity and stability, have long been used in the industry of electronic components in recent years and silver ink has been the size of nanoscale particles dispersed by developing display, an electronic tag, a flexible circuit board or the like used in the semiconductor and electronics as has been highlighted in, however industry modernization of equipment by increasing the production and consumption of products generated during the production process and environmental pollutants by use of waste products is expected to bring a serious environmental problem. In this study, prepared by a wet reduction method, the manufacturing process of the silver nano-ink to the entire process of the environmental impact assessment (LCA) was evaluated using the techniques. Life cycle assessment software GaBi 6 was used as received from the relevant agencies of the silver nano-ink data with reference to the manufacturing process, building inventory was international organization for standardization (ISO) 14040, 14044 compliant LCA conducted over four stages.