• 반도체디스플레이기술학회지
• /
• 제19권4호
• /
• pp.46-50
• /
• 2020

In this research, the attractive force of Coulomb type electrostatic chuck(ESC), which consisted of alumina dielectric, on glass substrate was studied by using the finite element analysis. The attractive force is caused by the high electrical resistance which occurs in contact region between glass substrate and dielectric layer. This research tries the simple geometrical modeling of ESC and glass substrate with air gap. The influences of the applied voltage, and air gap are investigated. When alumina dielectric with 1014 Ω·cm, 1.5 kV voltage, and 0.01 mm air gap were applied, electrostatic force in this work reached to 4 gf/㎠. This results show that the modeling of air gap is essential to derive the attractive force of the ESC.

• 전자공학회논문지
• /
• 제49권12호
• /
• pp.95-110
• /
• 2012

유한한 기판 크기가 2 소자 E-평면 마이크로스트립 패치 선형 위상 배열 안테나의 방사 특성에 미치는 영향에 대하여 연구하였다. 서로 다른 유전상수를 가지는 기판을 이용하여 2 소자 E-평면 배열 안테나의 기판 크기에 따른 평균 능동소자패턴 특성을 분석하고 빔 주사각도에 따른 배열 안테나의 방사패턴 특성을 분석하였다. 전산모의 실험 결과 E-평면상에 배열된 2 소자 배열안테나의 방사패턴은 주로 E-평면 기판 가장자리에서 회절되어 방사되는 필드에 의해 결정되며 안테나 소자 간 상호 결합으로 인한 기생 방사가 배열 안테나의 방사패턴에 미치는 영향은 상대적으로 작게 나타났다. 안테나 소자 중심에서 E-평면 방향 기판 가장자리까지의 거리가 $0.35{\lambda}_0$ 일 때 배열 안테나의 방사패턴 특성이 가장 향상되었다.

• 마이크로전자및패키징학회지
• /
• 제20권2호
• /
• pp.33-38
• /
• 2013

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of $22.5{\times}22.5$ mm, $37.5{\times}37.5$ mm and $42.5{\times}42.5$ mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

• 대한기계학회논문집A
• /
• 제35권11호
• /
• pp.1471-1476
• /
• 2011

자동차 배기계의 앞쪽에 배치된 촉매변환기는 배기가스 중 유해한 성분을 무해한 것으로 변환하는 제품이다. 이것의 중심부인 담체는 단면의 윤곽이 원형이나 타원형이고 내부는 미세한 격자형 벽으로 채워진다. 담체를 매트로 두르고 캔에 넣는 캐닝공정 중 과대한 압력을 받아서 담체가 취성파괴될 것이 염려된다. 담체의 파괴를 방지하고자 매트의 압력의 분포를 예측하는 유한요소 프로그램을 개발하였다. 이것은 Microsoft EXCEL로 작성되어 입출력이 모두 간편하다. 담체는 강체, 캔은 선형탄성체로 단순하게 취급하고 매트의 재료비선형성을 고려하였다. 캔은 굽힘과 균일인장이나 압축에 저항하는 것으로 모델링하였다. 편의상 요소의 갯수는 35개, 반복 횟수는 20회로 제한하였다. ABAQUS의 해석결과와 잘 일치하여 본 프로그램의 타당성을 입증하였다.

• Computers and Concrete
• /
• 제21권5호
• /
• pp.593-605
• /
• 2018

A nonlinear finite element modeling approach is developed to assess the behavior of a dowel bar embedded on a single concrete block substrate, subjected to monotonic loading. In this approach, a discrete representation of the steel reinforcing bar is considered, using beam finite elements with nonlinear material behavior. The bar is connected to the concrete embedment through nonlinear Winkler spring elements. This modeling approach can only be used if a new constitutive model is developed for the spring elements, to simulate the deformability and strength of the concrete substrate. To define this constitutive model, an extensive literature review was conducted, as well as 3 experimental tests, in order to select the experimental data which can be used in the calibration of the model. Based on this data, an empirical model was established to predict the global dowel response, for a wide range of bar diameters and concrete strengths. This empirical model provided the information needed for calibration of the nonlinear Winkler spring model, valid for dowel displacements up to 4 mm. This new constitutive model is composed by 5 stages, in order to reproduce the concrete substrate response.

• 한국윤활학회:학술대회논문집
• /
• 한국윤활학회 2001년도 제34회 추계학술대회 개최
• /
• pp.331-340
• /
• 2001

Elastic-Plasitc Finite element analysis is peformed about the TiN coated medium. The normal contact is simulated by a rigid asperity pressing the surface of an elastic-plastic half-surface. The case of a surface film stiffer than the substrate is considered, and general solutions for the subsurface stress and deformation fields are presented for several coating thickness. Additionally, the critical normal loads for deformation in the substrate and coating fracture are calculated when the yield of TiN film follows the Maximum Principal Stress Theory and Von Mises Theory. The results can be subsumed in failure maps for TiN thin film on steel.

• Journal of Electrical Engineering and Technology
• /
• 제10권1호
• /
• pp.320-324
• /
• 2015

Mutual coupling between antenna elements of a linear microstrip patch antenna array positioned along the H-plane including the effect of edge reflections is investigated. Simple formulas are presented for the estimation of the grounded dielectric substrate size with minimum mutual coupling. The substrate sizes calculated by these formulas are in good agreement with those obtained by the full-wave simulation and experimental measurement. The substrate size with minimum mutual coupling is a function of the effective dielectric constant for surface waves and the distance between the antenna centers. The substrate size with minimum mutual coupling decreases as the effective dielectric constant for surface waves on a finite grounded dielectric substrate increases.

• 반도체디스플레이기술학회지
• /
• 제10권4호
• /
• pp.113-118
• /
• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Structural Engineering and Mechanics
• /
• 제74권2호
• /
• pp.215-225
• /
• 2020

Thin films easily wrinkle under compressive loading due to their small bending stiffness resulting from their tiny thickness. For a thin film deposited on a functionally graded substrate with non-uniform stiffness exponentially changes along the length span in this paper, the uniaxial wrinkling problem is solved analytically in terms of hyper-Bessel functions. For infinite, semi-infinite and finite length systems the wrinkling load and wrinkling wavenumber are determined and compared with those in literature. In comparison with a homogeneous substrate-bounded film in which the wrinkling pattern is uniform along the length span, for a functionally graded substrate-film system the wrinkles accumulate around the softer location of the functionally graded substrate. Therefore, the effective length of the film influenced by the wrinkles decreases, the amplitude of the wrinkles on softer regions of the functionally graded substrate grows and the wrinkling load of the functionally graded substrates with higher softening rate decreases more. The results of the current research are expected to be useful in science and technology of thin films and wrinkling of the structures especially living tissues.

• 마이크로전자및패키징학회지
• /
• 제27권3호
• /
• pp.61-67
• /
• 2020

본 논문에서는 FEM(유한요소) 기법을 사용하여 칩이 실장되는 않은 substrate와 칩이 실장된 substrate의 warpage를 해석하여 칩의 실장이 warpage에 미치는 영향을 비교·분석하였다. 또한, warpage를 감소시키기 위한 substrate의 층별 두께의 영향도 분석과 층별 두께 조건을 다구찌법에 의한 신호 대 잡음 비로 분석하였다. 해석 결과에 의하면 칩이 실장되면 substrate의 warpage는 패턴의 방향이 변할 수 있고, 칩이 실장되면서 패키지의 강성도(stiffness)가 증가하고, 패키지 상·하의 열팽창계수의 차이가 작아지면서 warpage는 감소하였다. 또한, 칩이 실장되지 않은 substrate를 대상으로 설계 파라메타의 영향도 분석 결과에 의하면 warpage를 감소시키기 위해서는 회로층 중에서 내층인 Cu1과 Cu4를 중점 관리하고, 다음으로 바닥면의 solder resist 층의 두께와 Cu1과 Cu2 사이의 프리프레그 층의 두께를 관리해야 한다.