• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.108-113
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• 2011

There are a lot of PDP TV for a plasma discharge pulse voltage generated by the use of electromagnetic waves. EMI mesh film is near Infrared ray caused by malfunction of the remote control intended to prevent this phenomenon. In this study, the formation of fine pattern by making the mold is imprinted on the film sheet. EMI mesh film has been granted by filling in the conductive material region imprinted with electroforming in the manufacture of resistance. The fine patterns fabricated with electroforming facility thickness of homogenization process technology were established to optimize the working conditions.

• The Korean Journal of Cytopathology
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• v.1 no.2
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• pp.175-178
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• 1990

A case of metastatic adenoid cystic carcinoma of the lung, originated from the trachea, was diagnosed by fine needle aspiration. Although the cytologic features of adenoid cystic carcinoma have been well described, it is easy to confuse adenoid cystic carcinoma with more common primary small cell neoplasms of the lung, i.e., small cell carcinoma, well differentiated adenocarcinoma, and carcinoid tumor of the lung. The features distinguishing adenoid cystic carcinoma from these neoplasms include 1) tight, globular, honeycomb pattern of cells, 2) acellualr basement membrane material in the lumen, and 3) cells lacking true nuclear melding and having bland chromatin pattern. The morphologic feature of metastatic adenoid cystic carcinoma in this case was so distinctive as to permit a definite diagnosis by aspiration cytology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.583-584
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• 2006

Printing technology has begun to get into the spotlight in many ways due to the low cost effectiveness to existent semi-conductor process. It also has very useful application areas, not only paper printing but also patterning for LCD color tilter, Photovoltaic patterning, RFID antenna, OLED, and so on. In this study, an apparatus of gravure offset printing was developed for fine line width printing. The pattern was composed of $20{\mu}m$ size of continuous lines of which pitch size was $40{\mu}m$. The printed pattern shows that it is possible to make around $20{\mu}m$ line-width printing pattern. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. For testing of multi-layer printing, the system was designed to be capable of printing two different materials from each printing unit using gravure-offset printing method and have a function of alignment of two printed materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.929-930
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• 2012

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.107-108
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• 2000

We propose the method which is possible to fabricate the electrodes with the fine pattern and low resistance by photolithography and electroplating. The widths of pattern fabricated were 30, 50, 70 and 100um and the thickness could be up to $10{\mu}m$. The resistivity of the copper electrode electroplated was below $2.0{\mu}{\Omega}$ cm which is about half of photosensitive silver electrode. Dielectric layer was coated on the electrodes by screen printing and the pores harmful to the discharge were not formed after heat treatment. In the viewpoint of resistance and patterning, this method has much higher potential for large area display than other methods like screen printing, photosensitive conductive paste method and sputtering.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3660-3665
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• 2012

For blind equalization, it is necessary to open an eye pattern quickly in the early stage of equalization, after that it is important to lower an error level of equalizer output signal. This paper discusses coarse error estimation using signal points specifically determined and fine error estimation using original signal constellation, and proposes two suggestions for how to take advantage of the two error estimation methods. The two error estimates, respectively, are effective to quickly open an eye pattern in the state of eye pattern closed, or to lower the level of an error in the steady-state after the eye pattern opening. Two blind equalization algorithms are proposed and their performances are compared, which select one of the two error estimates depending on the state of convergence of the equalizer, or combine two errors weightedly according to the relative reliabilities of the two error estimates, and calculate the new error.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.3
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• pp.344-349
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• 2017

In this study, we developed a process technology to fabricate RFID tag antennas using a one-sheet inlay micro-pattern forming process by press-molding RFID tag antennas on insulation sheet layers, such as polymer films, using ultrasonic longitudinal vibration. In addition, a fine pattern applicable for RFID tag antennas was manufactured using a $25{\mu}m$ thick thin-plate square wire; this is in contrast to the method that uses a conventional round wire. The developed ultrasonic indentation process can be used to fabricate fine pattern of the RFID antenna using one piece of equipment. The simplified manufacturing process technology has a shorter manufacturing time and is more economical. The developed RFID tag antenna forming technique involves pressing the $25{\mu}m$ square wire directly on the thin sheet insulation sheet of maximum thickness $200{\mu}m$, using a 60 kHz ultrasonic tool horn.

• Journal of Information Display
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• v.10 no.4
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• pp.202-205
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• 2009

An automated circuit repair system was developed for enhancing the yield of nondefective liquid crystal panels, focusing on the resist patterns on the circuit material layer of thin-film transistor (TFT) substrates prior to etching. The developed system has an advantage over the parallel conventional system: In the former, the repair conditions depend on the type of resist whereas in the latter, the repair parameters must be fine-tuned for each circuit material. The developed system consists of a resist pattern defect inspection system and a pattern repair system for short and open defects. The repair system performs fine corrections of abnormal areas of the resist pattern. The open-repair system is equipped with a syringe to dispense resist. To maintain a stable resist diameter, a thermal insulator was installed in the syringe system. As a result, the diameter of the dispensed resist became much more stable than when no thermal insulator was used. The resist diameter was kept within the target of $400{\pm}100{\mu}m$. Furthermore, a prototype system was constructed, and using a dummy pattern, it was confirmed that the system worked automatically and correctly.

• Korean Journal of Childcare and Education
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• v.14 no.4
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• pp.63-83
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• 2018

Objective: The purpose of this study was to analyze how the elements and principles of fine arts were reflected in art related activities in the teacher's manual on standard childcare curriculum for a period of 2 years. Methods: The analysis criteria for the elements of fine arts were modified and complemented based on Kim and Gang(2011) and the same was done for the principles of fine arts based on Lee et al(2015). Results: First, as a result of analyzing the art contents according to life theme in art related activities, 'artistic expression' appeared the most in all nine life themes. Second, as a result of analyzing the art related contents in the standard childcare curriculum for 2 years based on the elements of fine arts, plane, texture, shape, color, volume, line, spot, space, composition, light and shade appeared in order. Third, as a result of analyzing the art related contents on the principles of fine arts, movement, emphasis, variety, unity, rhythm, proportion, balance and pattern appeared in order. Conclusion/Implications: The results of this research suggest that the childcare activities have to be devoloped in order to provide the balanced experiences with fine arts activities.