• Title/Summary/Keyword: Final annealing

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Process Sequence Design of the Inner Skin of Landing Gear Using Stretch Forming Process (스트레치포밍을 이용한 랜딩기어의 내면벽에 대한 공정설계)

  • 강범수;임중연;배진영
    • Transactions of Materials Processing
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    • v.6 no.4
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    • pp.291-299
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    • 1997
  • This paper is concerned with the design of process sequence to form the inner skin of landing gear. The inner skin of landing gear is a part of airplane which is known to be difficult to form its shape. Our study investigates the production method of inner skin and examines the design criteria by three dimensional elastic-plastic finite element method. Based on the results of simulation, design strategy for improving the process sequence is developed using stretch forming process. The final product of inner skin is produced in multi-stage operations with annealing treatment to meet the required capacity of press. The numerical results show that the newly designed process can produce the required part successfully within the design criteria.

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Development of km class Bi-2223/Ag HTS tapes (1km급 Bi-2223/Ag 고온초전도 선재 개발 연구)

  • 하동우;오상수;김상철;양주생;황선역;이동훈;최종규;하홍수;권영길
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.10a
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    • pp.63-66
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    • 2003
  • 1 km length of Bi-2223/Ag superconducting wires were fabricated by stacking, drawing process with advanced heat-treatment schedules. Intermediate annealing was carried out to increase the homogeneity and uniformity of the superconducting filaments embedded in the silver matrix. Phase modification from tetragonal to orthorhombic Bi-2212 by pre heat treatment(PHT) was executed to improve the texture and phase transformation of Bi-2223. Drawing stress was measured to Predict the sausaging and stress limit, Rolling parameters such as thickness, width and winding tension were investigated to roll the tape with uniformity. Critical current of 1 km length of superconducting tapes was measured about 50 A continuously after final sintering.

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The Characteristics of Wire Electrical Discharge Machining and Final Surface Grinding for Titanium Alloy (티타늄합금의 와이어 방전가공과 후처리 연삭가공 특성)

  • 왕덕현;김원일;김종업
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.6
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    • pp.10-16
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    • 2002
  • Titanium alloys have the characteristics of lightness, high strength and good corrosion resistant and are broadly used in manufacturing parts for military and aerospace industries. These alloys are also recognized for organism materials comparatively and used as fixing ones in human body. Nevertheless titanium alloys have excellent properties, it is difficult to machine by traditional methods because of high hardness and chemically activated property. So higher tool wear is expected when cutting by conventional tools, so it is required nontraditional machining process. Finally, the mechanical characteristics such as surface roughness, shape and hardness on studied for wire electrical discharge machined and pound surfaces of titanium alloys for different heat-tested conditions.

Effect of various cold rolling process on the evolution of texture and recrystallized grain size in AA 5052 sheet (AA 5052 판재의 집합조직 발달과 결정립 크기에 미치는 다양한 냉간압연 공정의 영향)

  • Lee, J.H.;Nah, J.J.;Huh, M.Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.408-410
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    • 2008
  • The evolution of texture and microstructure during recrystallization was tracked after different cold rolling of aluminum sheets. Texture of the sheet center were differentiated by different strain states due to prior deformation. The evolution of recrystallization texture was studied with the amount of shear applied during cold rolling. The final grain size after recrystallization annealing was varied due to the effective strain during deformation.

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Polymerase Chain Reaction for the Detection of Aujeszky's Disease Virus (오제스키병 바이러스 검출을 위한 Polymerase Chain Reaction)

  • Hwang, Dong-hee;Yeo, Sang-geon
    • Korean Journal of Veterinary Research
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    • v.43 no.2
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    • pp.239-246
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    • 2003
  • Polymerase chain reaction (PCR) was evaluated for the early detection of Aujeszky's disease virus (ADV) DNA from virus-infected cell cultures. For the purposes, the Korean ADV NYJ1-87 was propagated in swine kidney (SK) cells and subjected to the amplification of DNA (217 bp) by PCR using sense and antisense primers specific to gp50 gene of the ADV. In detection of cell-associated viral DNA, reliable PCR conditions were determined as 30 cycles of reaction consisting 1 minute each of denaturation at $94^{\circ}C$, annealing at $55^{\circ}C$ and polymerization at $72^{\circ}C$. The PCR encountered best results with reagent mixtures of $50{\mu}l$ containing $200{\mu}M$ dNTPs, $0.2{\mu}M$ each sense and antisense primers, 1 mM $MgCl_2$ and 10% (v/v) template DNA in the final concentrations. ADV-specific DNAs were detected as early as 6, 6, and 9 hours post-infection, respectively, from lysates of the SK cells infected with ADV of $10^3$, $10^2$ and $10^1\;TCID_{50}/ml$ by this condition. In culture supernatant, the DNAs were detected from ADV of as low infectivity as $10^ {-3}\;TCID_{50}/ml$ by the reduced reagent concentrations and 30 cycles of 1 minute each of denaturation at $94^{\circ}C$ and annealing at $55^{\circ}C$, and 2 minutes of polymerization at $72^{\circ}C$. The lowest amount of detectable ADV DNA was 1 fg. In conclusion, the PCR condition established in the present study was recognized as a feasible alternative to time-consuming procedures in isolation and characterization of the virus.

Residual stresses and viscoelastic deformation of an injection molded automotive part

  • Kim, Sung-Ho;Kim, Chae-Hwan;Oh, Hwa-Jin;Choi, Chi-Hoon;Kim, Byoung-Yoon;Youn, Jae-Ryoun
    • Korea-Australia Rheology Journal
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    • v.19 no.4
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    • pp.183-190
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    • 2007
  • Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

Preparation and Characteristics of PLT(28) Thin Film Using Sol-Gel Method (Sol-Gel 법을 이용한 PLT(28) 박막의 제작과 특성)

  • Kang Seong Jun;Joung Yang Hee;Yoo Jae-hung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.7
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    • pp.1491-1496
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    • 2005
  • We fabricated the $Pb_{0.72}La_{0.28}TiO_3$ (PLT(28)) thin film successfully by using the sol-gel method and characterized it to evaluate its potential for being utilized as the capacitor dielectrics of ULSI DRAMs. In our sol-gel process, the acetates were used as the starting materials. Through the TGA-DTA analysis, we established the excellent fabrication conditions of the sol-gel method for the PLT(28) thin film. We obtained the dense and crack-free PLT(28) thin film of $100\%$ perovskite phase by drying at $350^{\circ}C$ after each coating and final annealing at $650^{\circ}C$. Electrical properties of PLT(28) thin film were measured through formation on the $Pt/Ti/SiO_2/Si$ substrate and its dielectric constant and leakage current density were measured as 936 and $1.1{\mu}A/cm^2$, respectively.

Study on the Surface Magnetic Domain Structure of Thin-Gauged 3% Si-Fe Strips using Scanning Electron Microscopy with Polarization Analysis

  • Chai, K.H.;Heo, N.-H.;Na, J.g.;Lee, S.R.;Woo, j.s.
    • Journal of Magnetics
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    • v.3 no.2
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    • pp.44-48
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    • 1998
  • Scanning Electron Microscopy with Polarization Analysis (SEMPA) was used to image the surface magnetic domain structure of the 100 ${\mu}{\textrm}{m}$ thick 3% Si-Fe sheet. The thin-gauged 3% Si-Fe strips with magnetic induction ($B_{10}$) from 1.98 to 1.57 Tesla were prepared via conventional metallurgical processes including melting, hot-and cold-rolling, intermediate annealing and final annealing. Using SEMPA, it was observed that the $B_{10}$ (1.98 T) Tesla sample was almost composed of 180$^{\circ}$ stripe domains which are parallel to rolling direction. On the other hand the 3% Si-Fe sheet with $B_{10}$ (1.57 T) Tesla was composed of large 180$^{\circ}$stripe domains that are slanted about 30$^{\circ}$to the rolling direction and complex magnetic domain structures like tree and zigzag pattern. The 180$^{\circ}$stripe domains, which covered a major part of the sample, had (110)<001> Goss texture parallel to the rolling direction. The domain walls between 180$^{\circ}$stripe domains were the conventional Bloch type walls. On the other hand, the 90$^{\circ}$domains, which covered minor part on edge of the sample, were observed in (200) grains. The domain walls between 90$^{\circ}$domains were the Neel type walls. In high magnification, the elliptical singularity at the Neel walls was clearly observed.

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Metal Gate Electrode in SiC MOSFET (SiC MOSFET 소자에서 금속 게이트 전극의 이용)

  • Bahng, W.;Song, G.H.;Kim, N.K.;Kim, S.C.;Seo, K.S.;Kim, H.W.;Kim, E.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.358-361
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    • 2002
  • Self-aligned MOSFETS using a polysilicon gate are widely fabricated in silicon technology. The polysilicon layer acts as a mask for the source and drain implants and does as gate electrode in the final product. However, the usage of polysilicon gate as a self-aligned mask is restricted in fabricating SiC MOSFETS since the following processes such as dopant activation, ohmic contacts are done at the very high temperature to attack the stability of the polysilicon layer. A metal instead of polysilicon can be used as a gate material and even can be used for ohmic contact to source region of SiC MOSFETS, which may reduce the number of the fabrication processes. Co-formation process of metal-source/drain ohmic contact and gate has been examined in the 4H-SiC based vertical power MOSFET At low bias region (<20V), increment of leakage current after RTA was detected. However, the amount of leakage current increment was less than a few tens of ph. The interface trap densities calculated from high-low frequency C-V curves do not show any difference between w/ RTA and w/o RTA. From the C-V characteristic curves, equivalent oxide thickness was calculated. The calculated thickness was 55 and 62nm for w/o RTA and w/ RTA, respectively. During the annealing, oxidation and silicidation of Ni can be occurred. Even though refractory nature of Ni, 950$^{\circ}C$ is high enough to oxidize it. Ni reacts with silicon and oxygen from SiO$_2$ 1ayer and form Ni-silicide and Ni-oxide, respectively. These extra layers result in the change of capacitance of whole oxide layer and the leakage current

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Fabrication and characterization of metal oxide films on textured metal substrates (배향화된 금속기관에서 산화물막의 제조와 분석)

  • Choi, Eun-Chul;Hong, In-Ki;Lee, Chang-Ho;Sung, Tae-Hyun;No, Kwang-Soo
    • 한국초전도학회:학술대회논문집
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    • v.10
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    • pp.111-120
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    • 2000
  • Recently, metal oxide films such as MgO or ZrO$_2$ have been studied as buffer layers to fabricate the superconductor with preferred orientation and as diffusion barriers to prevent the reaction between superconductor and metal substrate. In this research, we focused fabrication and characterization of MgO and ZrO$_2$ films on textured metal substrates. We fabricated MgO and ZrO$_2$ films on the Ni metal sheets by sol-gel dipping method. The microstrcures of the films were investigated by SEM and AES analyses. The films were coated with different cycles and dryed at 400$^{\circ}$C and 500$^{\circ}$C . The final films were heat-treated at 700$^{\circ}$C, 800$^{\circ}$C, and 1000$^{\circ}$C, in air atmosphere. We investigated the alignment of MgO and ZrO$_2$ films on Ni metal sheets by XRD and pole figure. The grain growth of metal oxide films was improved by the increase of the drying temperature and annealing temperature. The grain growth was increased with the annealing temperature. The alignment of metal oxide films depended on the thickness.

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