• 제목/요약/키워드: Filler content

검색결과 394건 처리시간 0.022초

Studies on Properties with Different Filler and Content in Pb-free Sealing Frit for Electronic Devices

  • 안용태;최병현;지미정;장우석;이준호;황해진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.181-181
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    • 2009
  • 전자부품용 Pb-free sealing frit의 열팽창계수를 기판에 matching 시키기 위하여 음의 열팽창계수를 가지고 있는 $\beta$-Eucryptite, $\beta$-Spodumene를 합성하여 filler로 첨가하였다. 합성된 filler는 저온소성용 유리프리트의 높은 열팽창계수를 조절하기 용이하고, 유리프리트와 복합화 하여 소성하면 낮은 열팽창계수로 인한 우수한 열충격 저항성을 갖는다. Filler로써 $\beta$-Eucryptite, $\beta$-Spodumene의 결정성을 향상시키기 위해 $1250^{\circ}C$에서 5 시간 동안 유지하는 합성공정을 3회 반복 진행한 후 XRD를 사용하여 결정성을 분석하였고, TMA를 이용하여 filler 첨가량에 따른 유리프리트의 열팽장계수의 변화를 측정하였다. 또한, filler 입도와 함량에 따른 melting 특성을 분석하기 위해 Pill test를 진행하였으며, soda-lime glass 기판과의 접합면을 SEM을 사용하여 관찰하였다.

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Effect of Zinc Addition in Filler Metal on Sacrificial Anode Cathodic Protection of Fin-Tube Aluminum Heat Exchanger

  • Yoon-Sik So;Eun-Ha Park;Jung-Gu Kim
    • Journal of Electrochemical Science and Technology
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    • 제14권4호
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    • pp.349-360
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    • 2023
  • This study investigated the tri-metallic galvanic coupling of different metals in the tubes, fillers, and fins of a heat exchanger. The goal was to prevent corrosion of the tubes using the fin as a sacrificial anode while ensuring that the filler metal has a more noble potential than the fin, to avoid detachment. The metals were arranged in descending order of corrosion potential, with the noblest potential assigned to the tube, followed by the filler metal and the fin. To address a reduction in protection current of the fin, the filler metal was modified by adding Zn to decrease its corrosion potential. However, increasing the Zn content of filler metal also increases its corrosion current. The study examined three different filler metals, considering their corrosion potential, and kinetics. The results suggest that a filler metal with 1.5 wt.% Zn addition is optimal for providing cathodic protection to the tube while reducing the reaction rate of the sacrificial anode.

양이온성 PAM과 양성전분에 의한 GCC의 선응집과 이들의 투입량과 전단속도가 선응집체의 크기에 미치는 영향 (Preflocculation of GCC with Cationic PAM and Cationic Starch and the Influence of Their Dosage and Shear Rate on Prefloc Size)

  • 이경호;이학래
    • 펄프종이기술
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    • 제38권4호
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    • pp.1-9
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    • 2006
  • Increasing the filler content of sheet provides an opportunity for saving production cost through fiber replacement with relatively low-priced filler. But increasing the filler content tends to decrease the strength of paper and filler retention. To overcome these problems, preflocculation technology of fillers has been suggested. To evaluate the effect cationic polymers on the size and size distribution of preflocculated GCC and their shear stability, cationic PAM and cationic starch were used. Results showed that cationic PAM formed large prefloc at low dosage. It was required to add 15 times as high as cationic starch to cationic PAM to obtain the same size prefloc. But preflocs formed with cationic starch was superior in shear stability to those formed with cationic PAM. With the increase of shear rate the size of preflocs decreased. Greater amount of small preflocs or un-flocculated fillers was observed when the dosage of polymers was low and this ended up low ash retention in handsheets.

충전제 투입위치 이원화에 의한 고충전지 제조 (I) - 고농도 지료 충전이 종이물성과 공정에 미치는 영향 - (Production of High Loaded Paper by Dual Flow Additions of Fillers (I) -Effects of Filler Addition at Thick Stock on Paper Properties and Papermaking Process -)

  • 조병욱;김혁중;원종명
    • 펄프종이기술
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    • 제43권4호
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    • pp.23-30
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    • 2011
  • Fillers have been used for papermaking in order to enhance the optical properties, to improve sheet formation, printability and dimensional stability and to reduce the furnish cost. However, filler particles in paper interfere with fiber-fiber bonding, resulting in decreased paper strength. In order to increase filler content in paper without sacrificing too much paper strength, dual addition technology of fillers was investigated. As a first step, the effects of thick stock addition of fillers on paper properties and papermaking process were elucidated. It was shown that thick stock addition of fillers could increase paper strength at a given filler content. No significant adverse effects on formation, drainage and filler retention were observed. However, bulk of paper was reduced with thick stock addition of fillers, which shall be resolved with regulating other factors such as the mixing ratio of pulps and type of fillers.

열처리조건에 의한 자동차용 EGR쿨러의 브레이징부 접합강도에 관한 연구 (A Study on the Strength of Brazed Joint for Automotive EGR Cooler by Heat Treatment Conditions)

  • 이준;한창석
    • 열처리공학회지
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    • 제22권4호
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    • pp.210-216
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    • 2009
  • Stainless steel EGR cooler of diesel engine is widely used to prevent the corrosion due to the content of sulfur in diesel fuel. The strength of brazed joint between stainless steel materials is very important. It is essential to observe the spreading ratio of the filler metals under the condition of deoxidation or vacuum during heating process. In this experiment, spreading ratio was tested to find the optimum brazing condition for stainless steel using brazing filler metals of FP-613, BNi-2 and BNi-5 on sus304 and sus410. Anti-corrosion tests were also performed on the above filler metals with solution of 5% $H_2SO_4$, 65% $HNO_3$ and 5% $NH_4OH$. Consequently FP-613 has good ability for anti-corrosion with 30% of chromium content compared with other filler metals. The optimum brazing conditions are occurred at $960^{\circ}C$ for 90 min. and at $1090^{\circ}C$ for 50 min. at the same degree of vacuum, $2{\sim}3{\times}10^{-3}$ Torr.

Electrical properties of polyethylene composite films filled with nickel powder and short carbon fiber hybrid filler

  • Mironov, V.S.;Kim, Seong Yun;Park, Min
    • Carbon letters
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    • 제14권2호
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    • pp.105-109
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    • 2013
  • Effects of the amount of nickel powder (Ni) in Ni-carbon fiber (CF) hybrid filler systems on the conductivity(or resistivity) and thermal coefficient of resistance (TCR) of filled high density polyethylene were studied. Increases of the resistivity and TCR with increasing Ni concentration at a given hybrid filler content were observed. Using the fiber contact model, we showed that the main role of Ni in the hybrid filler system is to decrease the interfiber contact resistance when Ni concentration is less than the threshold point. The formation of structural defects leading to reduced reinforcing effect resulted in both a reduction of strength and an increase of the coefficient of thermal expansion in the composite film; these changes are responsible for the increases of both resistivity and TCR with increasing Ni concentration in the hybrid filler system.

합판의 충전제로서 신문용지 잔사의 조사 (Examination of Newsprint Residue as a Plywood Adhesive Filler)

  • 오용성
    • Journal of the Korean Wood Science and Technology
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    • 제24권2호
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    • pp.42-45
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    • 1996
  • A residue from the newsprint waste was investigated as a filler in adhesive for bonding southern pine plywood. The residue was prepared by drying the wet residue to 8% moisture content and grinding the dry material using a laboratory Wiley mitt with a 75-${\mu}m$(200-mesh) screen. The residue was compared to a commercial filler commonly used in structural plywood adhesives. A total of 48 three-ply panels. 12.7mm nominal thickness and 0.3 by 0.3 m in size, were fabricated at two press times(4 and 5 min) and three assembly times(20, 40 and 60 min). Evaluations of the residue were carried out by performance tension shear tests after two 4-hour boil accelerated aging tests on plywood. The test results included tension shear strength and estimated wood failure values. All plywood made with the residue filler were comparable to the control-bonded plywood. These results indicate that residue from the newsprint waste streams would be suitable as filler for plywood adhesives.

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Thermal Conductivity and Mechanical Properties of Magnesium Oxide Reinforced Polyamide-66 Composites

  • Hwang, Seok-Ho
    • Elastomers and Composites
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    • 제50권3호
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    • pp.205-209
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    • 2015
  • Magnesium oxide (MgO) reinforced polyamide-66 (PA66) composites were prepared through melt-compounding method in order to determine the possibility of using MgO particle as conductive filler in the polymer-based composite. The effects of MgO filler content on the thermal conductivity and mechanical properties for the PA66/MgO composites were investigated. The results showed that the addition of MgO filler to the PA66 matrix led to a large increase in thermal conductivity of the PA66/MgO composites. Tensile strengths of the PA66/MgO composites were slightly decreased as MgO filler loading increased. However, flexural strength and flexural modulus were improved with increasing filler loading. Notched Izod impact strengths were dramatically lowered by the addition of MgO filler.

차세대 반도체용 유-무기 나노 복합재료의 에폭시 수지변화에 따른 흡습특성 (Moisture Absorption Properties of Organic-Inorganic Nano Composites According to the Change of Epoxy Resins for Next Generation Semiconductor Packaging Materials)

  • 김환건;김동민
    • 반도체디스플레이기술학회지
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    • 제12권1호
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    • pp.23-28
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    • 2013
  • Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

반도체 봉지재용 EMC의 점도거동 특성 - 한 종류의 구형 실리카 포함 (The Characteriastics of Viscosity Behavior of EMC for Semi-conductor Encapsulant - Containing One Kind of Spherical Silica)

  • 김인범;이명천;이의수
    • 공업화학
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    • 제10권8호
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    • pp.1175-1179
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    • 1999
  • 반도체 봉지재용 epoxy molding compound(EMC)에는 고함량의 충전제가 함유되어 있어 충전제의 함량이 유변학적 거동에 큰 영향을 미친다. 본 연구에서는 반도체 봉지재용 EMC의 점도거동을 충전제 함량과 주파수(frequency)의 변화에 따라 조사하였다. 또한 주파수변화에 따른 점도거동을 전단율(shear rate)의 함수로 변환하기 위해 Cox-Merz 식과 modified Cox-Merz 식을 적용해 보았다. 이 결과 고함량에서 전단박화현상(shear thinning)과 항복강도(yield stress)가 관찰되었으며 전단율의 함수로의 변환은 Cox-Merz식을 적용하였을 때는 고종도에서 변형율 변화에 따른 점도값 차이 때문에 적용될 수 없었다. Modified Cox-Merz식을 적용하였을 때는 고농도/고변형율에서는 측정장치의 한계 때문에 오차를 보이기는 하지만 각 변형율에 따른 점도값들이 한 개의 마스터곡선으로 일치되는 경향을 보였다.

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