References
- K. Okamoto, I. Niki, A. Shvartser, Y. Narukawa, T. Mukai, and A. Scherer, "Surface-plasmon-enhanced light emitters based on InGaN quantum wells", Nat. Mater., 3, 601 (2004). https://doi.org/10.1038/nmat1198
-
B. Liu and H. C. Zeng, "Salt-Assisted Deposition of
$SnO_2$ on${\alpha}-MoO_3$ Nanorods and Fabrication of Polycrystalline$SnO_2$ Nanotubes", J. Phys. Chem. B, 108, 5867 (2004). https://doi.org/10.1021/jp037822d - R. S. Yang, and Z. L. Wang, "Springs, Rings, and Spirals of Rutile-Structured Tin Oxide Nanobelts", J. Am. Chem. Soc., 128, 1466 (2006). https://doi.org/10.1021/ja0578000
-
D. W. Kim, I. S. Hwang, and S. J. Kwon, "Highly Conductive Coaxial
$SnO_2-In_2O_3$ Heterostructured Nanowires for Li Ion Battery Electrodes", Nano Lett., 7, 3041 (2007). https://doi.org/10.1021/nl0715037 - K. McCullough, J. Miller, and E. M. Sagal, U.S. Patent 6976769 (2005).
- W.-Y. Zhou, S.-H. Qi, H.-Z. Zhao, and N.-L. Liu, "Thermally conductive silicone rubber reinforced with boron nitride particle", Polym. Compos., 28, 23 (2007). https://doi.org/10.1002/pc.20296
- P. Giuseppe, K. Ikuko, and M. Sadao, "Thermal conductivity of AlN/polystyrene interpenetrating networks", J. Eur. Ceram. Soc., 20, 1197 (2000). https://doi.org/10.1016/S0955-2219(99)00282-4
- H. Ishida and S. Rimdusit, "Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine", Thermochim. Acta, 320, 177 (1998). https://doi.org/10.1016/S0040-6031(98)00463-8
- C. K. Leong and D. D. L. Chung, "Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance", Carbon, 41, 2459 (2003). https://doi.org/10.1016/S0008-6223(03)00247-1
- K. Sanada, Y. Tada, and Y. Shindo, "Thermal conductivity of polymer composites with close-packed structure of nano and micro fillers", Compos. Part A, 40, 724 (2009). https://doi.org/10.1016/j.compositesa.2009.02.024
- G. Kalaprasad, P. Pradeep, G. Mathew, C. Pavithran, and S. Thomas, "Thermal conductivity and thermal diffusivity analyses of low-density polyethylene composites reinforced with sisal, glass and intimately mixed sisal/glass fibres", Compos. Sci. Technol., 60, 2967 (2000). https://doi.org/10.1016/S0266-3538(00)00162-7
- Y. Xu, D. D. L. Chung, and C. Mroz, "Thermally conducting aluminum nitride polymer-matrix composites", Compos. Part A, 32, 1749 (2001). https://doi.org/10.1016/S1359-835X(01)00023-9
-
L. C. Sim and S. L. Ramanan, "Thermal Characterization of
$Al_2O_3$ and ZnO Reinforced Silicone Rubber as Thermal Pads for Heat Dissipation Purposes", Thermochim. Acta, 430, 155 (2005). https://doi.org/10.1016/j.tca.2004.12.024 - R. Ruth and K. Y. Donaldson, "Thermal Conductivity of Boron Carbide-Boron Nitride Composites", J. Am. Ceram. Soc., 75, 2887 (1992). https://doi.org/10.1111/j.1151-2916.1992.tb05525.x
- R. J. Samuels and N. E. Mathis, "Orientation Specific Thermal Properties of Polyimide Film", J. Electron. Packag., 123, 273 (2001). https://doi.org/10.1115/1.1347986
- A. Devpura and P. E. Phelan, "Percolation Theory Applied to the Analysis of Thermal Interface Materials in Flip-Chip Technology", In: Proceedings of the Inter Society Conference on Thermal Phenomena, Las Vegas, NV, USA, May 23-26, pp. 21-28 (2000).
- S. H. Xie, B. K. Zhu, and J. B. Li, "Preparation and Properties of Polyimide/Aluminum Nitride Composites", Polym. Test., 23, 797 (2004). https://doi.org/10.1016/j.polymertesting.2004.03.005
- Y. Agari and A. Ueda, "Thermal Conductivities of Composites in Several Types of Dispersion System", J. Appl. Polym. Sci., 65, 2732 (1997).
- A. Slocombe and L. Li, "Laser Ablation Machining of Metal/Polymer Composite Materials", Appl. Surf. Sci., 154-155, 617 (2000). https://doi.org/10.1016/S0169-4332(99)00391-8
- Z. Q. Tao, S. Y. Yang, J. S. Chen, and L. Fan, "Synthesis and characterization of imide ring and siloxane-containing cycloaliphatic epoxy resins", Eur. Polym. J., 43, 1470 (2007). https://doi.org/10.1016/j.eurpolymj.2007.01.039
- P. Dashora and G. Gupta, "On the temperature dependence of the thermal conductivity of linear amorphous polymers", Polymer, 37, 231 (1996). https://doi.org/10.1016/0032-3861(96)81092-5
- W. H. Kim, J. W. Bae, I. D. Choi, and Y. S. Kim, "Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation", Polym. Eng. Sci., 39, 756 (1999). https://doi.org/10.1002/pen.11464
- W. N. Santos, P. Mummery, and A. Wallwork, "Thermal Diffusivity of Polymers by the Laser Flash Technique", Polym. Test., 24, 628 (2005). https://doi.org/10.1016/j.polymertesting.2005.03.007
- S. Zheng, J. Wang, Q. Guo, J. Wei, and J. Li, "Miscibility, Morphology and Fracture-Toughness of Epoxy-Resin Poly(Styrene-co-Acrylonitrile) Blends", Polymer, 37, 4667 (1996). https://doi.org/10.1016/S0032-3861(96)00324-2