• Title/Summary/Keyword: Fatigue Reliability

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On procedures for reliability assessment of mechanical systems and structures

  • Schueller, G.I.
    • Structural Engineering and Mechanics
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    • v.25 no.3
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    • pp.275-289
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    • 2007
  • In this paper a brief overview of methods to assess the reliability of mechanical systems and structures is presented. A selection of computational procedures, stochastic structural dynamics, stochastic fatigue crack growth and reliability based optimization are discussed. It is shown that reliability based methods may form the basis for a rational decision making.

Remaining Fatigue Life Evaluation of Steel Railroad Bridge (강철도교의 잔존피로수명 평가)

  • Kim, Sang Hyo;Lee, Sang Woo;Mha, Ho Seong;Kim, Jong Hak
    • Journal of Korean Society of Steel Construction
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    • v.11 no.4 s.41
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    • pp.329-338
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    • 1999
  • A systematic procedure to evaluate fatigue damages and to predict remaining fatigue lives is introduced for a steel railway bridge. Fatigue damages are evaluated by using the currently available fatigue damage theory. Fatigue lives with the condition of fatigue crack initiation are estimated by the probabilistic approach based on the reliability theory as well as the simplified procedure. A equivalent deterministic procedure is also suggested to assess the remaining fatigue life under various traffic conditions. Numerical simulations are used to assess dynamic stress histories with correction factors. Loading models are obtained from the passenger volume data. Train coincidences are also considered. Based on the results, the fatigue life is found to be underestimated by without considering the coincidence of trains on the bridge. The simplified method proposed in this study are found to yield approximately the same results as the systematic procedure.

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Reliability Analysis for Fatigue Damage of Steel Bridge Details (강교 부재의 피로손상에 대한 신뢰성 해석)

  • Park, Yeon Soo;Han, Suk Yeol;Suh, Byoung Chal
    • Journal of Korean Society of Steel Construction
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    • v.15 no.5 s.66
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    • pp.475-487
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    • 2003
  • This study developed an analysis model of estimating fatigue damage using the linear elastic fracture mechanics method. Stress history occurring to an element when a truck passed over a bridge was defined as block loading and crack closure theory explaining load interaction effect was applied. Stress range frequency analysis considering dead load stress and crack opening was done. Probability of stress range frequency distribution was applied and the probability distribution parameters were estimated. The Monte Carlo simulation of generating the probability various of distribution was performed. The probability distribution of failure block numbers was obtained. With this the fatigue reliability of an element not occurring in failure could be calculated. The failure block number divided by average daily truck traffic remains the life of a day. Fatigue reliability analysis model was carried out for the welding member of cross beam flange and vertical stiffener of steel box bridge using the proposed model. Consequently, a 3.8% difference was observed between the remaining life in the peak analysis method and in the proposed analysis model. The proposed analysis model considered crack closure phase and crack retard.

Thermal Fatigue Characteristics of $\mu$ BGA Solder Joints with Underfill (언더필이 적용된 $\mu$p BGA 솔더 접합부의 열피로특성)

  • 고영욱;김종민;이준환;신영의
    • Journal of Welding and Joining
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    • v.21 no.4
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    • pp.25-30
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    • 2003
  • There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

STRUCTURAL SAFTY EVALUATION OF COMPRESSOR DRIVING MOTOR SHAFT SYSTEM (컴프레서 구동용 전동기 축계의 구조 안전성 평가)

  • Jung, Kun-Hwa;Kwak, Ju-Ho;Kim, Byung-Joo;Lee, Jong-Moon
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1031-1036
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    • 2007
  • Torsional vibration analysis is necessary at design stage to ensure the reliability of a system particularly when the driven machine is a reciprocating compressor. This paper contains the results of torsional vibration analysis and fatigue strength evaluation for 540 kW compressor driving motor. Torsional vibration analysis showed that the $2^{nd}$ torsional mode of the entire shaft system has the possibility of resonance with the $14^{th}$ order excitation of compressor and twin line frequency of motor at operating speed. Therefore, the analyses were required to ensure the structural reliability of the motor. The fatigue strength was evaluated for the shaft and inner fans using the results of forced vibration analysis. It is concluded that the motor has sufficient fatigue strength under normal operating condition.

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Fatigue Life Analysis on Multi-Stacked Film Under Thermal and Residual Stresses (열응력과 잔류응력하의 다층박막의 피로수명 해석)

  • Park Jun-Hyub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.4 s.235
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    • pp.526-533
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    • 2005
  • Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

The Shape Design of Shot Ball to Improve the Reliability of Surface Treatment (표면가공의 신뢰성향상을 위한 쇼트볼의 형상설계)

  • 이승호
    • Journal of the Korean institute of surface engineering
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    • v.35 no.6
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    • pp.357-362
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    • 2002
  • In this study, to improve the effect of the surface treatment, the shape design of shot ball is proposed. The fatigue effects of shot peening by the cut wire shot ball and the rounded cut wire shot ball are compared. The rotary bending and tensile fatigue tests are conducted on a spring steel to evaluate fatigue lives. The residual compressive stresses by the rounded cut wire shot ball is higher than by the rounded cut wire shot ball. This consequently increase the fatigue life and the reliability of surface treatment. Thus, to obtain optimum, repeatable and reliable shot peening effect the shape of the shot ball must be round.

Reliability Analysis in Fatigue Strength of Connecting Rod (커넥팅 로드의 피로강도에 대한 신뢰성 해석)

  • Kim, Cheol-Su;Lee, Jun-Hyeong;Kim, Jeong-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.10
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    • pp.1651-1658
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    • 2001
  • It is necessary to evaluate fatigue strength and reliability of the connecting rod which is core part in automotive engine to assure the high level of durability of automobile. For this purpose, the loading conditions in automotive engine is obtained by the dynamic analysis. Based on these results, the critical section was identified by the finite element analysis. The fatigue strength under constant amplitude was evaluated and the mean of the fatigue limit at R = -2.27 derived from the staircase method was 311.2MPa. And the failure probability( F$\sub$p/ ) derived from the strength-stress interference model is 0.0003% at the 99.99% confidence level and the mean factor of safety was 4.2.

Analysis and Fatigue Life Evaluation of the Ball Bearing with Thin-Section Raceways (박판 궤도륜 볼베어링의 특성해석 및 피로수명 평가)

  • 김완두
    • Tribology and Lubricants
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    • v.13 no.3
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    • pp.48-55
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    • 1997
  • The ball bearing with thin-section raceways which is much lighter than other conventional bearings used in most modem passenger cars and small tracks. The important design parameters of this bearing is the groove radius of raceways, the diametral clearance, the free contact angle and so on. The optimal value of these parameters were determined by considering the dynamic load capacity, the contact angle and the calculated fatigue life. The contact angle between a ball and raceways was calculated by considering the local contact deformation and the structural deformation of thin-section raceways which was estimated by FEM. The raceways were made by means of the press-forming process. The fatigue life tester was designed and manufactured. The fatigue life test was executed and the reliability of this bearing was confirmed.

Life Assessment of Automotive Electronic Part using Virtual Qualification (Virtual Qualification을 통한 자동차용 전장부품의 수명 평가)

  • Lee, Hae-Jin;Lee, Jung-Youn;Oh, Jae-Eung
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.11a
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    • pp.143-146
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    • 2005
  • In modern automotive control modules, mechanical failures of surface mounted electronic components such as microprocessors, crystals, capacitors, transformers, inductors, and ball grid array packages, etc., are mai or roadblocks to design cycle time and product reliability. This paper presents a general methodology of failure analysis and fatigue prediction of these electronic components under automotive vibration environments. Mechanical performance of these packages is studied through finite element modeling approach fur given vibration environments in automotive application. Using the results of vibration simulation, fatigue lift is predicted based on cumulative damage analysis and material durability information. Detailed model of solder/lead joints is built to correlate the system level model and obtain solder strains/stresses. The primary focus in this paper is on surface-mount interconnect fatigue failures and the critical component selected for this analysis is 80 pin plastic leaded microprocessor.

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