• Title/Summary/Keyword: Fail bit

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Automatic Classification of Failure Patterns in Semiconductor EDS Test for Yield Improvement (수율향상을 위한 반도체 EDS공정에서의 불량유형 자동분류)

  • Han Young Shin;Lee Chil Gee
    • Journal of the Korea Society for Simulation
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    • v.14 no.1
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    • pp.1-8
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    • 2005
  • In the semiconductor manufacturing, yield enhancement is an urgent issue. It is ideal to prevent all the failures. However, when a failure occurs, it is important to quickly specify the cause stage and take countermeasure. Reviewing wafer level and composite lot level yield patterns has always been an effective way of identifying yield inhibitors and driving process improvement. This process is very time consuming and as such generally occurs only when the overall yield of a device has dropped significantly enough to warrant investigation. The automatic method of failure pattern extraction from fail bit map provides reduced time to analysis and facilitates yield enhancement. The automatic method of failure pattern extraction from fail bit map provides reduced time to analysis and facilitates yield enhancement. This paper describes the techniques to automatically classifies a failure pattern using a fail bit map.

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A Study on Multi-Bit Processing Scheme of GPS Receiver for Fail-Safe Seaway (Fail-Safe Seaway를 위한 GPS 수신기의 다중비트처리기법 연구)

  • Cho Deuk-Jae;Oh Se-Woong;Suh Sang-Hyun
    • Journal of Navigation and Port Research
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    • v.29 no.10 s.106
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    • pp.877-882
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    • 2005
  • It is necessary that Fail-Safe Seaway technology providing a continuous navigation solution though fault of navigation system is occurred in sea. This paper focus on signal processing of GPS receiver, one of receivers using the software radio technology to implement a integrated radio navigation system including satellite-based and ground-based navigation systems. It is difficult to implement the software GPS receivers using a commercial processor because of the heavy computational burden for processing the GPS signals in real time. This paper proposes an efficient multi-bit GPS signal processing scheme to reduce the computational burden for processing the GPS signals in the software GPS receiver. The proposed scheme uses a compression concept of the multi-bit replica signals and patterned look-up table method to generate the correlation value between the GPS signals and the replica signals.

A Study on Multi-Bit Processing Scheme of GPS Receiver for Fail-Safe Seaway (Fail-Safe Seaway를 위한 GPS 수신기의 다중비트처리기법 연구)

  • Cho Deuk-Jae;Oh Se-Woong;Suh Sang-Hyun
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2005.10a
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    • pp.37-42
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    • 2005
  • It is necessary that Fail-Safe Seaway technology providing a continuous navigation solution though fault of navigation system is occurred in sea. This paper focus on signal processing of GPS receiver, one of receivers using the software radio technology to implement a integrated radio navigation system including satellite-based and ground-based navigation systems. It is difficult to implement the software GPS receivers using a commercial processor bemuse of the heavy computational burden for processing the GPS signals in real time. This paper proposes an efficient multi-bit GPS signal processing scheme to reduce the computational burden for processing the GPS signals in the software GPS receiver. The proposed scheme uses a compression concept of the multi-bit replica signals and patterned look-up table method to generate the correlation value between the GPS signals and the replica signals.

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Automatic classification of failure patterns in semiconductor EDS Test using pattern recognition (반도체 EDS공정에서의 패턴인식기법을 이용한 불량 유형 자동 분류 방법 연구)

  • 한영신;황미영;이칠기
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.703-706
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    • 2003
  • Yield enhancement in semiconductor fabrication is important. It is ideal to prevent all the failures. However, when a failure occurs, it is important to quickly specify the cause stage and take countermeasure. The automatic method of failure pattern extraction from fail bit map provides reduced time to analysis and facilitates yield enhancement. This paper describes the techniques to automatically classifies a failure pattern using a fail bit map, a new simple schema which facilitates the failure analysis.

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Correlation Analysis on Semiconductor Process Variables Using CCA(Canonical Correlation Analysis) : Focusing on the Relationship between the Voltage Variables and Fail Bit Counts through the Wafer Process (CCA를 통한 반도체 공정 변인들의 상관성 분석 : 웨이퍼검사공정의 전압과 불량결점수와의 관계를 중심으로)

  • Kim, Seung Min;Baek, Jun-Geol
    • Journal of Korean Institute of Industrial Engineers
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    • v.41 no.6
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    • pp.579-587
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    • 2015
  • Semiconductor manufacturing industry is a high density integration industry because it generates a vest number of data that takes about 300~400 processes that is supervised by numerous production parameters. It is asked of engineers to understand the correlation between different stages of the manufacturing process which is crucial in reducing production costs. With complex manufacturing processes, and defect processing time being the main cause. In the past, it was possible to grasp the corelation among manufacturing process stages through the engineer's domain knowledge. However, It is impossible to understand the corelation among manufacturing processes nowadays due to high density integration in current semiconductor manufacturing. in this paper we propose a canonical correlation analysis (CCA) using both wafer test voltage variables and fail bit counts variables. using the method we suggested, we can increase the semiconductor yield which is the result of the package test.

Predicting Package Chip Quality Through Fail Bit Count Data from the Probe Test (프로브 검사 결점 수 데이터를 이용한 패키지 칩 품질 예측 방법론)

  • Park, Jin Soo;Kim, Seoung Bum
    • Journal of Korean Institute of Industrial Engineers
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    • v.41 no.4
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    • pp.408-413
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    • 2015
  • The quality prediction of the semiconductor industry has been widely recognized as important and critical for quality improvement and productivity enhancement. The main objective of this paper is to predict the final quality of semiconductor chips based on fail bit count information obtained from probe tests. Our proposed method consists of solving the data imbalance problem, non-parametric variable selection, and adjusting the parameters of the model. We demonstrate the usefulness and applicability of the proposed procedure using a real data from a semiconductor manufacturing.

Wear assessment of the WC/Co cemented carbidetricone drillbits in an open pit mine

  • Saeidi, Omid;Elyasi, Ayub;Torabi, Seyed Rahman
    • Geomechanics and Engineering
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    • v.8 no.4
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    • pp.477-493
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    • 2015
  • In rock drilling, the most important characteristic to clarify is the wear of the drill bits. The reason that the rock drill bits fail with time is wear. In dry sliding contact adhesive wear deteriorates the materials in contact, quickly, and is the result of shear fracture in the momentary contact joins between the surfaces. This paper aims at presenting an overview of the assessment of WC/Co cemented carbide (CC) tricone bit in rotary drilling. To study wear of these bits, two approaches have been used in this research. Firstly, the new bits were weighted before they mounted on the drill rigs and also after completion their useful life to obtain bit weight loss percentage. The characteristics of the rock types drilled by using such this bit were measured, simultaneously. Alternatively, to measure contact wear, namely, matrix wear a micrometer has been used with a resolution of 0.02 mm at different direction on the tricone bits. Equivalent quartz content (EQC), net quartz content (QC), muscovite content (Mu), coarseness index (CI) of drill cuttings and compressive strength of rocks (UCS) were obtained along with thin sections to investigate mineralogical properties in detail. The correlation between effective parameters and bit wear were obtained as result of this study. It was observed that UCS shows no significant correlation with bit wear. By increasing CI and cutting size of rocks wear of bit increases.

Automatic classify of failure patterns in semiconductor fabrication for yield improvement (수율 향상을 위한 반도체 공정에서의 불량 유형 자동 분류)

  • 한영신;최성윤;김상진;황미영;이칠기
    • Proceedings of the Korea Society for Simulation Conference
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    • 2003.11a
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    • pp.147-151
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    • 2003
  • Yield enhancement in semiconductor fabrication is important. Even though DRAM yield loss may be attributed to many problems, the existence of defects on the wafer is one of the main causes. When the defects on the wafer form patterns, it is usually an indication for the identification of equipment problems or process variations. In this paper describes the techniques to automatically classify a failure pattern using a fail bit map.

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A Study on the Algorithm of Improved One-Time Password using Time and Time Correction (시간을 이용한 효율적인 일회용 패스워드 및 시간 교정 알고리즘)

  • 강철오;박중길;홍순좌;배병철;박봉주
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.27 no.11C
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    • pp.1074-1080
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    • 2002
  • In clients/server environments, the one-time password scheme using time is especially useful because it solves the synchronization problem. However, it has the problem that is time-slippage, and causes the authentication to fail. In this paper, we propose an effective one-time password algorithm, which solves the time-slippage problem through the use of 1-bit information, which denotes the duration in which the authentication could be failed because of time-slippage. This algorithm is added easily and quickly to current one-time password systems using time without requiring any change of protocols: the proposed algorithm can be implemented by adding only 1-bit information to the user authentication information, not by modifying the one-time password authentication system protocol. And we propose also the algorithm of time correction, which can be implemented by adding 2-bit information on the proposed one-time password.