• Maxillofacial Plastic and Reconstructive Surgery
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• 제37권
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• pp.2.1-2.9
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• 2015

Background: The aim of this study was to evaluate the effect of autogenous tooth bone as a graft material for regeneration of bone in vertical bony defects of the minipigs. Material and Methods: Six minipigs were used in this study. Four molars were extracted in the right mandibular dentition and sent to the Korea Tooth Bank for fabrication of autogenous tooth bone. Ten days later, each extraction site was implanted with MS Implant Narrow Ridge $3.0{\times}10mm$ fixture (Osstem, Seoul, Korea) after standardized 2mm-sized artificial vertical bony defect formation. Pineappleshaped Root-On type autogenous tooth bones were applied to the vertical defects around the neck area of the posterior three fixtures and the fore-most one was not applied with autogenous bone as a control group. Each minipig was sacrificed at 4, 8, 12 weeks after fixture installation and examined radiologically and histologically. Histological evaluation was done under light microscope with Villanueva osteochrome bone staining with semi-quantitative histomorphometric study. Percentage of new bone over total area (NBF) and bone to implant contact (BIC) ratio were evaluated using digital software for area calculation. Result: NBF were $48.15{\pm}18.02%$, $45.50{\pm}28.37%$, and $77.13{\pm}15.30%$ in 4, 8, and 12 weeks, respectively for experimental groups. The control group showed $37.00{\pm}11.53%$, $32.25{\pm}26.99%$, and $1.33{\pm}2.31%$ in 4,8,12 weeks, respectively. BIC ratio were $53.08{\pm}19.82%$, $45.00{\pm}28.37%$, and $75.13{\pm}16.55%$ in 4,8,12 weeks, respectively. Those for the control groups were $38.33{\pm}6.43%$, $33.50{\pm}29.51%$, and $1.33{\pm}2.31%$ in 4, 8, 12 weeks, respectively. Conclusion: Autogenous tooth bone showed higher score than control group in NBF and BIC in all the data encompassing 4,8,12 weeks specimens, but statistically significant only 12 weeks data in both NBF and BIC.

• 복식
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• 제20권
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• pp.151-167
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• 1993

The purpose of this study is to systematize the theory of the Fashion Marketing and merchandi-sing system as well as the strategy for the Mar-keting based on the related variable. Furthermore, this study deals with development of the mark-eting strategy to the relation between consumers and industry. The content conclusion on the research can be outlined as follows : 1. In order to inverstigate how the life-style of consumers affects their sense of fashion, awa-reness of brand, and decision making process of purchase, the life-style of women consumers is classified into 15 types. (1) Acording to the different life-style types, and important difference is found in the consum-ers' sense of clothes, a unique image of outfit and its own favorite image of womanliness. (2) The consumer's awareness of a particular brand has a reasonable relationship with their brand preference and possession of the brands. (3) Their is an important discrimination acco-rding to the life-style types in their brand awar-eness and preference and possesion of brands. (4) The consumers of each life-style type show noticeable difference in the decision making pro-cess of purchase including he motive of purchase, the source of information, the cause of purchase intention, price, the frequency of purchase and the degree of satisfaction of purchased goods. 2. The merchandising system and the market positioning among the fashion industry are compared and analyzed in the following terms ; (1-1) For the purpose of establishing the target market strategy, the industry uses unreasenalbe methods to analyze the life-style of the target customers and the real customers(36%) and the aging phenomenon of brands is remarkable : as much as 37% of brands show over 5 years-old age gap. (1-2) The price setting process depends highly on the cost-plus approach. (1-3) In color planning, too many colors are used in every season(the average number is 22.3) and the investigation of the consumers' favorite color is neglected. (1-4) The manufacturers of successful brands are much likely to employ the textile designer and allow them to develop the various fabrication. (1-5) The regular rate of sales in each season is extremely low(56.04%) : the rate of the succ-essful brands is relatively high at 65%, but that of the unsuccessful as low as 51%. (1-6) 47% of brands reveal the designer-orie-nted fashion merchandising system. The successful brands, on the other hand, show a high rate of merchandiser oriented system. (2) Since the brand positioning is highly cen-tered on each brand image, styles and target age, the new data are presented in this study for the new market development. (3) To set up the target market, the mapping of images between the differentiated market and the consumers is suggersted according to the market positioning of industry and 15 types of the life-styles of consumers.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.344-344
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• 2014

Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

• 대한치과보철학회지
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• 제42권5호
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• pp.489-500
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• 2004

Statement of problem: The use of zirconia prostheses fabricated with CAD/CAM system is on an increasing trend in dentistry. However, evaluation of the fit related to internal relief and marginal reproducibility of zirconia has not been reported. Purpose : This study was to evaluate the fit related to internal relief and marginal reproducibility of zirconia core fabricated with CAD/CAM system. Materials and methods: The evaluation was based on 30 zirconia cores and 5 IPS-Empress2 cores. Zirconia cores were fabricated in different conditions of internal relief(0, 10, 20, 30, 40 and $50{\mu}m$), and IPS-Empress2 cores were fabricated in accordance with the manufacturer's instructions. Before cementation, the marginal discrepancies or cores were measured on metal die. And then, each core was cemented to stone die, embedded in an acrylic resin and sectioned in two planes(mesiodistally and labiopalatally). The internal gaps were measured at the margin and axial surface. Measurements for the marginal discrepancies, the internal marginal gaps and the internal axial gaps were performed under a measuring microscope(Compact measuring microscope STM5; Olympus, Japan) at a magnification of ${\times}100$. In addition, the marginal conagurations of metal die, zirconia core and IPS-Empress2 core were examined with SEM(S-2700, Hitachi, Japan). Results : Within the limits of this study the results were as follows. 1. Compared with IPS-Empress2 cores, the marginal discrepancies of zirconia cores had no significant differences. the internal marginal gaps were statistically smaller and the internal axial gaps were statistically larger in each condition of internal relief. 2. The marginal discrepancies and the internal marginal gaps of zirconia cores had no significant differences related to the conditions of internal relief(P>0.05). 3. The internal axial gaps of zirconia cores with $0{\sim}20{\mu}$m for internal relief were significantly larger than that with $50{\mu}m$ (P<(0.0001). 4. SEM micrographs showed favorable marginal reproducibility of zirconia core and smooth texture on the milling surface. Conclusion: The marginal discrepancy and the internal gaps of zirconia core were clinically acceptable and the milling surface was showed smooth texture. For fabrication of the durable esthetic restoration, further investigations on complex design of core, milling accuracy, compatability of enamel porcelain and porcelain firing seems to be needed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.167-170
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• 2005

The two-dimensional (2D) and three-dimensional (3D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography (UV-NIL) were fabricated using two kinds of methods, which were a DLC coating process followed by the focused ion beam (FIB) lithography and the two-photon polymerization (TPP) patterning followed by nano-scale thick DLC coating. We fabricated 70 nm deep lines with a width of 100 nm and 70 nm deep lines with a width of 150 nm on 100 nm thick DLC layers coated on quartz substrates using the FIB lithography. 200 nm wide lines, 3D rings with a diameter of $1.35\;{\mu}m$ and a height of $1.97\;{\mu}m$, and a 3D cone with a bottom diameter of $2.88\;{\mu}m$ and a height of $1.97\;{\mu}m$ were successfully fabricated using the TPP patterning and DLC coating process. The wafers were successfully printed on an UV-NIL using the DLC stamp. We could see the excellent correlation between the dimensions of features of stamp and the corresponding imprinted features.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 센서학회지
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• 제7권3호
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• pp.171-178
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• 1998

SDB 웨이퍼를 이용하여 실리콘 압저항형 절대압센서를 제조하고 이를 가스누출 감지시스템에 응용하였다. 이 경우 센서는 $0{\sim}600\;mmH_{2}O$, $0{\sim}100^{\circ}C$의 압력, 온도범위에서 정상적으로 동작하여야 하고 다이아프램이 파괴되었을 때 가스가 소자 외부로 누출되어서는 안된다. 따라서 다이아프램 내의 공극을 유리(Pyrex7740)와 진공중($10^{-4}$ torr)에서 양극 접합을 행하였다. 제조된 센서는 압력에 대하여 우수한 선형특성을 보였고, 압력감도는 대기압이상 $0{\sim}600\;mmH_{2}O$의 압력범위에서 $4.06{\mu}V/VmmH_{2}O$ 이었다. 온도보상 일체화 조건을 조사하기 위해 Al 박막저항을 제조하여 온도보상을 행하였는데 오프셋의 온도 drift는 80 %이상, 감도의 온도의존성은 95 %이상 보강 효과를 얻었다. 또한 다이오드(PXIN4001)를 이용한 온도보상시 오프셋의 온도 drift는 98 %이상, 감도의 온도의존성은 90%이상 보상 효과를 나타내었다.

• 한국산학기술학회논문지
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• 제17권4호
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• pp.129-137
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• 2016

국내외에서 건축시설 중심의 BIM 라이브러리를 개발하여 보급하고 있으나, 개별 라이브러리 형상에 대한 물리적, 논리적 품질검토 방법을 정의하고 있지 않아 2D로부터 변환된 3D 라이브러리 모델의 신뢰성을 확보하는데 어려움이 있다. BIM 라이브러리는 자재 및 부재 제작업체들이 참여하여 컨텐츠를 구성하므로 개별 라이브러리의 제작 후 납품시 별도의 품질검토를 통해 인증을 받는 절차가 무엇보다 중요하다. 또한 그 활용에 범용성을 가져야 하므로 일관된 검토기준에 따라 객체의 품질을 확보하는 것이 필요하다. 따라서 본 연구에서는 국토교통부 표준도를 기반으로 작성된 토목분야 BIM 라이브러리를 토대로 기존 2D와 비교하여 물리적 및 데이터 관점에서 정확한 라이브러리 객체가 작성되었는지를 확인하기 위한 품질 검토 방법을 구성한다. 본 연구는 건축 및 토목분야의 자재 및 부재 제작업체들이 BIM 라이브러리 객체 납품 시 품질 검토 방법으로 널리 활용될 수 있을 것이다. 또한 As-Built BIM 모델의 품질검토를 위한 룰-셋(Rule-Sets) 정보로 활용되어 파라미터 기반의 자동화된 품질검증 시스템 구축에 활용될 수 있을 것이다.

• 생물환경조절학회지
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• 제12권3호
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• pp.114-120
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• 2003

본 연구는 인삼재배 해가림 시설의 실태를 조사하여 시설의 구조 및 환경 공학적인 특성을 분석하고, 개선 방안을 도출하여 환경조절형 인삼재배시설의 개발을 위한 기초자료 제공을 목적으로 하였다 6개 인삼 주산지를 대상으로 현장실측 및 설문조사를 수행하였으며, 그 결과를 분석하여 뼈대구조의 재질에 따라 목재시설과 철재시설로 분류하고, 기둥과 서까래의 연결방식에 따라 전후주연결식과 후주연결식으로 분류하였으며, 도리와 보조도리의 세부구조에 따라 프레임식과 케이블 식으로 구조를 유형화하였다. 시설구조의 실측조사결과 기둥과 서까래는 대부분 표준 규격 이상의 단면을 사용하고 있었으나, 도리와 보조도리는 규격 미달이 많았고 이를 전혀 설치하지 않은 경우도 상당수 있어 이 부분에 대한 보강이 필요한 것으로 판단되었다. 시설의 폭과 높이, 기둥의 설치간격 등은 대체로 표준형과 비슷한 규격으로 설치하는 경향이었으나 편차가 크고, 구조적으로 취약한 부분도 상당수 있으므로 자재의 규격화와 시공 및 조립방법의 표준화가 필요하고, 폭설에 대한 대책과 보강설계가 가장 중요한 구조개선 사항으로 판단되었다. 환경관리 부분에서는 관수기준 설정 연구가 시급하고, 가장 힘들고 시간이 많이 소요되며 기계화 및 자동화가 요구되는 작업은 해가림 시설의 설치인 것으로 조사되었다. 따라서 설치비가 저렴하고 구조적으로 안전하며, 작업성이 양호한 동시에 환경조절 이용이한 인삼재배시설의 개발이 필요할 것으로 생각 되었다.

• 대한전기학회논문지
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• 제38권7호
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• pp.511-523
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• 1989

본 논문에서는 내열성 에폭시 수지의 1차 경화방법에 따른 물성, 전기적 및 기계적 특성과 2차 경화조건에 따른 상온 및 액체질소내에서의 전기적 및 기계적 특성에 관한 연구를 행하였다. 본 연구의 실험결과에서, 첫째, 내열성 에폭시 수지의 1차 경화방법에 있어, 1차 경화시에 에폭시 수지의 물성특성, 전기적 및 기계적 특성에 커다란 영향을 미치고 있음을 알 수 있었다. 즉, 시료제작시에 에폭시 수지의 내부반응온도를 최대한 억제시킴으로서 우수한 제반특성을 가지는 시료를 제작할 수 있음을 알 수 있었다. 둘째, 최적의 전기적 기계적 특성을 가지는 시료는 에폭시 수지의 2차 경화조건에서 볼때, $100^{\circ}C$에서 반복 2차 경화방법에서 얻을 수 있었다. 셋째, 액체질소내에서의 $Tan{\delta}$ 및 ${\varepsilon}_{\gamma}$특성은 상온에서의 $Tan{\delta}$ 및 ${\varepsilon}_{\gamma}$보다 각각 2배 정도 낮게 나타났다. 넷째, 액체질소내에서의 에폭시 수지의 절연강도는 상온에서 보다 0.6-1.0[MV/cm]정도 높게 나타났다. 그리고 에폭시 수지내의 미세결함 발생 및 과잉 열운동으로 한 에폭시 수지 자체의 열 열화등은 상온에서의 절연파괴강도보다 액체질소내에서의 절연파괴강도에 더욱 중요한 인자로 나타남을 알 수 있었다. 수 있었다.