• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.8
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• pp.745-750
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• 2017

Tension tests for copper thin films with thickness of $12{\mu}m$ were performed by using a digital image correlation method based on consecutive digital images. When calculating deformation using digital image correlation, a large deformation causes errors in the calculated result. In this study, the calculation procedure was improved to reduce the error, so that the full field deformation and the strain of the specimen could be accurately and directly measured on its surface. From the calculated result, it can be seen that the strain distribution is not uniform and its variation is severe, unlike the distribution in a common bulk specimen. This might result from the surface roughness introduced in the films during the fabrication process by electro-deposition.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of Advanced Navigation Technology
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• v.8 no.2
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• pp.184-190
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• 2004

A feedforward linear power amplifier (FLPA) has been developed for UHF-band RFID reader applications. The main and error amplifiers are composed of a 2 stage so that linearity of the FLPA can be improved. The FLPA has been implemented on an FR-4 substrate (Er=4.7 and thickness=0.8 mm) with 3-dB and 10-dB hybrid couplers for input/output power divider and combiner. For 2-tone measurement (input level=-11 dBm at $f_1$=915 MHz and $f_2$=916 MHz), the FLPA exhibits a -18.52 dBm of $IMD_3$, which indicates that $IMD_3$ cancellation with feedforward loop is more than 27 dB. From 890 to 960 MHz, 1-dB gain compression output power and power gain of the FLPA are higher than 30 dBm and 40 dB, respectively.

• Journal of the Institute of Convergence Signal Processing
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• v.7 no.4
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• pp.195-200
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• 2006

The conventional discrete circuit for ABS/TCS system was examined and the problems of the system were analyzed by computer simulation. In order to improve the performance of ABS/TCS system, interface IC which has error compensation, comparator and under voltage lock-out circuit was designed and their electrical characteristics were investigated. The voltage regulator was included to compensate the temperature variation in the temperature range from $-20^{\circ}C$ to $120^{\circ}C$ for automobile environment. ABS and brake signal were separated using the duty factor of same frequency or different frequencies. UVLO(Under Voltage Lock-Out) circuit and constant current circuit were applied for the elimination of noise, and protection circuit was applied to cut the excess current off. Layout for IC fabrication was designed to enhance the electrical performance of ABS/TCS system. Layout was consisted of 11 masks, arrayed effectively 8 pads to reduce the current loss. We can see that the result of layout simulation was better than the result of bread board.

• Korean Journal of Optics and Photonics
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• v.31 no.6
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• pp.328-333
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• 2020

In this paper, we study the analysis method for the aspherical tolerance of a Korsch telescope using a Q polynomial. It is important to analyze the tolerances for evaluating quality in high-precision fabrication of aspherical reflectors for high-resolution satellites. Thus we express the aspheric surface in terms of a Q polynomial in which each coefficient term is composed independently, and analyze the tolerance of a Korsch telescope. We also analyze the tolerance using Zernike fringe sag, which expresses the shape error of an aspherical mirror. By comparing the two results, we confirm that the Q-polynomial method can be used to analyze an aspherical mirror.

• Journal of the Korean Institute of Rural Architecture
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• v.23 no.1
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• pp.1-8
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• 2021

In this study, a real-sized experimental equipment (pilot plant) was built at the site based on the preliminary research data to develop a movable separator for the mixed construction waste that can be implemented in agricultural areas to review its feasibility through the evaluation of its separation efficiency by waste types. The final construction of the movable separator and experimental results of the separation efficiency are summarized as follows. 1) The separation performance according to the blade type was the best for the combustible wastes either with 26 numbers of L-type blades and 32 numbers of pin type blades. As far as combination of blade types, when the L-type and pin-type were combined, the best separation efficiency was achieved. 2) The separation efficiency for waste wood by the conveyor type and angle of inclination (slope) of the trommel was the best when the conveyor had ribs of seagull shape with the angle of inclination 45°. 3) The separation efficiencies by process showed that 65.9% was separated as inorganic demolition wastes, 18.2% as waste woods, and 16.0% as combustible wastes at conveyor speed of 2-3 rpm, and the error rate was the least from the waste types generated in the dismantle site.

• Journal of IKEEE
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• v.25 no.4
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• pp.762-765
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• 2021

In this paper, an automotive ECU (electronic control unit) with Kalman filter accelerator is designed and implemented. RISC-V is exploited as a processor core. Accelerator for Kalman filter matrix operation, CAN (controller area network) controller for in-vehicle network, and LIN (local interconnect network) controller are designed and embedded. Kalman filter operation consists of time update process and measurement update process. Current state variable and its error covariance are estimated in time update process. Final values are corrected from input measurement data and Kalman gain in measurement update process. Usually floating-point multiplication is exploited in software implementation, but fixed-point multiplier considering accuracy analysis is exploited in this paper to reduce hardware area. In 28nm silicon fabrication, its operating frequency, area, and gate counts are 100MHz, 0.37mm², and 760k gates, respectively.

• Journal of Navigation and Port Research
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• v.30 no.10 s.116
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• pp.847-853
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• 2006

In this paper, we designed VCO(voltage controlled oscillator} that is composed of a dielectric resonator and a varactor diode, and the PLDRO(phase locked dielectric resonator oscillator) that is combined with the sampling phase detector and loop filter. The results at 12.05 GHz show the output power is 13.54 dBm frequency tuning range approximately +/- 7.5 MHz, and power variation over the tuning range less than 0.2 dB, respectively. The phase noise which effects on bits error rate in digital communication is obtained with -114.5 dBc/Hz at 100 kHz offset from carrier, and The second harmonic suppression is less than -41.49 dBc. These measured results are found to be more improved than those of VCO without adopting PLL, and the phase noise and power variation performance characteristics show the better performances than those of conventional PLL.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.5
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• pp.336-343
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• 2018

We herein present the design and fabrication of a Rx core chip operating in the X-band (10.5~13 GHz) using Win's commercial $0.25-{\mu}m$ GaAs pHEMT process technology. The X-band core chip comprises a low-noise amplifier, a four-bit phase shifter, and a serial-to-parallel data converter. The size is $1.75mm{\times}1.75mm$, which is the state-of-the-art size. The gain and noise figure are more than 10 dB but less than 2 dB, and both the input and output return losses are less than 10 dB. The RMS phase error is less than $5^{\circ}$, and the P1dB is 2 dBm at 12.5 GHz, the performance of which is equivalent to other GaAs core chips. The fabricated core chip was packaged in a QFN package type with a size of $3mm{\times}3mm$ for the convenience of assembly. We confirmed that the performance of the packaged core chip was almost the same as that of the chip itself.

• Journal of Power System Engineering
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• v.20 no.4
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• pp.75-82
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• 2016

In this paper, we developed a 3D printing system using a photo-curing resin in order to reduce the surface roughness of a sculpture produced with the 3D printer. Using the pattern of the resulting variable thickness, that gave rise to a stepped shape, and the area error of the photo-curable sculpture, a study was carried out for the process to reduce the surface roughness. At a given value of stage velocity (40~70 mm/s) and output air pneumatic pressure (20~60 kPa), the minimum pattern thickness of the pattern was achieved $65{\mu}m$ and the maximum pattern thickness of up to $175{\mu}m$. To increases the pattern resolution to about $40{\mu}m$, the process conditions should be optimized. 3D surface Nano profiler was used to find the surface roughness of the sculpture that was measured to be minimum $4.7{\mu}m$ and maximum $8.7{\mu}m$. The maximum surface roughness was reduced about $1.2{\mu}m$ for the maximum thickness of the pattern. In addition, a FDM was used to fabricate the same sculpture and its surface roughness measurements were also taken for comparison with the one fabricated using photo-curing. Same process conditions were used for both fabrication setups in order to perform the comparison efficiently. The surface roughness of the photo-curable sculpture is $5.5{\mu}m$ lower than the sculpture fabricated using FDM. A certain circuit patterns was formed on the laminated surface of the photo-curable sculpture while there was no stable pattern on the laminated surface of the FDM based sculpture the other hand.