Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Tension Tests of Copper Thin Films

구리박막 시험편의 인장시험

  • Park, Kyung Jo (Division of Mechanical Design Engineering, Chonnam Nat'l Univ.) ;
  • Kim, Chung Youb (Division of Mechanical Design Engineering, Chonnam Nat'l Univ.)
  • 박경조 (전남대학교 기계설계공학부) ;
  • 김정엽 (전남대학교 기계설계공학부)
  • Received : 2017.01.04
  • Accepted : 2017.05.24
  • Published : 2017.08.01
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Abstract

Tension tests for copper thin films with thickness of $12{\mu}m$ were performed by using a digital image correlation method based on consecutive digital images. When calculating deformation using digital image correlation, a large deformation causes errors in the calculated result. In this study, the calculation procedure was improved to reduce the error, so that the full field deformation and the strain of the specimen could be accurately and directly measured on its surface. From the calculated result, it can be seen that the strain distribution is not uniform and its variation is severe, unlike the distribution in a common bulk specimen. This might result from the surface roughness introduced in the films during the fabrication process by electro-deposition.

본 연구에서는 두께 $12{\mu}m$의 구리박막에 대한 인장시험을 수행하였으며, 변위 측정은 디지털이미지를 기반으로 한 디지털이미지상관법을 이용하였다. 일반적인 디지털이미지상관법에서 시험편 표면의 큰변형으로 인해 변형률계산에 큰 오차가 발생하는 문제점을 개선하여, 시험편 전영역에 걸쳐 정밀하게 변형률을 계산할 수 있었으며 직접 시험편의 표면에서 변형률을 정확하게 측정할 수 있었다. 계산된 시험편 표면의 변형률 분포는 일반적인 벌크소재의 시험편에서와는 달리 전체적으로 균일하지가 않고 그 변화폭이 매우 크며, 항복응력이하의 탄성범위에 있는 경우에도 변형률분포는 균일하지 않다. 이것은 구리박막의 전해증착 제조공정에서 발생한 시험편의 거칠기가 비교적 큰 영향을 준 것으로 판단된다.

Keywords

References

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