• 대한전자공학회논문지TC
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• 제41권8호
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• pp.19-26
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• 2004

패키지는 전기적인 특성에 있어서 우수한 고주파 전송 특성을 지녀야한다. 그러나 집적회로면이 위로 향하는 세라믹 패키지(Face-up Package)는 본드와이어 연결 시 고주파의 기생 특성이 크게 증가하여 시스템 전체의 성능에 큰 제한을 가져온다. 본 논문에서는 향상된 정합특성을 갖는 새로운 밀리미터파 세라믹 패키지 급전구조를 제안하였고, 유한요소법(FEM: Finite Element Method)을 이용하여 20 ∼ 50 GHz에서 해석 및 설계를 하고 제작하였다. 측정 결과, 삽입된 금속판 (Embedded Metal Sheet)을 가지는 세라믹 패키지 급전구조는 47GHz까지 기존의 세라믹 패키지보다 0.85dB 그리고 본드와이어 부분에 일반적인 에폭시( ε/sub γ/ = 4)를 사용하여 몰딩한 세라믹 패키지보다 0.4dB가 개선된 삽입손실의 특성을 얻을 수 있었다. 따라서 본 해석결과는 소형의 세라믹 패키지 및 MMIC(Monolithic Microwave Integrated Circuit) 모듈 개발에 효과적으로 활용될 수 있으리라 기대된다.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.33-38
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• 2002

패키지는 전기적인 특성에 있어서 적은 삽입손실과 반사손실 특성이 요구된다. 따라서 이러한 고주파 전송 특성이 우수한 패키지를 설계하기 위하여 본 논문에서는 LTCC (Low Temperature Cofired Ceramic) 기술을 이용한 세라믹 패키지를 설계하였고, 유한요소법(FEM: Finite Element Method)을 이용하여 DC~30 GHz에서 해석하였다. 해석 결과, 설계된 패키지 급전구조는 30 GHz까지 삽입손실과 반사손실이 각각 0.32 dB, 16.8 dB 이내의 양호한 특성을 얻었다. 따라서 본 논문에서 설계된 세라믹 패키지는 MMIC (Monolithic Microwave Integrated Circuit) 모듈 개발에 효과적으로 활용될 수 있으리라 기대된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.259-263
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• 2002

We design and characterize a millimeter-wave ceramic package in a frequency range from DC to 300Hz using the FEM(Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

• Journal of Mechanical Science and Technology
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• 제18권2호
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

• 산업경영시스템학회지
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• 제32권1호
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• pp.85-93
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• 2009

In this paper, the geometric design for the body of a 3"-PFA-lined plug valve is concerned, and body model which has less deformed PFA-resin after infection molding process is proposed. A CAE software is used to simulate the deformation due to heat in cooling. To reduce the deformation, some small shapes are added to PFA-resin surfaces related on wall of the valve housing. And thermal stress simulation with FEM methodology is followed after that. Also, the 3D-CAD package is used during the design processes. In this study, I tried to present the possibility to use the FEM analysis in the solid modeling process. So, the design engineer will be able to use analysis package effectively on his job within the limited range.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.735-736
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• 2011

• 전산구조공학
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• 제32권3호
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• pp.9-15
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• 2019

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.124-128
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• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• 한국정밀공학회지
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• 제17권12호
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• 대한기계학회논문집A
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• 제28권11호
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.