• International Journal of Korean Welding Society
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• v.2 no.2
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• pp.14-18
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• 2002

Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature ( about $1000^{\circ}C$ ) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at $900^{\circ}C$ or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point: $825^{\circ}C$) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: $825^{\circ}C$) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of $820^{\circ}C$ or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

• Journal of the Korean Chemical Society
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• v.6 no.2
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• pp.143-147
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• 1962

As a part of "the Fundamental Study of Pyrometallurgical Debismuthizing of Lead", the author has studied liquid Pb-Bi, Pb-Na, Bi-Na binaries and Pb-Bi-Na ternary including Pb rich side composition which forms a basis of the Dittmer method. In this study, debismuthizing mechanism of the Dittmer method pertaining to the lead rich corner of the system studied was classified by the results of thermal analysis, solubility determination of Bi and Na in liquid Pb and debismuthizing test by adding metallic sodium. For instance eutectic trough in lead rich corner of Pb-Bi-Na ternary relating to the Dittmer method was determined.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.16 no.3
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• pp.309-313
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• 2018

In this study, we prepared Li-K-Cd alloy, which meets the requirement of eutectic ratio of Li:K, to maintain the operating temperature of the drawdown process at $500^{\circ}C$ and to achieve the reuse of LiCl-KCl molten salt. The prepared Li-K-Cd alloys were added to LiCl-KCl salt bearing U and Nd at $500^{\circ}C$ to investigate the removal of $UCl_3$ in the salt. The reduction of $UCl_3$ in the salt was examined by measuring the OCP value of salt and analyzing the salt composition by ICP-OES. Reduction was also visually confirmed by change of salt color from dark purple to white. The experimental results reveal that the prepared Li-K-Cd alloy has reductive extractability for $UCl_3$ in salt. By improving the preparation method, the Li-K-Cd alloy can be applied to the drawdown process.

• Journal of Powder Materials
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• v.20 no.4
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• pp.253-257
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• 2013

Freeze drying for porous Mo was accomplished by using $MoO_3$ powder as the source and camphor-naphthalene eutectic system as the sublimable material. Eutectic composition of camphor-naphthalene slurries with the initial $MoO_3$ content of 5 vol%, prepared by milling at $55^{\circ}C$ with a small amount of oligomeric dispersant, was frozen at $-25^{\circ}C$. The addition of dispersant showed improvement of dispersion stability in slurries. Pores were generated subsequently by sublimation of the camphor-naphthalene during drying in air for 48 h. To convert the $MoO_3$ to metallic Mo, the green body was hydrogen-reduced at $750^{\circ}C$, and sintered at $1100^{\circ}C$ for 2 h. The sintered samples, frozen by heated Teflon cylinder, showed large pores with the size of about 40 ${\mu}m$ which were aligned parallel to the sublimable vehicles growth direction. The formation of unidirectionally aligned pores is explained by the rejection and accumulation of solid particles in the serrated solid-liquid interface.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• Journal of Powder Materials
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• v.22 no.5
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• pp.362-366
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• 2015

The effect of sublimable vehicle composition in the camphor-naphthalene system on the pore structure of porous Cu-Ni alloy is investigated. The CuO-NiO mixed slurries with hypoeutectic, eutectic and hypereutectic compositions are frozen into a mold at $-25^{\circ}C$. Pores are generated by sublimation of the vehicles at room temperature. After hydrogen reduction at $300^{\circ}C$ and sintering at $850^{\circ}C$ for 1 h, the green body of CuO-NiO is completely converted to porous Cu-Ni alloy with various pore structures. The sintered samples show large pores which are aligned parallel to the sublimable vehicle growth direction. The pore size and porosity decrease with increase in powder content due to the degree of powder rearrangement in slurry. In the hypoeutectic composition slurry, small pores with dendritic morphology are observed in the sintered Cu-Ni, whereas the specimen of hypereutectic composition shows pore structure of plate shape. The change of pore structure is explained by growth behavior of primary camphor and naphthalene crystals during solidification of camphor-naphthalene alloys.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2004.06a
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• pp.337-337
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• 2004

As one of researches for the P ＆ T purposes, a basic experiment on the recovery of actinide elements from the mixture with rare earth elements by means of electrorefining using a liquid cadmium cathode in the LiCl-KC1 eutectic melt was carried out. In order to examine the behaviors of electrodeposition of metal ions on a liquid electrode, recovery experiments of rare earth metals resulting from forming electrodeposits were performed by a galvanostatic electrolysis method at various current densities. A cyclic voltammetric technique was applied to determine reduction-oxidation potential of each metal element in the melt and to detect the changes of the multi component melt composition for on-line monitoring. Also, a collaboration study with RIAR was completed to test the preliminary feasibility on a recovery of actinide elements from the mixture with rare earth elements using a liquid cadmium cathode and actinide metals. Experimental results showed that the ratio of actinides to rare earths, 9: 0.5∼1 led to the rare earth content of about 5∼10 wt% in the deposit.

• Journal of the Korean Ceramic Society
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• v.27 no.1
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• pp.48-54
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• 1990

YBa2Cu3O7-x(=YBCO) single crystals were grown by flux method and the growing process of crystals was investigated. YBCO and 3BaO-7CuO composition powders were mixed by the ratio of 25 : 75(wt%), and the mixtures were melted at 105$0^{\circ}C$ in a electric furnace with no temperature-gradient. Then the melt was cooled at a rate 2-1$0^{\circ}C$/h in the above furnace. YBCO single crystal plate with average size of $1.5\times$2.0$\times$0.1㎣ were obtained in the cavities between crucible and solidified ingot, and the single crystals were oriented to <001> direction. The ingots of flux parts were analyzed by XRD and EDS for the purpose of presuming the growing process of the crystals. It was assumed that the divorced eutectic reaction, by which YBCO crystals were grown first and then BaCuO2 and CuO crystals, occured in the case of cooling rate faster than 2$^{\circ}C$/h. When the cooling rate was 2$^{\circ}C$/h, it was assumed that quasi-equilibrium eutectic reaction occured, so that YBCO, BaCuO2 and CuO crystals were grown at the same time.

• Transactions on Electrical and Electronic Materials
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• v.15 no.3
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• pp.155-158
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• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.