• Nuclear Engineering and Technology
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• v.51 no.2
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• pp.546-555
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• 2019

Since the first nuclear reactor first critical, nuclear systems has gone through four generations of history, and the fourth generation nuclear system will be truly realized in the near future. The notions of SVBR and lead-bismuth eutectic alloy coolant put forward by Russia were well received by the international nuclear science community. Lead-bismuth eutectic alloy with the ability of the better neutron economy, the low melting point, the high boiling point, the chemical inertness to water and air and other features, which was considered the most promising coolant for the 4th generation nuclear reactors. This study mainly focuses on the structural design optimization of the 4th-generation reactor coolant pump, including analysis of external characteristics, inner flow, and transient characteristic. It was found that: the reactor coolant pump with a central symmetrical dual-outlet volute structure has better radial-direction balance, the pump without guide vane has better hydraulic performance, and the pump with guide vanes has worse torsional vibration and pressure pulsation. This study serves as experience accumulation and technical support for the development of the 4th generation nuclear energy system.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.393-395
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• 2005

The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.48 no.1
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• pp.55-64
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• 2022

The potassium cream soap with fatty acid called cleaning foam has a crystal gel structure, and unlike an emulsion system, it is weak to shear stress and shows characteristics that are easily separated under high temperature storage conditions. The crystal gel structure of cleansing foams is significantly influenced by the nature and proportion of fatty acids, degree of neutralization, and the nature and proportion of polyols. In order to investigate the effect of these parameters on the crystal gel structure, a ternary system consisting of water/KOH/fatty acid was investigated in this study. The investigation of differential scanning calorimeter (DSC) revealed that the eutectic point was found at the ratio of myristic acid (MA) : stearic acid (SA) = 3 : 1 and ternary systems were the most stable at the eutectic point. However, the increase in fatty acid content had little effect on stability. On the basis of viscosity and polarized optical microscopy (POM) measurements, the optimum degree of neutralization was found to be about 75%. The system was stable when the melting point (T_m) of the ternary system was higher than the storage temperature and the crystal phase was transferred to lamellar gel phase, but the increase in fatty acid content had little effect on stability. The addition of polyols to the ternary system played an important role in changing the T_m and causing phase transition. The structure of the cleansing foams were confirmed through cryogenic scanning electron microscope (Cryo-SEM), small and wide angle X-ray scattering (SAXS and WAXS) analysis. Since butylene glycol (BG), propylene glycol (PG), and dipropylene glycol (DPG) lowered the T_m and hindered the lamellar gel formation, they were unsuitable for the formation of stable cleansing foam. In contrast, glycerin, PEG-400, and sorbitol increased the T_m, and facilitated the formation of lamellar gel phase, which led to a stable ternary system. Glycerin was found to be the most optimal agent to prepare a cleansing foam with enhanced stability.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.168-170
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• 2007

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.334-338
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• 1994

This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

• Corrosion Science and Technology
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• v.23 no.2
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• pp.113-120
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• 2024

An attempt was made to apply digital image correlation (DIC) strain analysis to in-situ scanning electron microscopy (SEM) observations of bending deformation to quantify local strain distribution inside a ZnMgAl-alloy coating in deformation. Interstitial-free steel sheets were hot-dipped in a Zn-3Mg-6Al (mass%) alloy melt at 400 ℃ for 2 s. The specimens were deformed using a miniature-sized 4-point bending test machine inside the SEM chamber. The observed in situ SEM images were used for DIC strain analysis. The hot-dip ZnMgAl-alloy coating exhibited a solidification microstructure composed of a three-phase eutectic of fine Al (fcc), Zn (hcp), and Zn2Mg phases surrounding the primary solidified Al phases. The relatively coarsened Zn₂Mg phases were locally observed inside the ZnMgAl-alloy coating. The DIC strain analysis revealed that the strain was localized in the primary solidified Al phases and fine eutectic microstructure around the Zn₂Mg phase. The results indicated high deformability of the multi-phase microstructure of the ZnMgAl-alloy coating.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.9-18
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• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Journal of Powder Materials
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• v.11 no.1
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• pp.69-73
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• 2004

The sintering characteristics of commercial 7xxx series Al-Zn-Mg-Cu alloy have been investigated. Sintering system of this blended elemental powder has aspects of both transient and supersolidus liquid phase sintering. Transient liquids occur when the constitution point during sintering lies in a solid phase region but where the sintering temperature is greater than either the melting point of one of the constituent or a eutectic temperature. Supersolidus liquid phase sintering occurs when a preblended powder is heated to a temperature between the solidus and liquids. However, these reaction were restrained their inter diffusion due to the appearance of the oxide film. Thus, 7xxx series Al alloy is extremely sensitive to process variables, including particle size, holding time and sintering temperature. Therefore, above phenomenons were observed formation and behaviour of the liquid by using SEM and DSC.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• Archives of Metallurgy and Materials
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• v.65 no.4
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• pp.1329-1333
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• 2020

In this study, we have developed Sn-Ag alloy by a simple high energy ball milling technique. We have ball-milled the eutectic mixture of Sn and Ag powders for a period of 45 h. The milled powder for 45 h was characterized for particle size and morphology. Microstructural investigations were carried out by scanning electron microscopy and X-ray diffraction studies. The melting behavior of 45 h milled powder was studied by differential scanning calorimetry. The resultant crystallite size of the Sn(Ag) solid solution was found to be 85 nm. The melting point of the powder was 213.6℃ after 45 h of milling showing depression of ≈6℃ in melting point as compared to the existing Sn-3.5Ag alloys. It was also reported that the wettability of the Sn-3.5Ag powder was significantly improved with an increase in milling time up to 45 h due to the nanocrystalline structure of the milled powder.