• Title/Summary/Keyword: Epoxy composites

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Preparation of Electrically Conductive Composites Filled with Nickel Powder and MWCNT Fillers (다중벽 탄소나노튜브와 니켈 분말을 포함하는 전도성 복합체 제조)

  • Kim, Sunghoon;Park, Seonghwan;Kwon, Jaebeom;Ha, KiRyong
    • Korean Chemical Engineering Research
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    • v.54 no.3
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    • pp.410-418
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    • 2016
  • In this study, we prepared electrically conducting composites using epoxy resin of diglycidyl ether of bisphenol A (DGEBA) as a matrix, triethylenetetramine (TETA) as a hardener and nickel powder or multi-walled carbon nanotubes (MWCNTs) grafted with $-NH_2$ groups (MWCNT-$NH_2$) as electrically conducting fillers. Electrical conductivity of composite films were measured by coating on the slide glass with a doctor blade. We measured modification reactions of MWCNT and reaction of MWCNT-$NH_2$ with DGEBA epoxy resin by fourier transform infrared spectrometer (FTIR), thermogravimetric analyzer (TGA) and elemental analyzer (EA). Morphology of composites was investigated by scanning electron microscope (SEM) and sheet resistances of composites were measured by 4-point probe. We found $(9.87{\pm}1.09){\times}10^4{\Omega}/sq$ of sheet resistance for epoxy composite containing both 40 wt% nickel powder and 0.5 wt% of MWCNT-$NH_2$ as fillers, equivalent to epoxy composite containing 53.3 wt% nickel powder only as a filler.

Investigation of Thermal Stability of Epoxy Composite Reinforced with Multi-Walled Carbon Nanotubes and Micrometer-Sized Silica Particles (다중벽 탄소나노튜브와 마이크로미터 크기 실리카 입자로 강화된 에폭시 복합재료의 열 안정성에 관한 연구)

  • Oh, Ryun;You, Byeong Il;Ahn, Ji Ho;Lee, Gyo Woo
    • Composites Research
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    • v.29 no.5
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    • pp.306-314
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    • 2016
  • In this study, to improve the thermal stabilities of the epoxy composite specimens in addition to the enhanced mechanical properties, those were reinforced with carbon nanotubes and micrometer-sized silica particles. To disperse the filler in matrix relatively simple physical process, specimens were fabricated using shear mixing and sonication. Tensile strength, coefficients of thermal expansion and thermal conductivity of the specimens were measured with varied contents of the two fillers. The mechanical and thermal properties were also discussed, and the experimental results of thermal expansion related to the thermal stability of the specimens were compared with those from several micromechanics models. The hybrid composites specimens incorporating 0.6 wt% of carbon nanotubes and 50 wt% of silica particles showed better mechanical properties than the others with increase in tensile strength up to 11%, with respect to those of the baseline specimens. As the silica contents were increased the thermal expansion was reduced down to 36%, and the thermal stability was improved with the decreased thermal deformation. Thermal conductivity of the epoxy composite specimens incorporating 50 wt% of silica particles was enhanced, which demonstrate improvement of 72%. The mechanical and thermal properties of the hybrid composites specimens incorporating the two fillers were improved simultaneously.

Mechanical Characteristics of CF Laminated Prepreg with UV-thermal Dual Curable Epoxy Resin (광·열경화형 수지를 이용한 탄소섬유 프리프레그의 물리적 특성)

  • Sim, Ji-hyun;Kim, Ji-hye;Park, Sung-min;Koo, Kwang-hoe;Jang, Key-wook;Bae, Jin-seok
    • Textile Coloration and Finishing
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    • v.29 no.1
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    • pp.37-44
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    • 2017
  • An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

The Analysis on Properties of Epoxy/MWCNT for Bonding CFRP to Steel Plates (CFRP와 금속 재료의 접합을 위한 epoxy/MWCNT의 특성 분석)

  • Yoo, Sung-Hun;Kwon, Il-Jun;Shin, Dong-Woo;Park, Sung-Min;Yeum, Jeong-Hyun
    • Composites Research
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    • v.30 no.3
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    • pp.215-222
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    • 2017
  • The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.

DGEBA-MDA-SN-Hydroxyl Group System and Composites -Cure Kinetics and Mechanism in DGEBA/MDA/SN/HQ System- (DGEBA-MDA-SN-Hydroxyl계 복합재료의 제조 -DGEBA-MDA-SN-HQ계의 경화반응 속도론 및 메카니즘-)

  • Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.3
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    • pp.517-523
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    • 1994
  • The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

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Effects of Solvent-Based Dilution Condition on CNT Dispersion in CNT/Epoxy Composites (용매를 이용한 에폭시 희석 조건이 CNT 에폭시 복합재료 내 CNT 분산도에 미치는 영향)

  • Kwon, Dong-Jun;Shin, Pyeong-Su;Kim, Jong-Hyun;Lee, Hyung-Ik;Park, Jong-Kyoo;Park, Joung-Man
    • Composites Research
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    • v.29 no.4
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    • pp.125-131
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    • 2016
  • In case of CNT mixing with epoxy, epoxy matrix needs to be diluted. This work studied the effect of the dilution condition of epoxy on CNT dispersion. The optimum solvent condition using acetone and DMF was found via mechanical and solubility methods which affects, the epoxy performance. The dispersion using acetone was better than the DMF and thus higher mechanical properties. Four mixing types of CNT particle were performed. To verify the effects of each step between dilution and dispersion, the dispersion between epoxy and CNT was evaluated via the electrical resistance and optical methods. The optimum dispersion was obtained via mechanical test and thermal analysis by DSC. Among four types, the best was to disperse CNT after epoxy and hardeners were diluted respectively.

Piezoelectric and acoustic properties of piezoceramic/polymer 1-3 composites (압전 세라믹/Polymer 1-3 Composites의 압전 및 음향 특성)

  • Choi, H.I.;SaGong, G.
    • Proceedings of the KIEE Conference
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    • 1992.07b
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    • pp.727-729
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    • 1992
  • In this study, the piezoelectric composites with 1-3 connectivity have been studied. A piezoelectric ceramics PZT prepared by Flux method is used as a filler in a epoxy Eccogel polymer matrix. The piezoelectric coefficients were increased as PZT volume% increases, and resonance frequency was moved to lower frequency as the sample thickness increased. The acoustic matching impedance with water is lowered than single phase PZT ceramics.

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Functionally Graded Polymer Composites : Simulation of Fiber Distribution

  • Choe, Chul-Rim;C. Klingshirn;K. Friedrich
    • Macromolecular Research
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    • v.10 no.4
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    • pp.236-239
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    • 2002
  • Centrifugation is a method to create functionally graded materials (FGM) with a thermosetting matrix. In this study the movement of short carbon fibers in an epoxy resin during the centrifugation process was modeled to determine the fiber distribution in the final product. For this purpose a form factor K was introduced to modify a set of equations that was previously shown to be valid for the motion of spheres. It was shown that the results of the simulation were in good agreement with the experimental data, when an empirical K factor of four was chosen.

Microstructural Morphology and Bending Performance Evaluation of Molded Microcomposites of Thermotropic LCP and PA6 (액정폴리머/폴리아미드6 미시복합재료의 내부구조 및 기계적 굽힘성능 평가)

  • ;Kiyoshi Takahashi
    • Composites Research
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    • v.12 no.6
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    • pp.53-64
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    • 1999
  • Microstructural morphology and bending strengths of moulded composites of thermotropic liquid crystalline polymer(LCP) and polyamide 6 (PA6) have been studied as a function of epoxy fraction. Injection-moulding of a composite plaque at a temperature below the melting point of the LCP fibrils generated a multi-layered structure: the surface skin layer with thickness of $65\;-\;120{\mu\textrm{m}}$ exhibiting a transverse orientation; the sub-skin layer with an orientation in the flow direction; the core layer with arc-curved flow patterns. The plaques containing epoxy 4.8vol% exhibited superior bending strength and large fracture strain. With an increase of epoxy fraction equal to and beyond 4.8vol%, geometry of LCP domains was changed from fibrillar shape to lamella-like one, which caused a shear-mode fracture. An analysis of the bending strength of the composite plaques by using a symmetric layered model beam suggested that addition of epoxy component altered not only the microstructural geometry but also the elastic moduli and strengths of the respective layers.

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Effects of Silane-treated Silica on the Cure Temperature and Mechanical Properties of Elastomeric Epoxy (실란 커플링제로 처리된 실리카가 탄성에폭시의 경화온도 및 기계적 물성에 미치는 영향)

  • Choi, Sun-Mi;Lee, Eun-Kyoung;Choi, Seo-Young
    • Elastomers and Composites
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    • v.43 no.3
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    • pp.147-156
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    • 2008
  • In this work, epoxy/carboxyl-terminated butadiene acrylonitirile (EP/CTBN) composites were prepared by employing a reinforcing filler, silica treated with silane coupling agent in different ratio by dry and wet method. Their curing characteristics, surface free energy, interface morphologies and mechanical properties such as tensile strength and impact resistance were carefully investigated. Differential scanning calorimetry(DSC) results showed that curing temperature was lowered with the increase of silane coupling agent because of the increase of relative curing agent cotent by filling the pores of silica. Wet method was proved to be more effective for lowering curing temperature of EP/CTBN composite. In general, surface free energy and impact resistance were increased with the increase of silane coupling agent in this work. Tensile strength, however, was observed to be decreased at 4 wt% of silane coupling agent. It was found that the dry method was proved to be preferable for pretreatment of silica with coupling agent.