• Journal of Ocean Engineering and Technology
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• v.23 no.4
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.578-583
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• 2001

The bushing for high voltage and large and power should endure weight of itself and force of pushing from contact with circuit breaker. Like this, epoxy mold bushing has to be strong without fault. However, the external circumstances and internal factors was caused by partial discharge, flashover and dielectric breakdown. Therefore, to remove external factor of defect and to prevent the internal cracks and cavity generated from the contraction on interface of Cu-Epoxy, we should form semi-conductive layer on Cu bar by carbon. Then, the PD properties and the insulation qualities of epoxy mold type bushing was able to improved by roles of cushions for the direction of diameter and by effects fo natural sliding like as separated from conductor for the direction of length. So, in this work, we could prove the method of semi-conductive layer in making the long conductor.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.905-906
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.18 no.3
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• pp.75-83
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• 2001

RIM(Reaction Injection Molding) is a widely used method to manufacture middle-large size outfit-part for a prototype car. The main advantage of RIM is the capability of manufacturing a small number of prototype parts with less cost and lead time than injection molding which is the most popular method to manufacture plastic parts. Generally, epoxy resin and RTV(Room Temperature Vulcanization) silicon are used as mold materials for RIM, and the selection of mold materials is usually depended upon the industrial environment of manufactures and it decides overall mold making process and part quality. This paper suggests a new mold making process by consolidating the advantages of epoxy resin and RTV silicon based RIM mold to enhance the parts quality while reducing the manufacturing cost and time and shows the competitiveness of the suggested process compared with conventional methods.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.2
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• pp.1-7
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• 2012

LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[$^{\circ}C$] when the mold height was 3~5[mm], but the thermal conductivity of the mold didn't affect the junction temperature significantly.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.10
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• pp.902-908
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• 2005

Various stresses (such as electrical stress, mechanical stress, environmental and electrochemical stress, and defects of structure) result in insulation degradation of epoxy mold type insulators. Since the insulation degradation of BCT(Bushing Current Transformer) and bushing proceeds during fabrication process or operation time due to these causes, various methods to reduce the degradation in their insulation ability have been suggested. In this paper, we investigated surface temperature increment of these insulators due to PD(partial discharge). After the voltage applied into the insulator to generate the artificial PD, the surface temperature of the insulator was measured with non-contact thermometer using infrared rays. It was confirmed through the analysis based on PD experiments that the procession in the insulation degradation of the insulator could be estimated through the measurement of the surface temperature in the insulator.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05a
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• pp.23-28
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• 2000

Insulator systems using resin casting apparatus are useful to realize the high capacity, small size, and combined electric power equipments, and are expected to bring various advantages. In Korea, epoxy resin molded apparatus have been restricted to indoor uses till now. On the other hand, in Europe, molded insulators and transformers and so forth have been practically used since the former half of 1960's. Recently, investigation on epoxy resin materials and molded apparatus for outdoor use have ben intensively carried out. Probably, this is because electric power outdoor apparatus such as distribution transformer can be given multi-functions by using outdoor epoxy resin compound This study describes the trend on the development of epoxy mold transformers, and important technologies applied for outdoor use.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.96-102
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• 2006

In this study, manufacturing of polymer master, PDMS(poly dimethylsiloxane) transfer mold, and mold insert was investigated for laser LIGA(LIthography Calvanoformung Abformtechnik). Initially, ablation by excimer laser radiation was used successfully to make 3-D microstructure of PET. After then, the PDMS transfer mold was replicated using ablated PET. Finally, epoxy resin tooling on replicated PDMS transfer mold was executed for making mold insert. From these facts we can conclude that excimer laser ablation of polymer and fabricaiton of PDMS transfer mold are reasonable tools to substitute for X-ray lithography of LIGA process in microstructuring.