• 한국정밀공학회지
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• 제15권1호
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Journal of Mechanical Science and Technology
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• 제18권3호
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Current Photovoltaic Research
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• 제2권3호
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• pp.140-145
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• 2014

The globally used PV qualification tests and reports the pass/fail only. Therefore, the reliability of new PV materials and parts can't be compared quantitatively with the reliability of the PV parts and materials in the market. Global PV materials and parts companies test and compare their materials, parts, and modules using the failure-to-test (FTT). However, it takes a long accelerated stress test (AST) until failure. It also needs to test the new and existing materials and parts. Therefore, it requires excessive equipment time and cost. In order to reduce the time and cost, a new reliability enhancement methodology has been developed. It tests the PV materials, parts, and modules in the global market and stores them in the PV reliability database. It reduces the time and cost of the comparison and enhancement of PV reliability. An example of the reliability enhancement of the PV encapsulant, EVA is presented.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.152-157
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• 2002

The cure and rheological behavior of Diglycidyl ether of bisphenol F, catalyzed by four kinds of imidazoles and a Nadic methyl anhydride curing agent were studied using a differential scanning calorimeter (DSC) and rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at 20~40 % of the reaction. The rate constants obtained from isothermal test showed temperature dependance, but reaction order did not. The order of reaction (m+n) was calculated to be close to 3. The measurements of viscosity and relation time in the presence of inorganic fillers were carried out at different isothermal curing temperatures. The viscosity and gelation time increased with filler content at the same isothermal temperature.

• Design & Manufacturing
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• 제6권1호
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.34.2-34.2
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• 2011

본 연구에서는 1986년에 국내 섬 지역에 설치된 태양전지 모듈을 대상으로 전기적 특성값의 열화 및 열화 원인에 대한 분석을 실시하였다. 태양전지 모듈의 초기 최대 출력값은 50 W였고, 5인치 단결정 실리콘 태양전지 36개로 구성되어 있었다. 첫째로, 육안 검사를 통해서 태양전지 모듈의 열화 현상을 관찰하였다. 태양전지 모듈의 절연성은 IEC 61215의 기준으로 측정하였다. 태양전지 모듈의 전기적 특성평가를 통해서 최대 출력값의 변화량을 측정하였고, EL(Electroluminescence) 측정을 통해서 태양전지의 열화를 분석하였다. 이를 통해 분석된 주요 열화 모드는 봉지재 (Encapsulant)의 변색(Discoloration) 및 박리(Delamination)현상이었다. 봉지재의 변색된 부분 및 변색되지 않은 부분의 태양광 반사도를 측정한 결과 변색된 부위의 반사도가 증가한 것을 확인하였다. 두번째로 최대 출력전압을 태양전지 모듈에 인가한 상태에서 태양전지 각각의 온도를 T.C (Thermocouple)을 이용하여 측정하였고, 이를 통해서 태양전지의 열화와 온도와의 관계를 분석하였다. 마지막으로 태양전지 모듈의 단면분석을 통해서 봉지재의 박리현상 및 리본와이어의 솔더 접합계면을 관찰하였다. 또한, 봉지재를 제거한 후에 SEM&EDX를 통해서 리본와이어 및 금속전극의 부식현상을 분석하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1320-1321
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• 2011

According to the advance that solar power plants go into the desert, power plants are getting greater capacity. The desert is unspoiled resources and it is well suited to build a solar power plant, because of abundant solar radiation and long sunshine duration. but existing PV modules have several weaknesses and don't generate lower the rated power, because it wasn't designed to produce in extreme environments like a desert climate. The one of the weaknesses of PV modules is that the characteristics of the temperature of the Encapsulants(EVA sheet) are not good in a desert climate, because the EVA sheet is melt at high temperature. In this study, a decrease phenomenon of the transmittance depending on the melting point of the Encapsulant(PV module using EVA sheet : $75^{\circ}C$ PV module using PVB film : $110^{\circ}C$) is suggested, it would be the one of the important factors to achieve rated output of the PV modules in high temperature climate regions.

• 한국수산과학회지
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• 제33권2호
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• pp.143-147
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• 2000

Alginate를 encapsulant 및 필름으로 이용하기 위한 기초자료를 얻기 위하여 다시마로부터 alginate의 추출조건과 alginate film 가공조건이 에스테르화합물의 필름 투과도에 미치는 영향에 관하여 실험 검토하였다. Alginate의 추출조건에서 추출용액인 $Na_2CO_3$ 용액의 농도가 증가할수록 에틸 아세테이트의 투과도는 증가하였지만, 추출시간은 큰 영향을 미치지 못하였다. Sorbitol의 농도가 증가할수록 에틸 아세테이트의 투과도도 증가하였다. 가소제의 종류별에 따른 에틸 아세테이트의 투과도는 sorbitol, glycerol 및 polyethylene glycol 첨가 필름 순으로 높게 나타났으며, 에스테르 화합물 중에서는 에틸 포메이트가 투과속도가 가장 높았다. 온도가 증가함에 따라 에틸 아세테이트의 필름 투과속도는 증가하였다.

• 조명전기설비학회논문지
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• 제29권6호
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• pp.27-34
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• 2015

There has been a critical issue in optical simulation of phosphors in LEDs due to their light-reabsorption properties. To improve the accuracy of optical modeling for a white LED package, we utilized the spectrum data of the phosphor-dispersed encapsulant film instead of the phosphor powder. By measuring white LED packages with green and red phosphors, the maximum difference between simulation and experimental results of a color temperature, a color rendition index number and a color coordinate corresponds to ${\Delta}T=95K$, ${\Delta}Ra=1.7$ and ${\Delta}xy=0.007$, respectively. Based on those results, the proposed method can well explain the change of emission spectra of white LEDs with more than two phosphors which introduce the complex optical phenomena such as absorption, reabsorption, light emission, reflection and scattering, etc.

• 폴리머
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• 제37권3호
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• pp.294-301
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• 2013

Polymersomes made of biodegradable triblock copolymers based on poly(fumaric acid-co-sebacoyl chloride)/PEG (PEG-co-P(FA/SC)-co-PEG) were prepared and studied in aqueous solutions. TEM confirmed the formation of vesicles in aqueous media. Aggregation behavior of the copolymers was studied by fluorescence spectroscopy of 8-anilino-1-naphthalenesulfonic acid, and the critical aggregation concentration (c.a.c.) of the copolymer was found to be ${\sim}26.2{\mu}M$ indicating desirable stability of the vesicles. Dynamic light scattering revealed that the size of the vesicles was distributed within the range of 170-270 nm. Turbidity measurements confirmed the relative short-term stability of the polymersomes. Carboxyfluorescein, a hydrophilic compound, was simply encapsulated in the vesicles during polymersome preparation. The release of encapsulant from the polymersomes at 25 and $37^{\circ}C$ lasted about 3 weeks, and the rate of release followed a first-order kinetics. The release is speculated to be primarily carried out through diffusion. These results confirm that these polymersomes are promising as controlled-release carriers of various drugs.