• 제목/요약/키워드: Embossing process

검색결과 128건 처리시간 0.03초

핫엠보싱 공정의 폴리머 점탄성 거동에 대한 연구 (Experimental and numerical study on viscoelastic behavior of polymer during hot embossing process)

  • 송남호;손지원;임성한;오수익
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.191-194
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    • 2007
  • In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

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Embossing 처리 과대지의 제조 및 물성 (Preperation and properties of embossing treated fruit bagging paper)

  • 김강재;변종상;김대근;엄태진
    • 한국펄프종이공학회:학술대회논문집
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    • 한국펄프종이공학회 2006년도 추계학술발표논문집
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    • pp.201-206
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    • 2006
  • Embossing treated fruit bagging paper was prepared with newly designed embossing roll and mechanical properties of fruit bagging paper were evaluated. The embossing technology was developed. First of all, embossing roll was designed in Ginyong Embo(Co) for the embossing process of fruiting bag. The embossing treated fruit bagging paper was manufactured in Agro(Co) at plant scale. The mechanical properties of embossing paper was investigated and operation efficiency of bagging was tested at field. The properties of embossed paper was quit satisfied for fruiting bag for cultivation of apple and pears.

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핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작 (Fabrication of plastic CE (capillary electrophoresis) microchip by hot embossing process)

  • 차남구;박창화;임현우;박진구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1140-1144
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    • 2005
  • A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

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방사광 LIGA 공정을 이용한 플라스틱 성형용 마이크로 금형 제작 (Manufacturing of Micromolds for Plastic Molding Technologies via Synchrotron LIGA Process)

  • 이봉기;김종현
    • 한국기계가공학회지
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    • 제14권4호
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    • pp.1-7
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    • 2015
  • In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.

냉간 등방압 성형공정을 이용한 마이크로 엠보싱 패턴 성형 및 기계적 물성 측정 (Fabrication Method Of Micro Embossing Patterned Metallic Thin Foil Using CIP Process and It's Mechanical Property)

  • 이혜진;이낙규;이근안;이형욱;최석우
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.243-246
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    • 2006
  • In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

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Polymer Planar-Lightwave-Circuit-Type Variable Optical Attenuator Fabricated by Hot Embossing Process

  • Kim, Jin-Tae;Choi, Choon-Gi;Sung, Hee-Kyung
    • ETRI Journal
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    • 제27권1호
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    • pp.122-125
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    • 2005
  • A polymer-based planar-lightwave-circuit-type variable optical attenuator (VOA) was fabricated using a hot embossing process. With an optimized one-step embossing process, forty micro-channels for the guidance of light were defined on a polymer thin film with an accuracy of ${\pm}0.5{\mu}m$. The fabricated polymeric thermo-optic VOA shows 30 dB attenuation with 110 mW electrical input power at $1.55{\mu}m$. The rise and fall times are less than 5 ms.

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Fabrication of Multimode Polymeric Waveguides by Hot Embossing Process: Effect of Sidewall Roughness on Insertion Loss

  • Yoon, Keun Byoung
    • Macromolecular Research
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    • 제12권5호
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    • pp.437-442
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    • 2004
  • We have fabricated a polymeric waveguide by using a hot embossing technique and have investigated its propagation loss. The replication of waveguide channels through the use of a hot embossing technique is of interest as a single-step process that could deliver surface roughnesses far smaller than the wavelength. We have evaluated experimentally that the sidewall roughness has a dominant effect on insertion losses of the multimode polymeric waveguide. The propagation loss of the waveguide decreased dramatically upon decreasing the sidewall roughness of the channel. We have confirmed that the preparation of waveguides having nanometer-scale sidewall roughness and 0.1 dB/cm propagation loss is possible when using the hot embossing technique.

UV 나노 엠보싱 공정을 이용한 고종횡비 고분자 나노 섬모 어레이 제작 (Manufacture of High-Aspect-Ratio Polymer Nano-Hair Arrays by UV Nano Embossing Process)

  • 김동성;이현섭;이정현;이건홍;권태헌
    • 대한기계학회논문집A
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    • 제30권7호
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    • pp.773-778
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    • 2006
  • High-aspect-ratio nano-hair or nano-pillar arrays have great potential in a variety of applications. In this study, we present a simple and cost-effective replication method of high-aspect-ratio polymer nano-hair arrays. Highly ordered nano-porous AAO (anodic aluminum oxide) template was utilized as a reusable nano-mold insert. The AAO nano-mold insert fabricated by the two-step anodization process in this study had close- packed straight nano-pores, which enabled us to replicate densely arranged nano-hairs. The diameter, depth and pore spacing of the nano-pores in the fabricated AAO nano-mold insert were about 200nm, $1{\mu}m$ and 450nm, respectively. For the replication of polymer nano-hair arrays, a UV nano embossing process was applied as a mass production method. The UV nano embossing machine was developed by our group for the purpose of replicating nano-structures by means of non-transparent nano-mold inserts. Densely arranged high-aspect-ratio nano-hair arrays have been successfully manufactured by means of the UV nano embossing process with the AAO nano-mold insert under the optimum processing condition.