• 제목/요약/키워드: Embossing process

검색결과 127건 처리시간 0.025초

테스트워크의 스트립 레이아웃설계에 관한 연구 (A study on the design of layout for test work)

  • 김세환;최계광
    • Design & Manufacturing
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    • 제6권1호
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    • pp.34-38
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    • 2012
  • Test work is the press die branch at The Korea-China-Japan Grand Prize Contest. This study focuses on strip layout design for test work. A comparison is drawn between product shape and blank deployment line. During the forming analysis of the whole product, shape part of the total forming process is analyzed. As for forming part and flange deployment, forming analysis is carried out in part during the mid process. Material utilization is 42.6 percent and strip layout design is completed in 14 processes that are comprised of hourglass, slotting, embossing, drawing and trimming.

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나노 광소자용 나노스탬프 제조공정 연구 (Nano stamp fabrication for photonic crystal waveguides)

  • 정명영;정은택;김창석
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.16-21
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    • 2005
  • Photonic crystals, periodic structure with a high refractive index contrast modulation, have recently become very interesting platform for the manipulation of light. The existence of a photonic bandgap, a frequency range in which the propagation of light is prevented in all directions, makes photonic crystal very useful in application where the spatial localization of light is required, for example waveguide, beam splitter, and cavity. However, the fabrication of 3 dimensional photonic crystals is still difficult process. A concept that has recently attracted a lot of attention is a planar photonic crystal based on a dielectric membrane, suspended in the air and perforated with two dimensional lattice of hole. The fabrication of Si master with pillar structure using hot embossing process is investigated for two dimensional, low-index-contrast photonic crystal waveguide. From our research we show that the multiple stamp copy process proved to be feasible and useful.

난성형 T형상 알루미늄 부품의 성형공정 해석 및 실험 (Forming Analysis and Experiment of Hard to Forming T Shape Aluminum Part)

  • 진철규
    • 한국산업융합학회 논문집
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    • 제20권2호
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    • pp.141-148
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    • 2017
  • A process comprising a hot extrusion process and a warm forging process was designed to form a T-shaped aluminum structural component with a high degree of difficulty by the plastic forming method. A circular cylindrical part was extruded with a hot extrusion process, and then an embossing part was formed with a warm forging process. The formability and the maximum load required for forming were then determined using a forming analysis program. The hot extrusion process was executed at $450^{\circ}C$ under the extrusion speed at 6 mm/s, while the warm forging process was executed at $260^{\circ}C$ under the forging speed at 150 mm/s. For both the processes, a condition by which friction would not be generated between the mold and the material was implemented. The analysis results showed that the load required for hot extrusion was 1,019 tons, while the load required for the warm forging was 534 tons. The T-shaped part was manufactured by using a 1,600 tons capacity press. The graphite lubricant was coated on the mold as well as the material. A forming experiment was performed under the same condition with the analysis condition. The measured values from the load cell were 1,210 tons in the hot extrusion process and 600 tons in the warm forging process.

차량용 델타샤시의 프로그레시브 공정 설계 (Progressive Process Design for Delta Sash in Vehicles)

  • 고영준;곽효서;배준호;김철
    • 한국정밀공학회지
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    • 제31권12호
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    • pp.1161-1170
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    • 2014
  • Delta sash is an important part of automobile door, which has the functions of supporting and guiding seesaw of car's window, preventing dust and air from outside. In previous manufacturing process, each part of the delta sash was independently formed by tandem processes, and rubber is bonded to steel by poisonous glue. So, the previous processes, including roll forming process and toxic gases, had low production rate and high failure rate. In this study, progressive process design of the delta sash was proposed in order to increase productivity and high utilization of the materials. And instead of the poisonous glue used for adhesion of rubber in the previous tandem process, embossing and piercing processes were designed in the new guide to help the rubber to adhere well to steel. And the optimal piercing distance was designed to ensure structural safety, and prototypes were manufactured for verifying reliability of the processes.

Development of Direct Surface Forming Process

  • Cho, Kwang-Hwan;Yoon, Kyung-Hwan
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 The Korea-Japan Plastics Processing Joint Seminar
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    • pp.73-77
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    • 2003
  • The backlight unit(BLU) is used as a light source of TFT liquid-crystalline-display (TFT-LCD) module. In this backlight unit, one of important components is the light guide, which is usually made of transparent polymers. Currently the screen-printing method is mainly used for the light guide as a manufacturing process. However, it has limitation to the flexibility of three-dimensional optical design. In the present paper a new alternative manufacturing method for the light guide with low-cost is proposed. This manufacturing method is named as direct surface forming (DSF), which is very similar to the well-known hot embossing except for partial contact between mold and substrate. The results of this new manufacturing method are presented in terms of processing condition, dimensional accuracy, productivity, etc.

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나노 임프린팅 리소그래피 장비의 기술개발 동향 (State of the art and technological trend for the nano-imprinting lithography equipment)

  • 이재종;최기봉;정광조
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.196-198
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    • 2003
  • Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

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정밀고속 PRESS 하사점 변위량에 영향을 최소화 하는 금형 EMBO 장치에 관한 구조 연구 (A structural study on mold EMBO equipment to minimize the influence on the bottom dead center displacement of precision high-speed press)

  • 김승수
    • Design & Manufacturing
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    • 제10권3호
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    • pp.46-50
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    • 2016
  • Laminate products for motor core are developed with a structure in which the importance of quality level and clamping force is influenced by the recent performance and safety of the product. It has been confirmed that the accuracy of the mold is emphasized, and that the accuracy of the tightening force produced by the stacked product for the motor core is greatly influenced by the change in the bottom dead center displacement of the aged high speed press. The reason why setting the mold, and test the effect of bottom dead center of high speed press is to improve product pull force in embossing process at mold. We have applied the system to minimize the effect on the damping displacement under the dynamical degree of the equipment by applying the emboss complement device which can test the influence and complement in the process.

A Study on the Multi-row Progressive Die for Thin Sheet Metal Forming by Computer Simulation

  • Sim, Sung-Bo;Kim, Chung-Hwan
    • 한국기계가공학회지
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    • 제7권3호
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    • pp.75-80
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    • 2008
  • The progressive die performs a work of sheet metal processes with a piercing, notching, embossing, bending, drawing, cut-off etc. in many kinds of pressing. Now a days, these processes have been evaluated as a advanced tooling method to increase the productivity and high quality assurance. The first step analyzing of die design is production part review, then the arrangement drawing of product design and strip process layout design should be done as a next steps with a FEM simulation for its problem solution. After upper procedure were peformed, it was started to make the die, then tryout and its revision of the die and product quality, safety, productivity etc. were done continually. For the all of these process, we mobilized the theory and practice of sheet metal forming, die structure, the function and activity of die components, and the others of die machining, die material, heat treatment and know‐how so on. In this study the features of representative are production part analyzing through the FEM simulation of bending area with a considering spring back problem by DEFORM.

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자동차용 부재 금형설계의 공정변수 결정을 위한 CAE 프로세스 적용 (Application of the CAE Process to the Parameter Determination far the Tool Design of an Auto-body Member)

  • 김세호;허훈;송정한
    • 한국자동차공학회논문집
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    • 제13권3호
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    • pp.64-73
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    • 2005
  • This paper is concerned with the simulation-based parameter determination for the tool design in the stamping process of the complicated auto-body member. The CAE procedure of the stamping process is proposed so that troubles such as wrinkle, springback and excess metal be eliminated with changing parameters such as the blank size, the restraining force of the draw-bead and the embossing shape in the die face. The selected indicators of failure during forming are wrinkling. the amount of spring after unloading of the tool, the amount of excess metal developed .The proposed analysis scheme is applied to the tool and process parameter design for the front side member of a RV car. The simulation results show that the scheme can produce sound product from the viewpoint of thickness distribution, the contact condition between tools and the blank, the shape accuracy and so on.

다공성 그래핀 필름의 슈퍼캐패시터 전극용 전기화학적 특성 (Electrochemical Characterization of Porous Graphene Film for Supercapacitor Electrode)

  • 최봉길;허윤석;홍원희
    • Korean Chemical Engineering Research
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    • 제50권4호
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    • pp.754-757
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    • 2012
  • 본 연구에서는 embossing 공정과 진공여과법에 의해서 제조된 다공성 그래핀 필름을 슈퍼캐패시터의 전극활물질로 사용하여 우수한 전기화학적 특성을 증명하였다. 그래핀 시트사이에서 Polystyrene 입자들의 삽입/제거 공정을 이용하여 기공 구조들을 제공함으로써 그래핀의 재적층(restacking)을 효과적으로 제어할 수 있었다. 상기 제조된 다공성 그래핀 필름은 넓은 표면적, 상호 연결된 기공 구조, 높은 전기전도도 및 우수한 기계적 물성을 나타내었다. 본 다공성 그래핀 필름을 슈퍼캐패시터의 전극물질로 사용하여 황산 수용액과 이온성 액체 전해질 기반의 3상 전극 시스템에서 전기화학적 특성을 살펴보았다. 다공성 그래핀 필름은 높은 비축전용량(284.5 F/g)을 나타내었으며, 이는 적층 그래핀 필름(138.9 F/g) 보다 두 배 정도 높았다. 또한, 그래핀 필름내의 이온 이동속도 향상 효과로 다공성 그래핀 필름의 충방전 속도(98.7% retention)와 충방전 수명(97.2% retention)이 크게 향상되었다.