• 전력전자학회:학술대회논문집
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• 전력전자학회 2001년도 Proceedings ICPE 01 2001 International Conference on Power Electronics
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• pp.581-585
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• 2001

This paper describes novel high voltage capacitor(HVC) embedded high frequency transformer and novel inverter power supply topology for driving magnetron in microwave oven. This transformer is used to achieve down­sizing, low-cost and efficiency improvement. Proposed transformer has HVC in its secondary winding. Therefore, this transformer does not need external high voltage capacitor which used in conventional power supply. As use of this transformer, output voltage is shifted from ground to above 2000[V] and efficiency of microwave oven can be improved. The weight of proposed transformer is about one sixth of conventional one and efficiency is improved by seven percent compared to the efficiency of the conventional system.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2016년도 추계학술대회 논문집
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• pp.220-221
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• 2016

This paper proposes an active switched-capacitor embedded quasi-Z-source inverter (ASC-EqZSI) topology. In order to improve boost ability, One diode and one switch device are added in the qZSI impedance network, and a single dc source is shifted in series with the inductor in the impedance network. The performances of the proposed topology are verified with simulation and experimental results.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.71-76
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• 2004

무선 이동 통신에 응용할 수 있는 소형의 집적된 형태의 여파기를 LTCC기술과 인터디지털 커패시터 (Interdigital capacitor)를 가진 컴라인 타입(Combline type)의 구조를 이용해 구현했다. 또한 T 패턴을 가지는 마이크로스트립(Microstrip)타입의 공진기를 이용해 LTCC 기판의 전기적 성능을 측정했다. 구현된 여파기는 인터디지털과 컴라인 구조를 이용해 2.7mm${\times}$2.03mm의 비교적 소형으로 구현할 수 있었고 5.09 GHz의 중심주파수에서 1.8 dB의 삽입손실, 37.6 dB의 반사손실, 그리고 280 MHz의 대역폭을 가졌다. 제안된 여파기는 작은 크기와 간단한 구조로 인해 여러 가지 LTCC기판의 집적형 여파기로 응용될 수 있을 것이다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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• pp.222-228
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• 2012

This paper presents a design and simulation of bi-directional DC/DC boost converter for a fuel cell system. In this paper, we analyze the equivalent model of both a boost converter and a buck converter. Also we propose the controller of bi-directional DC-DC converter, which has buck mode of charging a capacitor and boost mode of discharging a capacitor. In order to design a controller, we draw bode plots of the control-to-output transfer function using specific parameters and incorporate 3pole-2zero compensator in a closed loop. As a result, it has increased PM(Phase Margin) for better dynamic performance. The proposed bi-directional DC-DC converter's 3pole-2zero compensation method has been verified with computer simulation and simulation results obtained demonstrates the validity of the proposed control scheme.

• 한국전자파학회논문지
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• 제17권9호
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• pp.860-865
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• 2006

본 논문에서는 가변형 $Bi_2O_3-ZnO-Nb_2O_5(BZN)$ Pyrochlore 박막을 이용한 고가변형 inter-digital capacitor를 제안하였다. 가장자리 전계 효과를 이용한 가변성의 향상과 DC 전압의 감소를 위해 inter-digital capacitor의 전극이 박막 내부에 삽입되었다. 2.5D simulator를 이용한 설계 결과, 제 안된 구조의 inter-digital capacitor(IDC)가 일반적인 구조의 IDC에 비해 가변성이 10 % 향상되었다. 제안된 IDC는 설계 결과를 바탕으로 실리콘 기판 위에 BZN 박막을 이용하여 제작되었다. BZN 박막은 reactive RF magnetron sputtering 방법을 이용하여 증착되었다. 제작된 inter-digital capacitor는 5.8 GHz와 18 V의 DC 인가 전압에서 최대 가변율이 50 %였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• ETRI Journal
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• 제30권6호
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• pp.826-832
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• 2008

The metal-ferroelectric-metal (MFM) capacitor in the ferroelectric random access memory (FeRAM) embedded RFID chip is used in both the memory cell region and the peripheral analog and digital circuit area for capacitance parameter control. The capacitance value of the MFM capacitor is about 30 times larger than that of conventional capacitors, such as the poly-insulator-poly (PIP) capacitor and the metal-insulator-metal (MIM) capacitor. An MFM capacitor directly stacked over the analog and memory circuit region can share the layout area with the circuit region; thus, the chip size can be reduced by about 60%. The energy transformation efficiency using the MFM scheme is higher than that of the PIP scheme in RFID chips. The radio frequency operational signal properties using circuits with MFM capacitors are almost the same as or better than with PIP, MIM, and MOS capacitors. For the default value specification requirement, the default set cell is designed with an additional dummy cell.