• Journal of the Korean Society of Safety
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• v.15 no.4
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• pp.62-68
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• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.602-606
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• 2006

The electrostatic is well known phenomena. The fires and explosions caused by electrostatic occur often in the coating mechanical system. This paper presents various cases of electrostatic hazards, reasons why electrostatic hazards are happened, and methods for preventing electrostatic hazards. Generally the electrostatic can be lead to corona discharging, streaming electrification, and impinging electrification in the coating process. Corona discharging happens at electrostatic spray gun with 70 kV. Streaming electrification occurs at mixing process between paint and thinner, and transportation process with thinner. Impinging electrification is shown when the thinner are sprayed to drums. For the purpose of preventing the electrostatic discharge and damage, conductors should be ground, surface electric potential of should be decreased in using electrostatic shielding and ground, and flow of thinner should be controlled acceptable velocity.

• Journal of the Korean Society of Safety
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• v.14 no.3
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• pp.69-77
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• 1999

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipment need to be more alert to the problem of electrostatic discharges(ESD). Semiconductor devices such as IC, LSI, VLSI become a high density pattern of being more fragile by ESD phenomena. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the electrostatic discharge sensitive devices. Accordingly, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated to evaluate the ESD phenomina in the semiconductors in this paper. The required data are obtained by Static Honestmeter. Also The results in this paper can be used for the prevention of semiconductor failure by ESD.

• Journal of the Korean Society of Safety
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• v.17 no.4
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• pp.94-100
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• 2002

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipments need to be more alert to the problem of electrostatic discharges(ESD). In order to analyze damage characteristics of semiconductor device damaged by ESD, this study adopts a new charged-device model(CDM), field-induced charged model(FCDM) simulator that is suitable for rapid, routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. High voltage applied to the device under test is raised by the field of non-contacting electrodes in the FCDM simulator, which avoids premature device stressing and permits a faster test cycle. Discharge current and time are measured and calculated. The characteristics of electrostatic attenuation of domestic semiconductor devices are investigated to evaluate the ESD phenomena in the semiconductors. Also, the field charging mechanism, the device thresholds and failure modes are investigated and analyzed. The damaged devices obtained in the simulator are analyzed and evaluated by SEM. The results obtained in this paper can be used to prevent semiconductor devices form ESD hazards and be a foundation of research area and industry relevant to ESD phenomena.

• Journal of the Korean Society of Safety
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• v.25 no.1
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• pp.27-31
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• 2010

It is a well known fact that the LCD and Semiconductor Devices are a central part of IT industry which is important in the present and the future. But the biggest problem of Semiconductor and LCD manufacturing is maintaining a cleaning room environment. For this reason, the soft X-ray type Ionizer was used as the electrostatic reducer device, which protects damage of the product against electrostatic discharge in the manufacturing process. Therefore it is a essential important factor during Semiconductor and LCD production process. But the soft X-ray has a intrinsic problem with harmful to human being in case of soft X-ray exposure. That's reason we have the research to solve above problem and made an apparatus that it was covered with shielding structure to protect X-ray radiation to outside. And besides, it has a possibility to eliminate the charged electrostatic in the narrow space through the slot for Ion emissions with dual soft X-ray sources on the both side. It is also not make the particles from itself when it has been operated.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.1 s.106
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• pp.75-80
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• 2006

This paper introduces the mechanism of the ESD(electrostatic discharge) in the HDD spindle system using FDBs(fluid dynamic bearings). When a HDD(hard disk drive) spindle system is rotating, triboelectric charging occurs in the FDBs through the friction between the lubricant and the rotating shaft or between the lubricant and stationary sleeve. And this electrostatic charge is accumulated in the rotating parts of the HDD spindle system because they are insulated from the ground by the lubricant. This research shows experimentally that the behavior of electric charge and discharge in the FDB spindle system is the same as that of a capacitor. It also measures the electrostatic voltage difference between the rotating and stationary parts in the FDB spindle system due to the change of humidity, supporting load and motor speed. This research shows that the control of ESD is required in the HDD spindle system using FDBs, because the electrostatic charge accumulated in the FDB spindle system may cause the breakdown damage of the GMR head and data loss consequently.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.318-323
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• 2005

This paper introduces the mechanism of the ESD (Electrostatic discharge) in the HDD spindle system using FDBs (Fluid Dynamic Bearings). When a HDD (Hard Disk Drive) spindle system is rotating, triboelectric charging occurs in the FDBs through the friction of the lubricant between the rotating shaft and stationary sleeve. And this electrostatic charge is accumulated in the rotating part of the HDD spindle system because it is insulated from the ground by the lubricant. This research shows experimentally that the behavior of electric charge and discharge in the FDB spindle system is the same as that of a capacitor. It also measures the electrostatic charge and discharge of the FDB spindle system due to the chanse of humidity, supporting load and motor speed. This research shows that the control of ESD is required in the HDD spindle system using FDBs, because the electrostatic charge accumulated in the FDB spindle system may cause the breakdown damage of the GMR head and data loss consequently.

• Journal of the Korean Society of Safety
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• v.34 no.5
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• pp.37-45
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• 2019

The characteristic of fire and explosion related to electrostatic discharge is that it is difficult to reproduce the electrostatic charge and discharge phenomenon in addition to the large human and material damage. Therefore, in order to prevent accidents and disasters related to electrostatic in fire and explosion hazard areas, it is important to manage the level of electrostatic in a safe manner from the perspective of system between industrial facilities and human bodies. Rule 325 of the Occupational Safety and Health Regulations, "Prevention of Fire / Explosion due to Electrostatic", requires the use of grounding, conductive materials, humidification and electrification in order to prevent the risk of disaster caused by static explosion and electrostatic in the production process. In order to comply with these measures, related technologies, standards and systems are needed from the viewpoint of preventive measures related to electrostatic in fire and explosion hazard areas, but in Korea, it is still insufficient. Therefore, technical, institutional and managerial measures are needed as a precautionary measure to improve the level of ESD safety in fire and explosion hazard areas and prevent electrostatic related injury. In Korea, we analyzed the current status and characteristics of electrostatic related disaster by using the statistics of industrial accident and fire statistics of the Ministry of Employment and Labor. We also analyzed the current status and characteristics of electrostatic related disasters in Japan using JNIOSH accidents and disasters investigation cases and JNIOSH fire accident data of Japan Fire Bureau. The purpose of this study is to compare and analyze the current status of electrostatic related accidents and disasters in Korea and Japan in order to improve the safety management of electrostatic in fire and explosion hazard areas. In order to prevent accidents and disasters in the industrial field, The technical, institutional, and managerial measures to manage the level of electrostatic in a safe state were derived from the system point of view.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.48-53
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• 1998

We have fabricated electrostatic lens with novel structure by mixing surface- and bulk-micromachining technology. Polysilicon was used for both the structure and sacrificial layer, and the structure layer was passivated with thermal oxide in order not to be attacked during the silicon wet etching. Compared with conventional electrostatic lens used in microcolumn, this device has the advantages in ; 1) hole alignment, throughput, reliability, damage of lens, 2) the possibility of arrayed lithography through the integration of microcolumn.

• Journal of the Korean Society of Safety
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• v.21 no.4 s.76
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• pp.60-65
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• 2006

It is a well known fact that LCD is a central part of the IT industry which is important in the present and the future. But the biggest problem of LCD manufacturing is maintaining a cleaning room environment and administration. Therefore the purpose of this study is to first, prevent the yield depreciation and damage of products, and second, protect the worker ftom accidental electrostatic discharge during LCD manufacture. The soft x-ray ionizer is a type of electrostatic reducer device. It protects against electrostatic discharge in the cleaning room environment and is a necessary environmental factor during LCD production. The positive aspects of the soft x-ray are its shorter time and wider angle of exposure. But the negative aspect of the soft x-ray is its need for several shielding of protection from the harmful x-ray exposure. On this study, the development of the Air Nozzle-type ionizer to amend and refine some problems. For example, examined the electrostatic reduce device of a soft x-ray type and discovered the ion did not go inside well. also workers to be free from danger. An Air Nozzle-type ionizer is comprised of soft x-ray radiation and ionized air production. Air is injected through the nozzle after being ionized from radiation. It supplies air keeping the same pressure into the end foundation of ion production. The soft x-ray is the structure which radiates ionized air through the nozzle (21 holes) having micro holes of the ionizable radiation after ionizing the inside air by the ion production. A worker does not need a cover to protect against x-rays and the Air Nozzle-type ionizer is easy to set up and is more effective at eliminating electrostatic.