• 한국안전학회지
• /
• 제15권4호
• /
• pp.62-68
• /
• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• 대한설비공학회:학술대회논문집
• /
• 대한설비공학회 2006년도 하계학술발표대회 논문집
• /
• pp.602-606
• /
• 2006

The electrostatic is well known phenomena. The fires and explosions caused by electrostatic occur often in the coating mechanical system. This paper presents various cases of electrostatic hazards, reasons why electrostatic hazards are happened, and methods for preventing electrostatic hazards. Generally the electrostatic can be lead to corona discharging, streaming electrification, and impinging electrification in the coating process. Corona discharging happens at electrostatic spray gun with 70 kV. Streaming electrification occurs at mixing process between paint and thinner, and transportation process with thinner. Impinging electrification is shown when the thinner are sprayed to drums. For the purpose of preventing the electrostatic discharge and damage, conductors should be ground, surface electric potential of should be decreased in using electrostatic shielding and ground, and flow of thinner should be controlled acceptable velocity.

• 한국안전학회지
• /
• 제14권3호
• /
• pp.69-77
• /
• 1999

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipment need to be more alert to the problem of electrostatic discharges(ESD). Semiconductor devices such as IC, LSI, VLSI become a high density pattern of being more fragile by ESD phenomena. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the electrostatic discharge sensitive devices. Accordingly, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated to evaluate the ESD phenomina in the semiconductors in this paper. The required data are obtained by Static Honestmeter. Also The results in this paper can be used for the prevention of semiconductor failure by ESD.

• 한국안전학회지
• /
• 제17권4호
• /
• pp.94-100
• /
• 2002

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipments need to be more alert to the problem of electrostatic discharges(ESD). In order to analyze damage characteristics of semiconductor device damaged by ESD, this study adopts a new charged-device model(CDM), field-induced charged model(FCDM) simulator that is suitable for rapid, routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. High voltage applied to the device under test is raised by the field of non-contacting electrodes in the FCDM simulator, which avoids premature device stressing and permits a faster test cycle. Discharge current and time are measured and calculated. The characteristics of electrostatic attenuation of domestic semiconductor devices are investigated to evaluate the ESD phenomena in the semiconductors. Also, the field charging mechanism, the device thresholds and failure modes are investigated and analyzed. The damaged devices obtained in the simulator are analyzed and evaluated by SEM. The results obtained in this paper can be used to prevent semiconductor devices form ESD hazards and be a foundation of research area and industry relevant to ESD phenomena.

• 한국안전학회지
• /
• 제25권1호
• /
• pp.27-31
• /
• 2010

It is a well known fact that the LCD and Semiconductor Devices are a central part of IT industry which is important in the present and the future. But the biggest problem of Semiconductor and LCD manufacturing is maintaining a cleaning room environment. For this reason, the soft X-ray type Ionizer was used as the electrostatic reducer device, which protects damage of the product against electrostatic discharge in the manufacturing process. Therefore it is a essential important factor during Semiconductor and LCD production process. But the soft X-ray has a intrinsic problem with harmful to human being in case of soft X-ray exposure. That's reason we have the research to solve above problem and made an apparatus that it was covered with shielding structure to protect X-ray radiation to outside. And besides, it has a possibility to eliminate the charged electrostatic in the narrow space through the slot for Ion emissions with dual soft X-ray sources on the both side. It is also not make the particles from itself when it has been operated.

• 한국소음진동공학회논문집
• /
• 제16권1호
• /
• pp.75-80
• /
• 2006

This paper introduces the mechanism of the ESD(electrostatic discharge) in the HDD spindle system using FDBs(fluid dynamic bearings). When a HDD(hard disk drive) spindle system is rotating, triboelectric charging occurs in the FDBs through the friction between the lubricant and the rotating shaft or between the lubricant and stationary sleeve. And this electrostatic charge is accumulated in the rotating parts of the HDD spindle system because they are insulated from the ground by the lubricant. This research shows experimentally that the behavior of electric charge and discharge in the FDB spindle system is the same as that of a capacitor. It also measures the electrostatic voltage difference between the rotating and stationary parts in the FDB spindle system due to the change of humidity, supporting load and motor speed. This research shows that the control of ESD is required in the HDD spindle system using FDBs, because the electrostatic charge accumulated in the FDB spindle system may cause the breakdown damage of the GMR head and data loss consequently.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2005년도 추계학술대회논문집
• /
• pp.318-323
• /
• 2005

This paper introduces the mechanism of the ESD (Electrostatic discharge) in the HDD spindle system using FDBs (Fluid Dynamic Bearings). When a HDD (Hard Disk Drive) spindle system is rotating, triboelectric charging occurs in the FDBs through the friction of the lubricant between the rotating shaft and stationary sleeve. And this electrostatic charge is accumulated in the rotating part of the HDD spindle system because it is insulated from the ground by the lubricant. This research shows experimentally that the behavior of electric charge and discharge in the FDB spindle system is the same as that of a capacitor. It also measures the electrostatic charge and discharge of the FDB spindle system due to the chanse of humidity, supporting load and motor speed. This research shows that the control of ESD is required in the HDD spindle system using FDBs, because the electrostatic charge accumulated in the FDB spindle system may cause the breakdown damage of the GMR head and data loss consequently.

• 한국안전학회지
• /
• 제34권5호
• /
• pp.37-45
• /
• 2019

The characteristic of fire and explosion related to electrostatic discharge is that it is difficult to reproduce the electrostatic charge and discharge phenomenon in addition to the large human and material damage. Therefore, in order to prevent accidents and disasters related to electrostatic in fire and explosion hazard areas, it is important to manage the level of electrostatic in a safe manner from the perspective of system between industrial facilities and human bodies. Rule 325 of the Occupational Safety and Health Regulations, "Prevention of Fire / Explosion due to Electrostatic", requires the use of grounding, conductive materials, humidification and electrification in order to prevent the risk of disaster caused by static explosion and electrostatic in the production process. In order to comply with these measures, related technologies, standards and systems are needed from the viewpoint of preventive measures related to electrostatic in fire and explosion hazard areas, but in Korea, it is still insufficient. Therefore, technical, institutional and managerial measures are needed as a precautionary measure to improve the level of ESD safety in fire and explosion hazard areas and prevent electrostatic related injury. In Korea, we analyzed the current status and characteristics of electrostatic related disaster by using the statistics of industrial accident and fire statistics of the Ministry of Employment and Labor. We also analyzed the current status and characteristics of electrostatic related disasters in Japan using JNIOSH accidents and disasters investigation cases and JNIOSH fire accident data of Japan Fire Bureau. The purpose of this study is to compare and analyze the current status of electrostatic related accidents and disasters in Korea and Japan in order to improve the safety management of electrostatic in fire and explosion hazard areas. In order to prevent accidents and disasters in the industrial field, The technical, institutional, and managerial measures to manage the level of electrostatic in a safe state were derived from the system point of view.

• 전자공학회논문지D
• /
• 제35D권9호
• /
• pp.48-53
• /
• 1998

실리콘 벌크 마이크로머시닝과 표면 마이크로머시닝기술을 혼합하여 새로운 구조의 정전렌즈를 제작하였다. 표면 마이크로머시닝을 위한 구조층과 희생층으로는 폴리실리콘을 사용하였으며 구조층을 열산화막으로 보호하여 실리콘 습식 식각시 손상되지 않도록 하였다. 이전의 마이크로컬럼에 사용되던 정전렌즈에 비하여 이 구조가 갖는 장점은 1) 양극 접합의 수를 줄일 수 있어 구멍간 정렬, 렌즈의 생산성, 신뢰도, 손상 면에서 우수하고, 2) 마이크로컬럼의 집적화를 통한 arrayed lithography에도 유리하다는 것이다.

• 한국안전학회지
• /
• 제21권4호
• /
• pp.60-65
• /
• 2006

It is a well known fact that LCD is a central part of the IT industry which is important in the present and the future. But the biggest problem of LCD manufacturing is maintaining a cleaning room environment and administration. Therefore the purpose of this study is to first, prevent the yield depreciation and damage of products, and second, protect the worker ftom accidental electrostatic discharge during LCD manufacture. The soft x-ray ionizer is a type of electrostatic reducer device. It protects against electrostatic discharge in the cleaning room environment and is a necessary environmental factor during LCD production. The positive aspects of the soft x-ray are its shorter time and wider angle of exposure. But the negative aspect of the soft x-ray is its need for several shielding of protection from the harmful x-ray exposure. On this study, the development of the Air Nozzle-type ionizer to amend and refine some problems. For example, examined the electrostatic reduce device of a soft x-ray type and discovered the ion did not go inside well. also workers to be free from danger. An Air Nozzle-type ionizer is comprised of soft x-ray radiation and ionized air production. Air is injected through the nozzle after being ionized from radiation. It supplies air keeping the same pressure into the end foundation of ion production. The soft x-ray is the structure which radiates ionized air through the nozzle (21 holes) having micro holes of the ionizable radiation after ionizing the inside air by the ion production. A worker does not need a cover to protect against x-rays and the Air Nozzle-type ionizer is easy to set up and is more effective at eliminating electrostatic.