• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.57-57
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• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.89-93
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• 2018

Ceramic substrates applied to power modules of electric vehicles are required to have properties of high thermal conductivity, high electrical insulation, low thermal expansion coefficient and resistance to abrupt temperature change due to high power applied by driving power. Aluminum nitride and silicon nitride, which are applied to heat dissipation, are considered as materials meeting their needs. Therefore, in this paper, the properties of aluminum nitride and silicon nitride as radiator plate materials were compared through a commercial analysis program. As a result, when the process of applying heat of the same condition to aluminum nitride was implemented by simulation, the silicon nitride exhibited superior impact resistance and stress resistance due to less stress and warping. In terms of thermal conductivity, aluminum nitride has superior properties as a heat dissipation material, but silicon nitride is more dominant in terms of reliability.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.2
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• pp.89-95
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• 2017

Although the global coffee market is growing every year and the demand for coffee wrapping paper is increasing accordingly, research on the effect of PE material and PP material on the coffee aroma used in the sealant layer, which will directly contact the product, is lacking. In this study, we studied the change of aroma patterns and flavor materials by adding coffee to PP and PE pouches. In addition, we observed changes in aroma patterns depending on the temperature and the presence of the deoxidizer. As a result, it was found that the PP type packaging material was slightly better than the PE type packaging material, but the performance was hardly changed by the material. Rather, the change in the aroma pattern due to temperature was dominant rather than the material. It is ideal that refrigerated distribution ($4^{\circ}C$) is the best storage temperature and sales are done within a short period of time. Among the indicators, pyridine was the most suitable material to study and there are many data about pyridine. Therefore, it is expected that the results can be derived by using pyridine.

• Corrosion Science and Technology
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• v.20 no.5
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• pp.289-294
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• 2021

In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H₂SO₄ and 1 wt% HCl electrolytes at 25 ℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (E_CORR) values in sulfuric acid solution, ACA wire had more than six times higher E_CORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the E_CORR value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.9-17
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• 2015

After its inception in 1994, the Journal of the Microelectronics and Packaging Society has continued to make significant strides in the number and quality of publications within its field. The interest in the microelectronics and packaging research has become more critical as consumer electronic products continue its increasing trend towards thinner and lighter devices that tests the boundaries of electronic devices. This study utilizes social network analysis of all published literature in the Journal for the past 22 years. Using the keywords and abstracts available within each individual article, the publications within the Journal has focused on major topics covering (1) flip chip, (2) reliability, (3) Cu, (4) IMC (intermetallic compounds), and (5) thin film. Using the social network relationship between keywords within articles, flip chip was closely associated with reliability, BGA (ball grid array), contact resistance, electromigration in many of the published research works within the Journal. From the centrality analysis, it was found that flip chip, reliability, Cu, thin film, IMC, and RF (radio frequency) to have a high degree of centrality suggesting these key areas of research have relatively high connectivity with other research topics within the Journal and is central to many of the research fields within the micro-electronics and packaging area. The cohesiveness analysis showed research clustering of five major cohesive sub-groups and was mapped to better understand the major area of research within this field. Research within the field of micro-electronics and packaging converges many disciplines of science and engineering. The continued evolution within this field requires an understanding of the rapidly changing industry environment and the consumer needs.

• Korean Journal of Food Science and Technology
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• v.33 no.6
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• pp.728-736
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• 2001

Effects of packaging material and oxygen absorbant on physical and chemical properties of Yukwu were studied during storage to develop packaging conditions. The packaging materials used were PET/EVOH $(16\;{\mu}m)/PL$ : P1 and PET/EVOH $(24\;{\mu}m)/PL$ : P2 with or without oxygen absorbent (E1A : P1 and E2A : P2 for w/ $O_2$, absorbent, E1EA : P1 and E2EA : P2 for w/o $O_2$, absorbent). Color values for Yukwu indicated that L values of E1A, E1EA, E2A and E2EA were decreased during storage while those b values were increased. Hardness and chewiness of Yukwa were generally decreased, however those of E1A and E1EA were rather increased after 6 weeks of storage. Acid value of E2A had maintained less than 2.0 during 12 weeks of storage. E1A, E2A had the below of 20 in peroxide during 12 weeks. Aroma data by using electronic nose showed that there was no difference after 6 week storage time in different packaging materials. Sensory evaluation (Yukwa odor and rancid odor) showed very similar results with electronic nose one. E2A had the highest value of overall acceptability for sensory evaluation. Hardness and cheweness in physical measurement results had the highest correlation with hardness, crispness, overall-acceptability in sensory evaluation results.