• Journal of Korean Society of Disaster and Security
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• v.5 no.1
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• pp.21-28
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• 2012

This study can be solved a means of authentication of electronic financial transactions. We suggest that smart devices can be useful to authenticate in electronic financial transactions regardless of time and place. Our new authentication method named Lock-Unlock authentication method with smart devices. This method will be expected to reduce many kind of accidents (theft, phishing, hacking, certificates and simple certified OTP, ATM withdrawals, ARS, etc.) by account locking in electronic financial transactions. And helpful to users can effectively protect electronic financial transactions and minimize the accident during get a electronic trading.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.9
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• pp.33-40
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• 2008

As the speed of memory is improved vey fast the advanced test equipments are needed to test the ultra-high speed memory devices efficiently. It is necessary to develop the Algorithmic Pattern Generator (ALPG) that tests fast memory devices effectively using the instructions that testers want to use. In this paper, we propose a new parallel ALPG for the ultra-high speed memory testing. The proposed ALPG can generate patterns for fast memory devices at high speed using manual instructions by the Instruction Analyzer.

• Ceramist
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• v.22 no.4
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• pp.332-349
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• 2019

Ceramic thin films are key materials for fundamental electronic devices such as transistors and capacitors which are highly important for the state-of-the-art electronic products. Their characteristic dielectric properties enable accurate control of current conduction through channel of transistors and stored charges in capacitor electrodes. The electronic conduction in ceramic thin films is one of the most important part to understand the electrical properties of electronic device based on ceramic thin films. There have been numerous papers dealing with the electronic conduction mechanisms in emerging ceramic thin films for future electronic devices, but these studies have been rarely reviewed. Another interesting electrical characterization technique is one based on electrical pulses and following transient responses, which can be used to examine physical and chemical changes in ceramic thin films. In this review, studies on various conduction mechanisms through ceramic thin films and electrical characterization based on electric pulses are comprehensively reviewed.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.466-469
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• 2013

Currently, piezoelectric ceramics are being applied in various fields, such as ultrasonic sensors, vibration devices, sound filters, and various energy conversion devices. Flexible piezoelectric ceramics are widely studied in an effort to mitigate the disadvantages of their brittle and inductile properties. Structural damage to piezoelectric fibers is much less than that to thin films when piezoelectric fibers are twisted or bent. Therefore, stretchable devices can be fabricated if piezoelectric fibers are obtained using an elongated substrate. In this study, sintering processes of PZT ($Pb(Zr_{0.53}Ti_{0.47})O_3$) fibers prepared by electrospinning were optimized through the TGA and XRD analyses. The crystal structure and microstructure of the piezoelectric fibers were investigated by XRD, FE-SEM and TEM.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.9
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• pp.531-538
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• 2005

This paper proposes an expert system which is able to enhance the accuracy and productivity by determining the test strategy based on heuristic rules for test of the hybrid electronic circuit board producted massively in production line. The test heuristic rules are obtained from test system designer, test experts and experimental results. The guarding method separating the tested device with circumference circuit of the device is adopted to enhance the accuracy of measurements in the test of analog devices. This guarding method can reduce the error occurring due to the voltage drop in both the signal input line and the measuring line by utilizing heuristic rules considering the device impedance and the parallel impedance. Also, PSA(Parallel Signature Analysis) technique Is applied for test of the digital devices and circuits. In the PSA technique, the real-time test of the high integrated device is possible by minimizing the test time forcing n bit output stream from the tested device to LFSR continuously. It is implemented in Visual C++ computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. Finally, the effectiveness of the builded expert system is proved by simulating the several faults occurring in the mounting process the electronic devices to the surface of PCB for a typical hybrid electronic board and by identifying the results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.4
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• pp.391-396
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• 2023

Recently, as power and electronic devices have increased in frequency and capacity, it has become a major concern to protect electronic circuits and electronic components used in these devices from abnormal voltages such as various surges and pulse noise. To respond to variously rated voltages applied to power electronic devices, the rated voltages of various varistors can be obtained by controlling the size of internal particles of the varistor or controlling the number of layers of the varistor. During bonding, the problem of unbalanced thermal runaway occurring between the electrode and the varistor interface causes degradation of the varistor and shortens its life of the varistor. In this study, to solve the problem of unbalanced heat distribution of stacked varistors to adjust the operating voltage, the contents of the ZnO-based varistor composition were 96 wt% ZnO, 1 mol% Sb₂O₃, 1 mol% Bi₂O₃, 0.5 mol% CoO, 0.5 mol% MnO, and 1 mol% TiO₂. A multi-layered ZnO varistor was modeled by bonding a single varistor with a composition in three layers according to the operating voltage. The thermal distribution of the triple-layered ZnO varistor was analyzed for the thermal runaway phenomenon that occurred during varistor operation using the finite element method according to Comsol 5.2.

• Journal of Korea Society of Digital Industry and Information Management
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• v.11 no.3
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• pp.11-19
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• 2015

Due to recent development in mobile devices, the mobile device utilization and many related applications have been increasing. Most of initial applications on mobile devices just showed simple information, but now they processes huge data. However, smart devices have certain limitations in processing massive data. Especially, if the size of data increases, the speed of data processing adversely decreases, so the performance of programs also decreases. If hardware specification of the mobile devices is not enough to handle it, response time will be drastically delayed. To overcome these drawbacks, most of application running on mobile devices communicate with their servers to manage data. XML is a proper language for data communication to send and receive data between servers and mobile devices, because it defines rules of document's format and it is a textual data format and small-sized language. However, mobile devices have limitation such as memory, CPU and wireless network to process huge data and XML also takes a lot of time to communicate with servers and devices and handle data, so it could be overhead in service time. Binary XML is an alternative of performance improvement in data processing, which has XML's benefits and minimizes the XML size by binary coding. However, most of binaryXML which are used on applications don't fit on mobile applications. In this paper, we surveyed many kinds of binaryXML, compared merits and demerits to find a binaryXML for mobile applications. We propose how to use binary XML and implemented an electronic attendance system using binary XML to overcome the limitation of XML and to reduce the load of data communications between servers and devices.

• International Journal of Internet, Broadcasting and Communication
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• v.4 no.1
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• pp.1-2
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• 2012

A speaker is a system which produces sound through electromechanical operations. It transforms electronic signals into audible sound signals. Almost all speakers are three dimensional. These days, many mobile electronic devices such as mobile electronic devices have become smaller and thinner. A problem with this miniaturization, however, is that the volume of speakers has also decreased. In contrast to conventional three dimensional speakers, we have invented a new type of two dimensional flexible speaker by utilizing the reverse piezoelectric effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.399-402
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• 2007

The effects of heat treatment on the electrical properties of strained-Si/SiGe-on-insulator (SGOI) devices were examined. We proposed the optimized heat treatment processes for improving the back interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA (rapid thermal annealing) before gate oxidation step and the post-RTA after source/drain dopant activation step, the electrical properties of strained-Si channel on $Si_{1-x}Ge_x$ layer were greatly improved, which resulting the improvement of the driving current, transconductance, and leakage current of SGOI-MOSFET.

• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.