• 제목/요약/키워드: Electronic device cooling

검색결과 77건 처리시간 0.025초

액상법에 의한 Carbon Nanofiber 제조 및 특성 분석 (Preparation and Characterization of Carbon Nanofiber from Liquid Phase Carbon Source)

  • 이원우;신채호;박한성;최영민;류병환
    • 한국재료학회지
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    • 제18권10호
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    • pp.564-570
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    • 2008
  • Nanostructured carbon materials have been found to have applications in fuel cell electrodes, field emitters, electronic devices, sensors and electromagnetic absorbers, etc. Especially, the CNF (carbon nanofiber) can be expected to play an important role in catalyst supporters for fuel cell electrodes and chemical reactions. In this study, we synthesized CNF from a liquid phase carbon source by a solvothermal method. In addition, we studied the parameters for the preparation of CNF by controlling heating and cooling rates, synthesis temperature and time. We characterized the CNF by SEM/TEM, XRD, Raman spectroscopy and EDS. We found that the heating and cooling rate have strong effects on the CNF formation and growth. We were able to prepare the best CNF at the heating rate of $10^{\circ}$/min, at $450^{\circ}$ for 60 minutes, and at the cooling rate of $4^{\circ}$/min. As a result of Raman spectra, we found that the sample showed two characteristic Raman bands at ${\sim}1350cm^{-1}$ (D band) and ${\sim}1600cm^{-1}$ (G band). The G band indicates the original graphite feature, but the D band has been explained as a disorder feature of the carbon structure. The diameter and length of the CNF was about $15{\sim}20nm$, and over $1{\mu}$, respectively.

열펌프의 성능 최적화에 관한 연구 (Optimization of Heat Pump Systems)

  • 최종민;윤린;김용찬
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2007년도 추계학술대회 논문집
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    • pp.538-541
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    • 2007
  • An expansion device plays an important role in optimizing the heat pumps by controlling refrigerant flow and balancing the system pressures. Conventional expansion devices are being gradually replaced with electronic expansion valves due to increasing focus on comfort, energy conservation, and application of a variable speed compressor. In addition, the amount of refrigerant charge in a heat pump is another primary parameter influencing system performance. In this study, the flow characteristics of the expansion devices are analyzed, and the effects of refrigerant charge amount on the performance of the heat pump are investigated at various operating conditions. Cooling capacity of the heat pump system is strongly dependent on load conditions. The heat pump system is very sensitive with a variation of refrigerant charge amount. But, the performance of it can be optimized by adjusting the flow rate through expansion device to maintain a constant superheat at all test conditions.

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3kW급 옥외형 태양광 인버터의 효율개선을 위한 냉각시스템 연구 (A Study on Cooling System for Efficiency Improvements of 3kW Outdoor Type Photovoltaic Inverter)

  • 김민석;박의종;김용재;오보석
    • 한국전자통신학회논문지
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    • 제9권5호
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    • pp.617-624
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    • 2014
  • 최근 태양광 발전 산업에서 가격매입제도가 도입되면서 주목받고 있는 태양광 인버터는 대부분 개방형 통풍구조로 인해 기후변화에 유연하게 대응하지 못하고 설치환경에 따라 이상동작이 발생하여 효율 및 수명이 감소하는 문제점이 발생한다. 이러한 문제점을 해결하고자 외부환경에 영향을 받지 않도록 밀폐형 구조를 사용하고 계절별 온도에 따른 변화에 쉽게 대응하도록 새로운 냉각시스템을 부착한 친환경 태양광 인버터를 개발하고자 한다. 또한 냉각시스템의 소비전력을 최소화 하기위해 인버터 내부에 부착한 냉각시스템의 최적 구간을 도출하고 사용 냉각장치의 개수를 결정하여 인버터 효율을 향상시키고자한다.

고주파 유전가열형 온열암치료기의 개발과 가온특성 (DEVELOPMENT and THERMAL DISTRIBUTION of an RF CAPACITIVE HYPERTHERMIA SYSTEM)

  • 박민용;이상배;박덕규;추성실;정미향
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(II)
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    • pp.1309-1312
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    • 1987
  • Hyperthermia for the treatment of cancer has been introduced for a long time and the biological effect for the use of hyperthermia to malignant tumors has been well established and encouraging clinical results has been observed. Unfortunately, the engineering or technical aspects of hyperthermia for the deep seated tumors has not been satisfactory. We have researched and developed the radiofrequency capacitive hyperthermia system (GHT- RF8). It was composed with 8-9 MHZ RF generator, capacitive electrode, matching system, cooling system, temperature measuring system and control computer. The thermal profile was investigated in agar phantom, animals and in human tumors, which was heated with capacitive RF device.

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일체형 주상용 몰드변압기의 덕트에 따른 열해석 특성 연구 (The Thermal Analysis of Pole Mount Mold Transformer with One-body Molding by Duct Condition)

  • 조한구;이운용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.1135-1138
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    • 2003
  • The transformer is major equipment in power receiving and substation facilities. Necessary conditions required for the transformer are compactness, lightness, high reliability, economic advantages, and easy maintenance. The pole-mount transformer installed in distribution system is acting direct role in supply of electric power and it is electric power device should drive for long term. Most of modem transformer are oil-filled transformer and accident is happening considerable. The mold transformers have been widely used in underground substations in large building and have some advantages in comparison to oil-transformer, that is low fire risk, excellent environmental compatibility, compact size and high reliability. In addition, the application of mold transformer for outdoor is possible due to development of epoxy resin. The mold transformer generally has cooling duct between low voltage coil and high voltage coil. A mold transformer made by one body molding method has been developed for small size and low loss. One body molding transformer needs some cooling method because heat radiation between each winding is difficult. In this paper, The thermal analysis of pole mount mold transformer with one body molding by duct condition is investigated and the test result of temperature rise is compared with simulation data.

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고발열 통신용 전자부품 냉각을 위한 고성능 수냉식 냉각판 개발에 관한 연구 (A Study on Development of Liquid Cooled Plate for Cooling of a Communication Electronic Device with High Heat Generation)

  • 장걸;박철민;김은필
    • 동력기계공학회지
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    • 제11권2호
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    • pp.26-31
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    • 2007
  • 통신용 전자기기에서 대부분의 열은 증폭기에서 발생한다. 일반적으로 증폭기를 냉각하기 위하여 공랭식을 사용하여 발생하는 많은 열을 냉각하였다. 그러나 전통적인 방법은 고성능 콤팩트화 되어가는 추세에서 발열되는 열을 충분히 냉각하기는 부족하다. 본 논문은 고발열 전자부품 냉각을 위해서 수냉식 방법을 사용하였다. 열전달 효율을 높이기 위하여 냉각판에 직접 냉각수를 흐르게하여 접촉저항을 줄였다. 그리고 냉각판의 유로에 대한 배열과 유량의 비의 효과를 조사하였다. 연구를 수행한 결과, 다음과 같은 결론을 얻을 수 있었다. 냉각수 순환량이 $3{\iota}/min$인 경우, 유로 직경이 8 mm일 때의 냉각 성능이 10 mm일 때보다 우수한 것으로 나타났다. 냉각수 순환량이 $3{\iota}/min$인 경우, 유로 직경이 8 mm일 때의 발열 소자 표면 온도 분포가 더욱 안정적으로 나타났으며, 상하부에 설치된 발열 소자 표면 온도가 더 낮게 나타났다. 동일한 유로 직경의 냉각판에서, 열유속 증가에 따른 냉각수의 전열 성능 증가로 인해 전체 발열량의 증가율보다 발열 소자의 온도 증가율이 낮게 나타났다.

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세라믹 패키지를 이용한 표면 실장형 다이오드의 제작과 특성 평가 (Manufacture and Characteristic of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package)

  • 전명표;조상혁;조정호;김영익;유인기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.221-221
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    • 2006
  • The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

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Electrocaloric Effect in Pb0.865La0.09(Zr0.65Ti0.35)O3 Thin Film

  • Roh, Im-Jun;Kwon, Beomjin;Moon, Hi Gyu;Kim, Jin-Sang;Kang, Chong-Yun
    • 센서학회지
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    • 제23권4호
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    • pp.224-228
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    • 2014
  • The electrocaloric effect of 9/65/35 PLZT thin film fabricated by the sol-gel method, which has not been studied yet, was investigated for its structural, electrical properties as well as temperature change property. The relaxor ferroelectric property of 9/65/35 PLZT thin film was confirmed by examining its dielectric and electrical properties. The relaxor property can cause a more pronounced electrocaloric effect (ECE) in a wider temperature range than normal ferroelectric film. To avoid errors caused by using an indirect measurement method, the leakage current generated by increasing temperatures was minimized by using the optimal maximum electric field ($350kVcm^{-1}$) in the thin film. The largest temperature change ${\delta}T$ (0.23 K) and the electrocaloric strength ${\xi}$ (0.68 mkcm/kV), calculated by equations were obtained. The maximum field change ${\delta}E$ ($191kVcm^{-1}$) was in the vicinity of the curie temperature ($200^{\circ}C$).

EBSD를 이용한 1, 2차 용융흔 결정립의 방위 비교 분석 (The Orientation Comparison of the Primary and Secondary Beads Grain by EBSD)

  • 박광묵;방선배;양성채
    • 한국전기전자재료학회논문지
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    • 제30권11호
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    • pp.728-733
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    • 2017
  • Herein, for the quantitative analysis of the arc beads related to electric fire, we used electron backscatter diffraction (EBSD), a measuring device for grain orientation of materials, we compared and analyzed the surface texture of primary and secondary beads according to the difference in cooling rate at ambient temperature. This analysis revealed that the primary beads showed similar distribution at both low and high angles, while the secondary beads showed a higher distribution at low angles than at high angles. Thus, EBSD can be used for quantitative analysis of the beads and can be applied to identify beads in the future.

Effect of the size of active device and heatsink of power MOSFETs on its the junction to ambient transient thermal behavior

  • Koh, Jeong-Wook;An, Chul
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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    • pp.241-244
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    • 2000
  • To investigate the compact effect of the different area of an active layer and the different type of heatsink on the junction to ambient transient thermal impedance, we have characterized the thermal behavior of power MOSFETs that have three different areas of an active layer and two types of heatsink. To do so, the "cooling curve method" has been used in order to measure the junction-to-ambient transient thermal impedance Zthja that represents the thermal behavior of the devices. The measured data depiets that the larger area of an active layer gives the better-in other words. smaller-thermal impedance, and that the larger size of a heatsink improves the thermal impedance.

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