• ETRI Journal
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• v.33 no.4
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• pp.645-647
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• 2011

In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1063-1066
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• 2002

An equivalent circuit for the superconductor flux flow transistor(SFFT) was combined with high temperature cooling device, based on the analogy between thermal and electrical variables using the high-temperature superconductor(HTS), is proposed. The device is composed of parallel weak links with a nearby magnetic control line. A model has been developed that is based on solving the equation of motion of Abrikosov vortices subject to Lorentz viscous and pinning forces as well as magnetic surface barriers. The use of thermal models the global performance of thermal cooling circuit and signal system to be checked by using electrical circuit analysis programs such as SPICE.

• Transactions on Electrical and Electronic Materials
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• v.6 no.2
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• pp.39-45
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• 2005

Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.

• Journal of Power System Engineering
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• v.21 no.6
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• pp.79-85
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• 2017

A heat pump system is a highly efficient, eco-friendly device which consumes a small amount of energy and supply a lot of energy for heat formation. In addition, it is a single device system that has low generation effect about carbon dioxide. There are many researches related to the electronic expansion valve and the heat pump, but the detailed data analysis of each influence is insufficient. In this study, the cooling capacity and COP of the heat pump system were investigated by varying frequency of the inverter connected to compressor, inlet temperature of chilled water into evaporator and inlet temperature of cooling water into condenser. The results are as follows : (1) The cooling capacity increased as the inverter frequency, inlet temperature of chilled water into evaporator increased, and inlet temperature of cooling water into condenser decreased. (2) The COP increased as the frequency of inverter, inlet temperature of cooling water into condenser decreased and the inlet temperature of chilled water into evaporator increased.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.7
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• pp.799-804
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• 2014

To combine to the power transmission, photovoltaic inverter is demanded, because the photovoltaic system is generated direct current power. However, photovoltaic inverter is sensitive to high temperature. In the temperature rising such as at noon and on summer, efficiency of machine is decreased due to the loss increment. Because this problem causes national energy loss according to the expanding the photovoltaic industry, countermeasure is demanded. There, in this paper, we installed a cooling system using a thermoelement regardless of the temperature. Also, we analyze the cooling effect according to the position of two fans which improve the effect maximize.

• Journal of the Korea Safety Management & Science
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• v.15 no.2
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.7 no.2
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• pp.266-275
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• 1995

A numerical investigation on the conduction-natural convection-surface radiation conjugate heat transfer in the enclosure having substrate and chips has been performed. A 2-dimensional simulation model is developed by considering heat transfer by conduction, convection and radiation. The solutions to the equation of radiative transfer are obtained by the discrete ordinates method using S-4 quadrature. The effects of Rayleigh number and the substrate-fluid thermal conductivity ratio on the cooling of chip are analyzed. The result shows that radiation is the dominant heat transfer mode in the enclosure.